公开(公告)号：EP3211019A4

公开(公告)日：2018-05-16

申请号：EP15851854

申请日：2015-09-30

申请人： TORAY INDUSTRIES

发明人： MATSUDA AYUMI ,  MIYOSHI MASAYUKI ,  HIRANO NORIYUKI

IPC分类号： C08G59/32 ,  C08G59/50 ,  C08J5/04

CPC分类号： C08J5/042 ,  C08G59/245 ,  C08G59/3227 ,  C08G59/38 ,  C08G59/5026 ,  C08G59/5033 ,  C08G59/504 ,  C08J5/04 ,  C08J5/24 ,  C08J2363/00 ,  C08J2363/02

摘要： An epoxy resin composition suitable for use in the fiber reinforced composite material simultaneously exhibiting a high level of tensile strength and a heat resistance is provided. A fiber reinforced composite material produced by using such epoxy resin composition is also provided. An epoxy resin composition comprising at least the following component [A], component [B], and component [C] or [D] wherein cured product obtained by curing the epoxy resin composition has a rubbery state modulus in dynamic viscoelasticity evaluation of 10 MPa or less, and the cured product has a glass transition temperature of at least 95°C; [A] an aromatic epoxy resin having a functionality of at least 3, [B] an aromatic diamine having a substituent at ortho position of each amino group or a cycloalkyldiamine wherein the carbon atom adjacent to the carbon atom bonded to each amino group has a substituent, [C] an aliphatic polyamine having an alkylene glycol structure, [D] a straight chain or branched aliphatic polyamine containing 6 to 12 carbon atoms.

公开(公告)号：EP3272781A1

公开(公告)日：2018-01-24

申请号：EP16765004.3

申请日：2016-03-16

申请人： Toray Industries, Inc.

发明人： AOKI, Junichi ,  ARAI, Atsuhito ,  SAKATA, Hiroaki ,  OCHI, Takashi

IPC分类号： C08G59/20 ,  C08J5/24

CPC分类号： C08G59/245 ,  C08G59/20 ,  C08G59/3227 ,  C08G59/38 ,  C08G59/5033 ,  C08G73/026 ,  C08G73/1071 ,  C08G75/23 ,  C08J5/24 ,  C08K3/046 ,  C08L63/00 ,  C08L2205/035 ,  C08L81/06 ,  C08L79/08

摘要： Provided is an epoxy resin composition for giving a carbon fiber-reinforced composite material that simultaneously achieves tensile strength and compressive strength. An epoxy resin composition containing at least the following constituent elements [A]-[D] wherein the epoxy resin composition contains 5-50 mass% of constituent element [A] and 20-95 mass% of constituent element [B] relative to 100 mass% of total epoxy resin weight. [A]: at least one epoxy resin selected from the group comprising 1,2-bis(glycidyloxy)benzene, 1,3-bis(glycidyloxy)benzene, 1,4-bis(glycidyloxy)benzene, derivatives of these, and epoxy resins having a structure represented by general formula [1] (in general formula [1], at least one of R 1 -R 5 and at least one of R 6 -R 10 is a glycidyl ether group, and the other R 1 -R 10 represent any of a hydrogen atom, halogen atom, or aliphatic hydrocarbon group having four or fewer carbon atoms.); [B]: glycidylamine epoxy resin having three or more glycidyl groups per molecule; [C]: thermoplastic resin soluble in epoxy resin; [D]: epoxy resin curing agent

摘要翻译： 本发明提供一种用于得到同时实现拉伸强度和压缩强度的碳纤维增强复合材料的环氧树脂组合物。 一种环氧树脂组合物，其特征在于，所述环氧树脂组合物含有至少以下构成元素[A]〜[D]，相对于100重量份，构成元素[A]为5〜50质量％，构成元素为[B] 质量％的环氧树脂总重量。 [A]：至少一种选自1,2-双（缩水甘油基氧基）苯，1,3-双（缩水甘油基氧基）苯，1,4-双（缩水甘油基氧基）苯，它们的衍生物和环氧树脂 具有通式[1]表示的结构的树脂（通式[1]中，R 1 -R 5中的至少一个和R 6 -R 10中的至少一个为缩水甘油醚基团，并且其他R 1 -R 10表示任何 氢原子，卤素原子或具有四个或更少碳原子的脂族烃基）。 [B]：每分子具有三个或更多个缩水甘油基的缩水甘油胺环氧树脂; [C]：可溶于环氧树脂的热塑性树脂; [D]：环氧树脂固化剂

公开(公告)号：EP2896654B1

公开(公告)日：2017-07-12

申请号：EP12884738.1

申请日：2012-09-14

申请人： Shengyi Technology Co. Ltd.

发明人： ZENG, Xianping ,  REN, Nana

IPC分类号： C08L63/00 ,  C08G59/40 ,  C08G59/42 ,  C08G59/32 ,  B32B15/092 ,  B32B27/04

CPC分类号： C08K5/5313 ,  B32B5/26 ,  B32B15/092 ,  B32B15/14 ,  B32B15/20 ,  B32B27/20 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2307/204 ,  B32B2307/306 ,  B32B2307/704 ,  B32B2307/7265 ,  B32B2363/00 ,  B32B2457/08 ,  C08G59/28 ,  C08G59/3227 ,  C08G59/42 ,  C08G59/4246 ,  C08J5/24 ,  C08J2363/00 ,  C08K5/53 ,  C08K5/5317 ,  H01B3/40 ,  Y10T442/2213 ,  Y10T442/3423 ,  Y10T442/656 ,  C08L63/00

公开(公告)号：EP3064521A1

公开(公告)日：2016-09-07

申请号：EP14878027.3

申请日：2014-11-28

申请人： SHIN-ETSU CHEMICAL CO., LTD

发明人： SUMITA Kazuaki ,  UEHARA Tatsuya ,  KUSHIHARA Naoyuki

IPC分类号： C08G59/42 ,  C08K9/06 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31

CPC分类号： H01L21/561 ,  C08G59/245 ,  C08G59/3218 ,  C08G59/3227 ,  C08G59/3281 ,  C08G59/42 ,  C08G59/686 ,  C08K3/36 ,  C08K5/09 ,  C08K9/06 ,  C08K2201/003 ,  C08L63/00 ,  C09D7/62 ,  C09D7/63 ,  C09D163/00 ,  H01L21/78 ,  H01L23/296 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention relates to a liquid epoxy resin composition for semiconductor sealing, which contains: (A) a liquid epoxy resin that does not contain a siloxane bond in each molecule; (B) an acid anhydride-based curing agent; (C) a surface-treated spherical inorganic filler which is a spherical inorganic filler having an average particle diameter of 0.1-10 µm as determined by a laser diffraction method and serving as an inorganic filler, and wherein the surface of the spherical inorganic filler is surface-treated with 0.5-2.0 parts by weight of a (meth)acrylic functional silane coupling agent per 100 parts by weight of the spherical inorganic filler of the component (C); and (D) a curing accelerator. The present invention is able to provide a semiconductor device which has excellent heat resistance and moisture resistance.

公开(公告)号：EP2637860A4

公开(公告)日：2014-09-17

申请号：EP11839752

申请日：2011-11-07

申请人： TORAY INDUSTRIES

发明人： ARAI NOBUYUKI ,  HARO ALFRED P ,  HUGHES JONATHAN C ,  NATSUME NORIMITSU

IPC分类号： B32B7/00

CPC分类号： C08L63/04 ,  B32B37/003 ,  C08G59/28 ,  C08G59/3227 ,  C08G59/4021 ,  C08G59/504 ,  C08J5/24 ,  C08J2363/00 ,  C08L63/00 ,  Y10T442/20

摘要： An epoxy resin composition having components (A), (B), (C), and (D), wherein the epoxy resin composition has a viscosity at 40° C. of about 1×103 to about 1×104 Pa·s, a curing start temperature of about 90 to about 110° C., and a minimum viscosity at the curing start temperature of about 2 to about 20 Pa·s, wherein the components (A), (B), (C), and (D) are as follows: (A) About 60 weight parts or more of a tetraglycidyl amine type epoxy resin per 100 weight parts of the epoxy resin blend; (B) Dicyandiamide; (C) Diaminodiphenyl sulfone and (D) Urea compound.

摘要翻译： 具有组分（A），（B），（C）和（D））的环氧树脂组合物，其中环氧树脂组合物在40℃下的粘度为约1×10 3至约1×10 4 Pa·s， 固化开始温度为约90至约110℃，固化开始温度下的最小粘度为约2至约20Pa·s，其中组分（A），（B），（C）和（ D）如下：（A）每100重量份环氧树脂共混物约60重量份或更多的四缩水甘油胺型环氧树脂; （B）双氰胺; （C）二氨基二苯砜和（D）脲化合物。

公开(公告)号：EP2486077A1

公开(公告)日：2012-08-15

申请号：EP09740749.8

申请日：2009-10-07

申请人： Hexcel Composites, Ltd.

发明人： CAWSE, John, L. ,  MORTIMER, Stephen

IPC分类号： C08G59/32 ,  C08G59/40 ,  C08G73/10 ,  C08G75/23 ,  C08L63/00

CPC分类号： C08G59/3227 ,  C08G59/32 ,  C08G73/1046 ,  C08J3/28 ,  C08J5/24 ,  C08J2363/00 ,  C08J2371/12 ,  C08J2379/08 ,  C08J2381/06 ,  C08L61/00 ,  C08L63/00 ,  C08L79/04 ,  C08L79/08 ,  C08L81/06 ,  C08L2205/02 ,  C08L2205/22 ,  Y10T428/24149 ,  Y10T428/2852 ,  Y10T428/287 ,  C08L2666/20 ,  C08L2666/14 ,  C08L81/00

摘要： Thermosetting resins are provided that are toughened with an irradiated thermoplastic toughening agent. The resins have reduced levels of solvent-induced micro crack formation and do not lose their adhesiveness when attacked by solvent. The thermoplastic toughening agent is treated with a sufficient amount of high-energy radiation (e.g. electron beam or gamma rays) to cause reductions in solvent-induced micro crack formation and solvent-induced loss of adhesiveness when compared to the same toughened thermosetting resin in which a non- irradiated version of the thermoplastic toughening agent is used.

公开(公告)号：EP2484711A1

公开(公告)日：2012-08-08

申请号：EP10820716.8

申请日：2010-10-01

申请人： Mitsubishi Rayon Co., Ltd.

发明人： MIURA, Teppei ,  KANEKO, Manabu

IPC分类号： C08J5/04 ,  B29C70/06 ,  C08G59/50

CPC分类号： C08J5/24 ,  C08G59/3218 ,  C08G59/3227 ,  C08G59/504 ,  C08J2363/00 ,  C08L63/00 ,  Y10T442/2631 ,  C08L2666/22

摘要： A method for producing a fiber-reinforced composite material having high mechanical properties and high heat resistance, and allowing the use of a gypsum die in primary curing, wherein a fiber-reinforced prepreg, obtained by impregnating reinforcing fibers with an epoxy resin composition comprising a triphenylmethane-type epoxy resin, N,N,N',N'-tetraglycidyldiaminodiphenylmethane (B) and diaminodiphenylsulfone (C), is subjected to primary curing at 110-130°C, and then to secondary curing at a temperature which is at least as high as the primary curing temperature.

摘要翻译： 一种用于生产纤维增强复合材料具有高的机械性能和高耐热性，并允许使用在一次固化石膏的，worin纤维增强预浸料的方法，通过浸渍增强纤维与环氧树脂组合物，包括获得 三苯基甲烷型环氧树脂，N，N，N“N'-四缩水（B），和diaminodiphenylsulfones（C）在其至少一个温度下进行一次固化在110-130℃下，然后二次固化 一样高的一次固化温度。

公开(公告)号：EP2385078A1

公开(公告)日：2011-11-09

申请号：EP10183910.8

申请日：2005-04-20

申请人： Dendritic Nanotechnologies Inc.

发明人： Tomalia, Donald A. ,  Swanson, Douglas, R. ,  Huang, Baohua ,  Pulgam, Veera, Reddy

IPC分类号： C08J3/00 ,  C08J9/32 ,  C08J9/40 ,  C08K9/00 ,  C08G83/00

CPC分类号： C08G83/003 ,  C08G59/1477 ,  C08G59/32 ,  C08G59/3227 ,  C08G59/5026

摘要： Dendritic polymers with enhanced amplification and interior functionality are disclosed. These dendritic polymer are made by use of fast, reactive ring opening chemistry (or other fast reactions) combined with the use of branch cell reagants in a controlled way to rapidly and precisely build dendrimer structures, generation by generation, with precise structures with cleaner chemistry, typically single products, lower excesses of reagants, lower levels of dilution, higher capacity method, more easily scale to commercial dimensions, new ranges of materials, and lower cost. The dendrimer composition prepared have novel internal functionality, greater stability, e.g., thermal stability and less or no reverse Michaels reaction, and which reach encapsulation surface densities at lower generations. Unexpectedly, these reactions of poly-functional branch cell reagents with polyfunctional surfaces do not create gelled materials. Such dendritic polymers are useful as demulsifiers for oil/water emulsions, wet strength agents in the manufacture of paper, proton scavengers, calibration standards for electron microscopy, making size selective membranes, and agents for modifying viscosity in aqueous formulations such as paint. When these dendritic polymers have a carried material associated with their surface and/or interior, then these dendritic have additional properties due to the unique characteristics of the dendritic polymer.

摘要翻译： 公开了具有增强的扩增和内部功能的树枝状聚合物。 这些树枝状聚合物通过使用快速，反应性开环化学（或其他快速反应）结合使用分支细胞反应物以受控的方式制备，以快速和精确地构建树枝状聚合物结构，一代代，具有更清洁化学物质的精确结构 ，通常是单一产品，较低的试剂过剩，较低的稀释水平，较高的容量方法，更容易扩展到商业尺寸，新的材料范围以及更低的成本。 制备的树枝状聚合物组合物具有新颖的内部功能性，更高的稳定性，例如热稳定性和更少或没有反向迈克尔斯反应，并且在较低代次下达到包封表面密度。 出乎意料的是，多功能分支细胞试剂与多官能表面的这些反应不会产生胶凝材料。 这种树枝状聚合物可用作油/水乳液的破乳剂，纸张制造中的湿强剂，质子清除剂，用于电子显微镜的校准标准品，制备尺寸选择性膜以及用于改进水性配方如油漆中的粘度的试剂。 当这些树枝状聚合物具有与其表面和/或内部相关的载体材料时，由于树枝状聚合物的独特特征，这些树枝状结构具有额外的性质。

公开(公告)号：EP1896519A2

公开(公告)日：2008-03-12

申请号：EP06771235.6

申请日：2006-05-23

申请人： HEXCEL CORPORATION

发明人： MARTIN, Cary, J.

IPC分类号： C08G65/00 ,  C08G59/00

CPC分类号： C08G59/3227 ,  B32B5/28 ,  B32B15/02 ,  B32B15/08 ,  B32B15/14 ,  B32B27/04 ,  B32B27/08 ,  B32B27/38 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2274/00 ,  B32B2307/202 ,  B32B2307/558 ,  B32B2307/718 ,  B32B2605/18 ,  C08G59/4021 ,  C08L63/00 ,  C08L81/06 ,  C08L2205/02 ,  Y10T428/24994 ,  Y10T428/31511 ,  C08L81/00

摘要： Uncured thermosetting resins are loaded with relatively high amounts of solid thermoplastic resin particles to form a resin precursor. The resin precursor is heat treated so as to produce an uncured resin composition wherein the thermoplastic resin particles become substantially dissolved in the thermosetting resin without causing cure of the resin mixture. Heat treatment of highly loaded thermosetting resins in accordance with the present invention provides uncured resin compositions that are well suited for use in fabricating composite structures and particularly prepreg for use in lightning protection surface coatings.

公开(公告)号：EP1700875A3

公开(公告)日：2007-06-27

申请号：EP06075440.5

申请日：2006-02-28

申请人： Delphi Technologies, Inc.

发明人： Basheer, Rafil A. ,  Workman, Derek B. ,  Chaudhuri, Arun K. ,  Bouguettaya, Mohamed

IPC分类号： C08G59/50 ,  H01L23/31

CPC分类号： C08G59/5033 ,  C08G59/3227 ,  H01L21/563 ,  H01L23/293 ,  H01L23/49811 ,  H01L24/10 ,  H01L24/13 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/0106 ,  H01L2924/01063 ,  H01L2924/0107 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1579 ,  H01L2924/00 ,  H01L2224/0401

摘要： Disclosed is a curable composition having a low CTE. In one embodiment, a curable composition is disclosed that comprises (i) a binder comprising at least one epoxy compound of the structure:

         X-((CH 2 ) m -(N)-((CH 2 ) n -(Z)) 2 ) p

wherein X is an aromatic ring or a six membered cycloaliphatic ring, m is from about 0 to about 2, n is from about 1 to about 3, Z is an epoxy group of empirical formula: C 2 H 3 O, p is a number from about 2 to about 3, and (ii) a cross-linking agent comprising at least one polyamine. This curable composition is characterized by a CTE of no more than 60 ppm/°C when cured for a time of from about 20 to about 60 minutes at temperature of from about 100 to 240°C. Also disclosed are methods of making integrated circuits and integrated circuits made there from, especially flip chips.