HOUSING AND METHOD FOR FABRICATION THEREOF AND APPLICATION THEREOF

    公开(公告)号:EP3481165A1

    公开(公告)日:2019-05-08

    申请号:EP17819128.4

    申请日:2017-06-19

    Abstract: The present disclosure relates to the field of electronic communications, and discloses a housing, a preparation method therefor, and use thereof. The housing includes a metal oxide layer (5) and a resin film layer (3) adhering to a first surface of the metal anodic oxide layer (5). The metal anodic oxide layer (5) and the resin film layer (3) form an integrated structure. The preparation method includes: performing anode oxidization treatment on a substrate (1), and then successively performing injection molding and etching.

    METAL RESIN COMPLEX AND PREPARATION METHOD AND USE OF SAME

    公开(公告)号:EP3527346A1

    公开(公告)日:2019-08-21

    申请号:EP17860354.4

    申请日:2017-09-22

    Abstract: The present disclosure provides a metal resin composite. The metal resin composite includes a metal substrate. The upper surface of the metal substrate is provided with at least one upper surface slit, the lower surface of the metal substrate is provided with at least one lower surface groove in a position opposite to the upper surface slit, and the upper surface slit is communicated with the lower surface groove. A first injection molding resin is formed in the upper surface slit by injection molding, and a second injection molding resin is formed in the lower surface groove by injection molding. The present disclosure also provides a preparation method of the metal resin composite, a personal electronic device shell including the metal resin composite, a personal electronic device, and a metal resin composite processing component.

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