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公开(公告)号：EP2577716A1
公开(公告)日：2013-04-10
申请号：EP11787284.6
申请日：2011-05-24
发明人： FLEMING, Robert , GRAYDON, Bhret , VASQUEZ, Daniel , WU, Junjun , RAZAVI, Farhad
IPC分类号： H01L21/28
摘要： Ferroic circuit elements that include a set of conductive structures that are at least partially embedded within a ferroic medium are disclosed. The ferroic medium may be a voltage switched dielectric material that includes ferroic particles in accordance with various embodiments. A ferroic circuit element may be at least partially embedded within a substrate in accordance with embodiments of the current invention as an embedded ferroic circuit element. An embedded ferroic circuit element that is an inductor in accordance with embodiments of the current invention may be denoted as an embedded ferroic inductor. An embedded ferroic circuit element that is a capacitor in accordance with embodiments of the current invention may be denoted as an embedded ferroic capacitor.
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公开(公告)号：EP2412212A1
公开(公告)日：2012-02-01
申请号：EP10713274.8
申请日：2010-03-25
发明人： KOSOWSKY, Lex , FLEMING, Robert , GRAYDON, Bhret
CPC分类号： H05K1/0257 , H01C1/142 , H01C1/148 , H01C7/1006 , H05K1/0259 , H05K1/0373 , H05K1/167 , H05K2201/0738
摘要： Various aspects provide for structures and devices to protect against spurious electrical events (e.g., electrostatic discharge). Some embodiments incorporate a voltage switchable dielectric material (VSDM) bridging a gap between two conductive pads. Normally insulating, the VSDM may conduct current from one pad to the other during a spurious electrical event (e.g,. shunting current to ground). Some aspects include gaps having a gap width that is greater than 50% of a spacing between electrical leads connected to the pads. Some devices include single layers of VSDM. Some devices include multiple layers of VSDM. Various devices may be designed to increase a ratio of active volume (of VSDM) to inactive volume.
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公开(公告)号：EP2758992A2
公开(公告)日：2014-07-30
申请号：EP12834081.7
申请日：2012-09-21
IPC分类号： H01L27/04
CPC分类号： H01L27/0288 , H01L23/5252 , H01L23/60 , H01L2924/0002 , H05K1/0257 , H05K1/0259 , H05K1/16 , H05K2201/0738 , H01L2924/00
摘要： Embodiments disclosed herein generally relate to structures, methods and devices employing a voltage switchable dielectric material to achieve vertical and/or dual switching protection against ESD and other overvoltage events.
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4.发明公开
公开(公告)号：EP2540147A1
公开(公告)日：2013-01-02
申请号：EP11748214.1
申请日：2011-02-26
IPC分类号： H05K1/09
CPC分类号： H05K1/0254 , H05K1/0259 , H05K1/181 , H05K2201/0738 , H05K2203/304
摘要： Printed circuit boards including voltage switchable dielectric materials (VSDM) are disclosed. The VSDMs are used to protect electronic components, arranged on or embedded in printed circuit boards, against electric discharges, such as electrostatic discharges or electric overstresses. During an overvoltage event, a VSDM layer shunts excess currents to ground, thereby preventing electronic components from destruction or damage.
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5.发明公开SUBSTRATE DEVICE OR PACKAGE USING EMBEDDED LAYER OF VOLTAGE SWITCHABLE DIELECTRIC MATERIAL IN A VERTICAL SWITCHING CONFIGURATION 审中-公开衬底装置OR ENCAPSULATION具有嵌入的双电压的介电材料在垂直开关配置的层
公开(公告)号：EP2277364A1
公开(公告)日：2011-01-26
申请号：EP09732672.2
申请日：2009-04-13
发明人： KOSOWSKY, Lex , FLEMING, Robert , GRAYDON, Bhret
IPC分类号： H05K1/02
CPC分类号： H05K1/0257 , H05K1/0259 , H05K1/0373 , H05K2201/0738 , H05K2203/105
摘要： A substrate device includes an embedded layer of VSD material (230) that overlays a conductive element or layer (240) to provide a ground. An electrode (210), connected to circuit elements that are to be protected, extends into the thickness of the substrate to make contact with the VSD layer. When the circuit elements are operated under normal voltages, the VSD layer is dielectric and not connected to ground. When a transient electrical event occurs on the circuit elements, the VSD layer switches instantly to a conductive state, so that the first electrode is connected to ground.
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