摘要:
The present invention relates to a memory hierarchy for a system-in-package. The memory hierarchy is directly connectable to a processor (10) via a memory management unit arranged for translating a virtual address sent by said processor into a physical address. The memory hierarchy has a data cache memory and a memory structure having at least a L1 memory array comprising at least one cluster (21) having one or more banks of scratchpad memory. The memory structure comprises a first data access controller (31) arranged for managing one or more of said banks of scratchpad memory of at least one of said clusters of at least said L1 memory array, comprising a data port for receiving at least one physical address and arranged for checking, for each received physical address, if said physical address is present in said one or more banks of said at least one cluster of at least said L1 memory array and, if so, as a part of said managing, for forwarding a data request to one or more banks of scratchpad memory where said physical address is required, and if not, for forwarding said physical address to a cache controller (40) steering said data cache memory.
摘要:
The present invention relates to a memory hierarchy being directly connectable to a processor, said memory hierarchy having at least a Level 1, hereinafter termed L1, memory structure comprising a non-volatile memory unit as L1 data memory and a buffer structure (L1-VWB), said buffer structure comprising a plurality of interconnected wide registers with an asymmetric organization, wider towards said non-volatile memory unit than towards a data path connectable to said processor, said buffer structure and said non-volatile memory unit arranged for being directly connectable to said processor so that data words are selectable to be read or written by said processor.