公开(公告)号：EP1811556A4

公开(公告)日：2009-08-05

申请号：EP05788208

申请日：2005-09-29

申请人： TANAKA ELECTRONICS IND

发明人： MIKAMI MICHITAKA ,  ARIKAWA TAKATOSHI

IPC分类号： H01L21/60 ,  B23K35/30 ,  C22C5/02

CPC分类号： C22C5/02 ,  B23K35/3013 ,  H01L24/11 ,  H01L24/12 ,  H01L24/43 ,  H01L24/45 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/43 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48624 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00011 ,  H01L2924/01003 ,  H01L2924/01005 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01044 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/0106 ,  H01L2924/01063 ,  H01L2924/01064 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01105 ,  H01L2924/01204 ,  H01L2924/01205 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19043 ,  H01L2924/01062 ,  H01L2924/01004 ,  H01L2924/01039 ,  H01L2924/01201 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01006

摘要： The present invention was held in order to resolve problems on above-mentioned conventional wire bumping material. This invention has the following purposes; (1) approximating Au-Ag alloy bumping balls to bond Al pads to ideal sphere shape (2) increasing assurance of Au-Ag alloy bump bonding to Al pads (3) shortening tail length of Au-Ag alloy bump (4) improving anti-Au consumption into solder (5) decreasing contamination of capillary tip by bump wire and hole around tip Means for resolution Au-Ag alloy for wire bumping comprising wherein Au, which purity is more than 99.99 mass %, comprising Au matrix and a particle of additive elements, consisting of 1 to 40 mass % Ag, which purity is more than 99.99 mass %.

摘要翻译： 本发明是为了解决上述传统的导线凸块材料的问题而进行的。 本发明具有以下目的： （1）近似Au-Ag合金碰撞球以将Al焊盘结合到理想球形（2）增加Au-Ag合金凸点结合到Al焊盘的保证（3）缩短Au-Ag合金凸点的尾部长度（4） - 消耗到焊料中（5）通过凸点线和尖端周围的孔减少毛细管尖端的污染解决方法用于分解金属线的Au-Ag合金包括其中包含Au基体和颗粒为 由1质量％〜40质量％的Ag构成的添加元素，其纯度超过99.99质量％。