公开(公告)号：EP3255112A4

公开(公告)日：2018-07-25

申请号：EP16746475

申请日：2016-01-27

申请人： TANAKA PRECIOUS METAL IND

发明人： FURUSHO RIKIA ,  ABE SHINTARO ,  KONDO TAKESHI ,  TANAKA TERUKI

IPC分类号： C09J163/02 ,  C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  C09J163/04 ,  H01B1/22

CPC分类号： C09J11/04 ,  C09J9/02 ,  C09J11/06 ,  C09J163/04 ,  H01B1/22

摘要： [Problem] Provided is a thermally and electrically conductive adhesive composition used as a die-bonding material which shows high heat dissipation performance and stable electric conductivity as well as high adhesion force. [Solution] Provided is a thermally and electrically conductive adhesive composition, comprising: (A) an electrically conductive filler; (B) an epoxy resin; (C) a curing agent, and (D) an organic solvent, in which the electrically conductive filler (A) is a submicron fine silver powder, and the content of the electrically conductive filler (A) is such that (A) / (B) is 96.0 / 4.0 to 99.5 /0.5 in the mass ratio to the content of the epoxy resin (B); and the epoxy resin (B) comprises at least a bisphenol-type epoxy resin and a novo lac-type epoxy resin; and the curing agent (C) is diaminodiphenyl sulfone and/or a derivative thereof, and the content of the curing agent (C) is 0.4 to 2.4 molar equivalents in terms of equivalent of active hydrogen relative to 1 molar equivalent of epoxy groups in the epoxy resin (B).

公开(公告)号：EP3150680A4

公开(公告)日：2018-01-24

申请号：EP15799331

申请日：2015-05-28

申请人： TANAKA PRECIOUS METAL IND

发明人： ABE SHINTARO ,  FURUSHO RIKIA

IPC分类号： C09J163/00 ,  C08G59/50 ,  C08G59/62 ,  C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  C09J121/00 ,  H01B1/02 ,  H01B1/22 ,  H01L23/373

CPC分类号： C09J9/02 ,  C08G59/5033 ,  C08G59/504 ,  C08G59/621 ,  C08K2003/0806 ,  C09J11/04 ,  C09J11/06 ,  C09J11/08 ,  C09J121/00 ,  C09J163/00 ,  C09J163/04 ,  C09K5/14 ,  H01B1/02 ,  H01B1/22 ,  H01L23/3737 ,  H01L24/29 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/2075 ,  H01L2924/20751

摘要： The present invention relates to a thermally and electrically conductive adhesive composition, which includes (A) an electrically conductive filler, (B) an epoxy resin, (C) a reactive diluent, and (D) a curing agent, wherein the electrically conductive filler (A) is a silver powder having an average particle diameter of 1 to 10 µm, the epoxy resin (B) has two or more epoxy functional groups and aromatic rings in each molecule, the reactive diluent (C) is a compound having two or more glycidyl ether functional groups in an aliphatic hydrocarbon chain and also having a molecular weight of 150 to 600, and the curing agent (D) is a compound having two or more phenol functional groups in each molecule, a compound having two or more aniline functional groups in each molecule, or a mixture of these compounds, and the content of each of the electrically conductive filler (A), the epoxy resin (B), the reactive diluent (C), and the curing agent (D) is within a specific range. The thermally and electrically conductive adhesive composition of the present invention has high thermal conductivity and stable electrical conductivity.