公开(公告)号：EP2783285B1

公开(公告)日：2018-12-26

申请号：EP12808939.8

申请日：2012-11-19

申请人： VMware, Inc.

发明人： DEASY, Stephen ,  NEWELL, Craig ,  SIT, Emil ,  WISNER, Paul ,  FURODET, David ,  GYURIS, Viktor ,  MEYER, Robert ,  STRUDEL, Fanny

IPC分类号： G06F9/455 ,  G06F9/445 ,  H04L12/24 ,  G06F3/0482 ,  H04L29/06 ,  H04M1/725 ,  H04W12/06 ,  H04W12/08 ,  H04W68/12 ,  H04L29/08 ,  G06F21/62 ,  H04W8/22 ,  G06F3/0484 ,  H04W4/50 ,  H04W4/60 ,  H04W76/10

CPC分类号： H04L63/108 ,  B32B5/024 ,  B32B27/12 ,  B32B27/38 ,  B32B37/025 ,  B32B37/12 ,  B32B37/16 ,  B32B2037/1253 ,  C08J5/128 ,  C08J5/24 ,  C08J2363/04 ,  C08J2367/00 ,  C09J7/21 ,  C09J7/30 ,  C09J163/04 ,  C09J2463/00 ,  C09J2467/006 ,  G06F3/0482 ,  G06F3/04842 ,  G06F9/445 ,  G06F9/455 ,  G06F9/45529 ,  G06F9/45558 ,  G06F21/6245 ,  G06F21/629 ,  G06F2009/45587 ,  G06F2009/45595 ,  H04L41/0853 ,  H04L63/0272 ,  H04L63/102 ,  H04L63/105 ,  H04L63/20 ,  H04L67/34 ,  H04M1/72522 ,  H04M1/72583 ,  H04W4/50 ,  H04W4/60 ,  H04W8/22 ,  H04W12/06 ,  H04W12/08 ,  H04W68/12 ,  H04W76/10 ,  Y10T428/14

摘要： In some aspects, a mobile application package is bound to a privileged component of a mobile device operating system. The mobile application package includes a software virtualization layer and a management service component. The software virtualization layer and the management service component are enabled to execute in a privileged mode based on the privileged component. A virtual phone image is downloaded from a management server. A virtual machine based on the virtual phone image is launched by the software virtualization layer.

公开(公告)号：EP3093304B1

公开(公告)日：2018-09-12

申请号：EP15735456.4

申请日：2015-01-09

申请人： Korea Institute of Industrial Technology

发明人： CHUN, Hyun-Aee ,  KIM, Yun-Ju ,  PARK, Su-Jin ,  PARK, Sook-Yeon ,  TAK, Sang-Yong ,  PARK, Sung-Hwan

IPC分类号： C08G59/40 ,  C08K5/04 ,  C08K5/54 ,  C08L63/04 ,  C08G59/62 ,  C08G8/28

CPC分类号： C08G59/4085 ,  B32B27/42 ,  C08G8/28 ,  C08G14/12 ,  C08G59/40 ,  C08G59/621 ,  C08J5/24 ,  C08J2363/00 ,  C08J2363/02 ,  C08J2363/04 ,  C08K5/54 ,  C08K7/14 ,  C08L61/14 ,  C08L61/34 ,  C08L63/00 ,  C09D161/14 ,  C09D161/34 ,  C09D163/04 ,  C09J161/14 ,  C09J161/34 ,  C09J163/04 ,  H01L23/29 ,  H01L23/293 ,  H05K1/0353

摘要： The present invention relates to a novolac hardener having an alkoxysilyl group, the novolac hardener exhibiting excellent heat resistance characteristics, such as a low coefficient of thermal expansion (CTE) and an increase in the glass transition temperature, when forming a composite; a method for preparing the same; a composition containing the same; a hardened product; and a use thereof. According to an embodiment of the present invention, provided are a novolac hardener having an alkoxysilyl group of chemical formulas I-1 to I-4; a method for preparing the novolac hardener having an alkoxysilyl group of chemical formulas I-1 to 1-4 through alkenylation and alkoxysilylation of the novolac hardener; a method for preparing the novolac hardener having an alkoxysilyl group of chemical formulas I-1 to 1-4 through alkoxysilylation of the novolac hardener; a composition containing the novolac hardener having an alkoxysilyl group of chemical formulas I-1 to I-4; a hardened product thereof; and a use thereof. A composite comprising the novel hardener having an alkoxysilyl group according to the present invention exhibits a low CTE and a high glass transition temperature through a chemical bond between the alkoxysilyl group of the hardener and a phenol or epoxide group as well as a chemical bond between the alkoxysilyl group of the hardener and a filler.

公开(公告)号：EP3049478B1

公开(公告)日：2018-08-01

申请号：EP13894279.2

申请日：2013-09-26

申请人： Blue Cube IP LLC

发明人： FENG, Yanli ,  ZHANG, Yi ,  DU, Wei ,  XIE, Rui ,  XIE, Demei ,  GONG, Yonghua

IPC分类号： C08L63/00 ,  C08L71/02 ,  C09D163/00 ,  C09J163/00 ,  C08L63/04 ,  C09D163/04 ,  C09J163/04

CPC分类号： C08L63/04 ,  C08L63/00 ,  C08L71/02 ,  C09D163/00 ,  C09D163/04 ,  C09J163/00 ,  C09J163/04

摘要： A curable epoxy resin composition, upon curing, has a clarity value of at least 30% and provides improved impact strength while maintaining glass transition temperature; and a process of preparing the curable epoxy resin composition.

公开(公告)号：EP3150680A4

公开(公告)日：2018-01-24

申请号：EP15799331

申请日：2015-05-28

申请人： TANAKA PRECIOUS METAL IND

发明人： ABE SHINTARO ,  FURUSHO RIKIA

IPC分类号： C09J163/00 ,  C08G59/50 ,  C08G59/62 ,  C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  C09J121/00 ,  H01B1/02 ,  H01B1/22 ,  H01L23/373

CPC分类号： C09J9/02 ,  C08G59/5033 ,  C08G59/504 ,  C08G59/621 ,  C08K2003/0806 ,  C09J11/04 ,  C09J11/06 ,  C09J11/08 ,  C09J121/00 ,  C09J163/00 ,  C09J163/04 ,  C09K5/14 ,  H01B1/02 ,  H01B1/22 ,  H01L23/3737 ,  H01L24/29 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/2075 ,  H01L2924/20751

摘要： The present invention relates to a thermally and electrically conductive adhesive composition, which includes (A) an electrically conductive filler, (B) an epoxy resin, (C) a reactive diluent, and (D) a curing agent, wherein the electrically conductive filler (A) is a silver powder having an average particle diameter of 1 to 10 µm, the epoxy resin (B) has two or more epoxy functional groups and aromatic rings in each molecule, the reactive diluent (C) is a compound having two or more glycidyl ether functional groups in an aliphatic hydrocarbon chain and also having a molecular weight of 150 to 600, and the curing agent (D) is a compound having two or more phenol functional groups in each molecule, a compound having two or more aniline functional groups in each molecule, or a mixture of these compounds, and the content of each of the electrically conductive filler (A), the epoxy resin (B), the reactive diluent (C), and the curing agent (D) is within a specific range. The thermally and electrically conductive adhesive composition of the present invention has high thermal conductivity and stable electrical conductivity.

公开(公告)号：EP3093304A4

公开(公告)日：2017-08-02

申请号：EP15735456

申请日：2015-01-09

申请人： KOREA IND TECH INST

发明人： CHUN HYUN-AEE ,  KIM YUN-JU ,  PARK SU-JIN ,  PARK SOOK-YEON ,  TAK SANG-YONG ,  PARK SUNG-HWAN

IPC分类号： C08G59/40 ,  C08G8/28 ,  C08G59/62 ,  C08K5/04 ,  C08K5/54 ,  C08L63/04

CPC分类号： C08G59/4085 ,  B32B27/42 ,  C08G8/28 ,  C08G14/12 ,  C08G59/40 ,  C08G59/621 ,  C08J5/24 ,  C08J2363/00 ,  C08J2363/02 ,  C08J2363/04 ,  C08K5/54 ,  C08K7/14 ,  C08L61/14 ,  C08L61/34 ,  C08L63/00 ,  C09D161/14 ,  C09D161/34 ,  C09D163/04 ,  C09J161/14 ,  C09J161/34 ,  C09J163/04 ,  H01L23/29 ,  H01L23/293 ,  H05K1/0353

摘要： The present invention relates to a novolac hardener having an alkoxysilyl group, the novolac hardener exhibiting excellent heat resistance characteristics, such as a low coefficient of thermal expansion (CTE) and an increase in the glass transition temperature, when forming a composite; a method for preparing the same; a composition containing the same; a hardened product; and a use thereof. According to an embodiment of the present invention, provided are a novolac hardener having an alkoxysilyl group of chemical formulas I-1 to I-4; a method for preparing the novolac hardener having an alkoxysilyl group of chemical formulas I-1 to 1-4 through alkenylation and alkoxysilylation of the novolac hardener; a method for preparing the novolac hardener having an alkoxysilyl group of chemical formulas I-1 to 1-4 through alkoxysilylation of the novolac hardener; a composition containing the novolac hardener having an alkoxysilyl group of chemical formulas I-1 to I-4; a hardened product thereof; and a use thereof. A composite comprising the novel hardener having an alkoxysilyl group according to the present invention exhibits a low CTE and a high glass transition temperature through a chemical bond between the alkoxysilyl group of the hardener and a phenol or epoxide group as well as a chemical bond between the alkoxysilyl group of the hardener and a filler.

摘要翻译： 本发明涉及具有烷氧基甲硅烷基的酚醛清漆硬化剂，所述酚醛清漆硬化剂在形成复合材料时表现出优异的耐热性（例如低热膨胀系数（CTE）和玻璃化转变温度的增加）; 其制备方法; 含有该组合物的组合物; 硬化产品; 及其用途。 根据本发明的一个实施方案，提供了具有化学式I-1至I-4的烷氧基甲硅烷基的酚醛清漆硬化剂; 通过酚醛清漆硬化剂的烯基化和烷氧基甲硅烷基化来制备具有化学式I-1至1-4的烷氧基甲硅烷基的酚醛清漆硬化剂的方法; 通过酚醛清漆硬化剂的烷氧基甲硅烷基化来制备具有化学式I-1至1-4的烷氧基甲硅烷基的酚醛清漆硬化剂的方法; 包含具有化学式I-1至I-4的烷氧基甲硅烷基的酚醛清漆硬化剂的组合物; 其硬化产物; 及其用途。 根据本发明的包含具有烷氧基甲硅烷基的新型硬化剂的复合材料通过硬化剂的烷氧基甲硅烷基与苯酚或环氧基之间的化学键以及在所述硬化剂之间的化学键显示低CTE和高玻璃化转变温度 硬化剂的烷氧基甲硅烷基和填料。

公开(公告)号：EP2313470B1

公开(公告)日：2016-12-07

申请号：EP09791357.8

申请日：2009-08-11

申请人： Dow Global Technologies LLC

发明人： LUTZ, Andreas ,  SCHNEIDER, Daniel

IPC分类号： C09J163/00 ,  C08G18/66

CPC分类号： C08F283/006 ,  C08G18/12 ,  C08G18/2815 ,  C08G18/4854 ,  C08G18/6715 ,  C08G18/672 ,  C08G18/831 ,  C08L63/00 ,  C08L75/16 ,  C08L2666/20 ,  C09J163/00 ,  C09J163/04 ,  C09J175/16 ,  C08G18/6677

摘要： Structural adhesives are prepared from an elastomeric toughener that contains urethane and/or urea groups, and have some terminal isocyanate groups that are capped with a phenol and other terminal isocyanate groups that are capped with a hydroxy-functional acrylate or a hydroxy-functional methacrylate. In certain embodiments, the presence of both types of capping on the toughener leads to higher impact peel strengths and a greater level of cohesive failure, than when the toughener is capped with a phenol an hydroxy-functional acrylate or hydroxy-functional methacrylate alone.

公开(公告)号：EP2976380A1

公开(公告)日：2016-01-27

申请号：EP14767385.9

申请日：2014-03-21

申请人： Henkel IP & Holding GmbH

发明人： CHAMPAGNE, Timothy M. ,  SRIDHAR, Laxmisha M. ,  ISRAEL, Jonathan B. ,  KLEMARCZYK, Philip T. ,  ZHANG, Xianman ,  JORDAN, Benny E.

IPC分类号： C08J3/24 ,  C08K5/00 ,  C08G59/40 ,  C08F290/00 ,  C08L101/02 ,  C08L63/00 ,  C08L79/00 ,  H01L23/29

CPC分类号： C09J163/00 ,  C07C33/12 ,  C07C69/54 ,  C07C69/753 ,  C07C2603/68 ,  C07D303/16 ,  C07D303/28 ,  C08F283/10 ,  C08G59/226 ,  C08G59/24 ,  C08G59/4021 ,  C08G59/5073 ,  C08G59/56 ,  C08K5/092 ,  C08L53/02 ,  C08L63/00 ,  C08L79/085 ,  C09J163/04 ,  H01L21/563 ,  H01L23/293 ,  H01L23/3142 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/00

摘要： Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like (collectively, “subcomponents”), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions.

摘要翻译： 提供可用于安装到电路板半导体器件上的热固性树脂组合物，所述半导体器件例如芯片尺寸或芯片尺寸封装（“CSP”），球栅阵列（“BGA”），平面栅格阵列（“LGA”）和 （统称为“子组件”）或半导体芯片。 组合物的反应产物在经受适当的条件时可控制地再加工。

公开(公告)号：EP2617784B1

公开(公告)日：2015-06-10

申请号：EP11825094.3

申请日：2011-09-09

申请人： Sumitomo Metal Mining Co., Ltd.

发明人： TAKITA Yuka ,  MIYAUCHI Kyouko ,  YAMABE Hidetoshi

IPC分类号： C09D163/02 ,  C09D5/00 ,  C09D7/12 ,  C09D163/04 ,  C08G59/40 ,  C08G59/38 ,  C09D163/00

CPC分类号： C09J163/04 ,  C08G59/38 ,  C08G59/4021 ,  C09D5/002 ,  C09D5/084 ,  C09D163/00 ,  C09D163/04

公开(公告)号：EP2566922B1

公开(公告)日：2015-03-18

申请号：EP11718344.2

申请日：2011-05-02

申请人： Henkel AG & Co. KGaA

发明人： WALTER, Pablo ,  BENOMAR, Mustapha ,  KREILING, Stefan ,  TROLL, Angelika ,  SCHÖNFELD, Rainer

IPC分类号： C08J3/24 ,  C08G59/04 ,  C09D163/00 ,  C09D163/04 ,  C08L63/04 ,  C08L63/00 ,  C08G59/38 ,  C09J163/00 ,  C09J163/04

CPC分类号： C08G59/38 ,  C08G59/04 ,  C08J3/241 ,  C08J2363/00 ,  C08L63/00 ,  C08L63/04 ,  C09D163/00 ,  C09D163/04 ,  C09J163/00 ,  C09J163/04

公开(公告)号：EP2840125A1

公开(公告)日：2015-02-25

申请号：EP14187296.0

申请日：2011-06-27

申请人： Dow Global Technologies LLC

发明人： Ming, Ming ,  Feng, Shaoguang ,  Liu, Yan Fei ,  Froese, Robert D. ,  Lutz, Andreas ,  Eagle, Glenn G. ,  Jialanella , Gary L. ,  Cole, Eric E. ,  Golden, Michael R.

IPC分类号： C09J163/04

CPC分类号： C08G18/10 ,  C08G59/621 ,  C08G59/64 ,  C08G59/686 ,  C08L61/06 ,  C09J163/00 ,  C09J163/04 ,  C08G18/58

摘要： Epoxy adhesive compositions contain a heat-activatable catalyst. The heat-activatable catalyst includes a tertiary amine catalyst and a novolac resin that has a weight average molecular weight of at least 3000. One-component epoxy adhesive formulations that contain the heat-activatable catalyst have unexpectedly good storage stability.

摘要翻译： 环氧粘合剂组合物含有可热活化的催化剂。 可热活化的催化剂包括叔胺催化剂和重均分子量为至少3000的酚醛清漆树脂。含有可热活化催化剂的单组分环氧粘合剂制剂意外地具有良好的储存稳定性。