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    Composite wiring board and manufacturing method thereof
    2.
    发明公开
    Composite wiring board and manufacturing method thereof 有权
    Verbundleiterplatte和Herstellungsverfahren derselben

    公开(公告)号：EP1786250A1

    公开(公告)日：2007-05-16

    申请号：EP06255825.9

    申请日：2006-11-14

    申请人： TDK Corporation

    发明人： Kobuke, Hisashi c/o TDK Corporation ,  Miyakoshi, Toshinobu c/o TDK Corporation ,  Uematsu, Hiroyuki c/o TDK Corporation

    IPC分类号： H05K3/46 ,  H05K3/40

    CPC分类号： H05K3/281 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K1/0269 ,  H05K1/0306 ,  H05K3/4007 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0367 ,  H05K2201/096 ,  H05K2201/09781 ,  H05K2201/09881 ,  H05K2203/1189 ,  H05K2203/308 ,  H01L2924/00

    摘要： A composite wiring board includes a ceramic substrate (1), a resin layer (2, 3) in contact with at least one surface of the ceramic substrate and a sintered metal conductor (6) piercing through the resin layer. The composite wiring board is manufactured by a method including the steps of forming a through hole in a sheet (17) having a shrinkage-suppressing effect and filling the through hole with conductive paste (18) to obtain a sheet (15, 16, 61, 71, 81, 82) for formation of a conductor, firing the conductor formation sheet and a green sheet (11) for a substrate in their laminated state to obtain a ceramic substrate having a surface provided with a sintered metal conductor (6), removing from the surface of the ceramic substrate a fired product of the sheet having the shrinkage-suppressing effect and forming a resin layer (2, 3) on the surface of the ceramic substrate.

    摘要翻译： 复合布线板包括陶瓷基板（1），与陶瓷基板的至少一个表面接触的树脂层（2,3）和穿过树脂层的烧结金属导体（6）。 复合布线板通过以下方法制造：在具有收缩抑制效果的片材（17）中形成通孔的步骤，并且用导电浆料（18）填充通孔以获得片材（15,16,61 ，71,81,82），用于形成导体，烧结导体形成片和用于基板的生片（11），以形成其层压状态，以获得具有设置有烧结金属导体（6）的表面的陶瓷基板， 从陶瓷基板的表面除去具有收缩抑制效果的片材的烧成品，并在陶瓷基板的表面上形成树脂层（2,3）。