公开(公告)号：EP2120259A1

公开(公告)日：2009-11-18

申请号：EP09251320.9

申请日：2009-05-14

申请人： TEKTRONIX, INC.

发明人： Christensen, Dale E. ,  Miller, Curtis J.

IPC分类号： H01L21/60 ,  H01L23/49

CPC分类号： H01L24/85 ,  H01L24/36 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/40091 ,  H01L2224/40137 ,  H01L2224/45014 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48472 ,  H01L2224/48475 ,  H01L2224/48479 ,  H01L2224/48599 ,  H01L2224/49111 ,  H01L2224/4945 ,  H01L2224/85051 ,  H01L2224/85191 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/37099 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A ball-bump bonded ribbon-wire interconnect has a ball-bump (16) attached to an integrated circuit's bond pad (14). A ribbon-wire (18) has one end attached to the ball-bump (14) and its opposing end attached to a substrate's metallized surface (22). The ribbon-wire (18) may be wider than the ball-bump (16), and the ball-bump (16) may separate the ribbon-wire (18) from the integrated circuit's surface. The ribbon-wire may interconnect multiple integrated circuits, each of which has a ball-bump or a suitably wide metallized surface, to a substrate's metallized surface. The present invention also includes a method of electrically connecting an electronic component to a substrate.

摘要翻译： 球凸焊接带状线互连具有附接到集成电路的接合焊盘（14）的球凸点（16）。 带状线（18）的一端连接到球凸点（14），并且其相对端附接到基底的金属化表面（22）。 带状线（18）可以比球凸块（16）更宽，并且球凸起（16）可以将带状线（18）与集成电路的表面分离。 带状线可以将多个集成电路（每个集成电路具有球凸起或适当宽的金属化表面）连接到基板的金属化表面。 本发明还包括将电子部件电连接到基板的方法。