公开(公告)号：EP2120259A1

公开(公告)日：2009-11-18

申请号：EP09251320.9

申请日：2009-05-14

申请人： TEKTRONIX, INC.

发明人： Christensen, Dale E. ,  Miller, Curtis J.

IPC分类号： H01L21/60 ,  H01L23/49

CPC分类号： H01L24/85 ,  H01L24/36 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/40091 ,  H01L2224/40137 ,  H01L2224/45014 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48472 ,  H01L2224/48475 ,  H01L2224/48479 ,  H01L2224/48599 ,  H01L2224/49111 ,  H01L2224/4945 ,  H01L2224/85051 ,  H01L2224/85191 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/37099 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A ball-bump bonded ribbon-wire interconnect has a ball-bump (16) attached to an integrated circuit's bond pad (14). A ribbon-wire (18) has one end attached to the ball-bump (14) and its opposing end attached to a substrate's metallized surface (22). The ribbon-wire (18) may be wider than the ball-bump (16), and the ball-bump (16) may separate the ribbon-wire (18) from the integrated circuit's surface. The ribbon-wire may interconnect multiple integrated circuits, each of which has a ball-bump or a suitably wide metallized surface, to a substrate's metallized surface. The present invention also includes a method of electrically connecting an electronic component to a substrate.

摘要翻译： 球凸焊接带状线互连具有附接到集成电路的接合焊盘（14）的球凸点（16）。 带状线（18）的一端连接到球凸点（14），并且其相对端附接到基底的金属化表面（22）。 带状线（18）可以比球凸块（16）更宽，并且球凸起（16）可以将带状线（18）与集成电路的表面分离。 带状线可以将多个集成电路（每个集成电路具有球凸起或适当宽的金属化表面）连接到基板的金属化表面。 本发明还包括将电子部件电连接到基板的方法。

公开(公告)号：EP2636938A1

公开(公告)日：2013-09-11

申请号：EP11819039.6

申请日：2011-09-20

申请人： Panasonic Corporation

发明人： TAKEUCHI, Nobuyoshi ,  MATSUDA, Tsugihiro ,  NAGAI, Hideo ,  MIKI, Masahiro ,  UEMOTO, Takaari

IPC分类号： F21S2/00 ,  F21S8/04 ,  F21Y101/02

CPC分类号： F21K9/232 ,  F21V3/00 ,  F21Y2115/10 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49107 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light-emitting device capable of effectively dissipating heat generated at an LED is provided. The light-emitting device according to the present invention includes: a base board (140); and an LED chip (150) mounted on the base board (140). The base board (140) is a translucent base board made of a polycrystalline ceramic. A main region of the base board (140) is a region including an element mounted region (A2) on which the LED chip (150) is mounted, and an average grain size of the polycrystalline ceramic in the main region is between 10 µm and 40 µm inclusive. An end portion region (A1) of said base board (140) is a region around an end portion, and an average grain size of the polycrystalline ceramic in the end portion region (A1) is preferably smaller than an average grain size of the polycrystalline ceramic in the element mounted region (A2).

摘要翻译： 提供能够有效地散发在LED处产生的热量的发光装置。 根据本发明的发光器件包括：基板（140）; 和安装在基板（140）上的LED芯片（150）。 基板（140）是由多晶陶瓷制成的半透明基板。 基板（140）的主区域是包括安装有LED芯片（150）的元件安装区域（A2）的区域，并且主区域中的多晶陶瓷的平均晶粒尺寸在10μm和 40微米（含） 所述基板（140）的端部区域（A1）是端部周围的区域，并且端部区域（A1）中的多晶陶瓷的平均粒径优选小于多晶体的平均粒径 元件安装区域（A2）中的陶瓷。

公开(公告)号：EP0126664B1

公开(公告)日：1989-08-02

申请号：EP84400788.0

申请日：1984-04-19

申请人： FUJITSU LIMITED

发明人： Mizukoshi, Masataka ,  Endo, Teiichi

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L24/85 ,  H01L23/498 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/06153 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49052 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/49431 ,  H01L2224/4945 ,  H01L2224/78313 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85191 ,  H01L2224/85986 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00 ,  H01L2924/2075 ,  H01L2224/05599 ,  H01L2224/85399

公开(公告)号：EP2041783A2

公开(公告)日：2009-04-01

申请号：EP07785583.1

申请日：2007-06-29

申请人： Epcos AG

发明人： BLOCK, Christian ,  BRUNNER, Sebastian ,  HOFFMANN, Christian

IPC分类号： H01L21/603 ,  H01L21/607 ,  H01L23/485 ,  H01L23/31 ,  H01L23/14 ,  H01L23/15

CPC分类号： H01L24/85 ,  H01L23/3121 ,  H01L23/3171 ,  H01L23/49822 ,  H01L24/05 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/83 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05644 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/49175 ,  H01L2224/4945 ,  H01L2224/78301 ,  H01L2224/83 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2224/85191 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15798 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/4554

摘要： Disclosed is a module for electrical components. In said module, a component chip is glued to the top of a multilayer substrate which comprises integrated wiring and on which bondable terminal faces are provided. The component chip is fitted with bond pads on the upward-facing surface thereof and is connected to the substrate by means of bond wires. The bond wires are guided such that one respective ball thereof is bonded to a terminal face while the wedge thereof is bonded directly to one of the bond pads.

公开(公告)号：EP1328023A3

公开(公告)日：2004-12-22

申请号：EP02019488.2

申请日：2002-08-30

申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

发明人： Kawai, Fumihiko ,  Fukuda, Toshiyuki ,  Minamio, Masanori ,  Takeuchi, Noboru ,  Ogata, Shuichi ,  Tara, Katsushi ,  Nakatsuka, Tadayoshi

IPC分类号： H01L23/495 ,  H01L23/31

CPC分类号： H01L24/49 ,  H01L21/4842 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49548 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/06179 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/4912 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49433 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/85191 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/10329 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48227 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2224/4554

摘要： The present invention includes a die pad; signal leads, ground connection leads connected to the die pad; a semiconductor chip including electrode pads for grounding; metal thin wires, and an encapsulating resin for encapsulating the die pad and the semiconductor chip and encapsulating the signal leads and the ground connection lead such that lower portions of the signal leads and the ground connection lead are exposed as external terminals. The ground connection lead is connected to the electrode pad for grounding, so that the resin-encapsulated semiconductor device is electrically stabilized. Furthermore, interference between high frequency signals passing through the signal leads can be suppressed by the die pad and the ground connection leads.

摘要翻译： 本发明包括一个衬垫; 信号引线，接地连接引线连接到所述垫; 半导体芯片，包括电极焊盘接地; 金属细线，以及用于封装管芯焊盘和半导体芯片和封装所述信号引线和接地引线的连接并搜索所述信号引线和接地引线的连接的下部密封树脂露出作为外部端子。 接地连接引线被连接到用于接地的电极焊盘，所以没有树脂密封型半导体装置电稳定化。 进一步，通过信号引线高频信号之间的干扰可以通过在管芯焊盘和所述接地连接引线被抑制。

公开(公告)号：EP0964446A2

公开(公告)日：1999-12-15

申请号：EP99304251.4

申请日：1999-06-01

申请人： Ford Motor Company

发明人： Yerdon, Timothy Joseph ,  Topping, Mark Stephen ,  Paruchuri, Mohan R.

IPC分类号： H01L21/60

CPC分类号： H01L24/85 ,  H01L23/538 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/072 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48491 ,  H01L2224/48599 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48699 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48996 ,  H01L2224/49175 ,  H01L2224/4945 ,  H01L2224/85051 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/2076 ,  H05K3/244 ,  H05K3/328 ,  H01L2224/78 ,  H01L2924/00

摘要： An electronic circuit assembly comprising a dielectric substrate having an electronic component thereon; a first copper bonding surface on the substrate or component; a second metallic bonding surface on the substrate or component; a layer of silver atop the copper bonding surface; and a wirebonding wire attached to the layer of silver and to the second metallic bonding surface.

公开(公告)号：EP2652783A1

公开(公告)日：2013-10-23

申请号：EP11719091.8

申请日：2011-04-06

申请人： Tessera, Inc.

发明人： HABA, Belgacem ,  ZOHNI, Wael ,  CRISP, Richard, Dewitt

IPC分类号： H01L23/49 ,  H01L23/13 ,  H01L23/66 ,  H01L25/065 ,  H01L25/10

CPC分类号： H01L25/065 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L25/105 ,  H01L27/14618 ,  H01L2223/6611 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48096 ,  H01L2224/4824 ,  H01L2224/48477 ,  H01L2224/48599 ,  H01L2224/49111 ,  H01L2224/49174 ,  H01L2224/4945 ,  H01L2224/73215 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A microelectronic assembly includes a dielectric element having first and second surfaces, first and second apertures extending between the first and second surfaces and defining a central region of the first surface between the first and second apertures, first and second microelectronic elements, and leads extending from contacts exposed at respective front surfaces of the first and second microelectronic elements to central terminals exposed at the central region. The front surface of the first microelectronic element can face the second surface of the dielectric element. The front surface of the second microelectronic element can face a rear surface of the first microelectronic element. The contacts of the second microelectronic element can project beyond an edge of the first microelectronic element. At least first and second ones of the leads can electrically interconnect a first central terminal of the central terminals with each of the first and second microelectronic elements.

公开(公告)号：EP1328023B1

公开(公告)日：2012-02-01

申请号：EP02019488.2

申请日：2002-08-30

申请人： Panasonic Corporation

发明人： Kawai, Fumihiko ,  Fukuda, Toshiyuki ,  Minamio, Masanori ,  Takeuchi, Noboru ,  Ogata, Shuichi ,  Tara, Katsushi ,  Nakatsuka, Tadayoshi

IPC分类号： H01L23/495 ,  H01L23/31

CPC分类号： H01L24/49 ,  H01L21/4842 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49548 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/06179 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/4912 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49433 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/85191 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/10329 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48227 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2224/4554

公开(公告)号：EP0964446A3

公开(公告)日：2001-02-07

申请号：EP99304251.4

申请日：1999-06-01

申请人： Ford Motor Company

发明人： Yerdon, Timothy Joseph ,  Topping, Mark Stephen ,  Paruchuri, Mohan R.

IPC分类号： H01L21/60

CPC分类号： H01L24/85 ,  H01L23/538 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/072 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48491 ,  H01L2224/48599 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48699 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48996 ,  H01L2224/49175 ,  H01L2224/4945 ,  H01L2224/85051 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/2076 ,  H05K3/244 ,  H05K3/328 ,  H01L2224/78 ,  H01L2924/00

摘要： An electronic circuit assembly comprising a dielectric substrate (10) having an electronic component (14) thereon; a first copper bonding surface (60) on the substrate or component; a second metallic bonding surface (62) on the substrate or component; a layer of silver (24) atop the copper bonding surface; and a wirebonding wire (18) attached to the layer of silver and to the second metallic bonding surface.

摘要翻译： 一种电子电路组件，包括其上具有电子部件的电介质基板; 在基板或部件上的第一铜键合表面; 在所述基板或部件上的第二金属结合表面; 铜层表面上方有一层银; 以及连接到银层和第二金属结合表面的引线接合线。

公开(公告)号：EP0883177A1

公开(公告)日：1998-12-09

申请号：EP98401286.4

申请日：1998-05-28

申请人： SGS-THOMSON MICROELECTRONICS S.A.

发明人： Moscicki, Jean-Pierre

IPC分类号： H01L23/433

CPC分类号： H01L24/49 ,  H01L23/4334 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/49429 ,  H01L2224/4945 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： Dispositif semi-conducteur, comprenant une pastille (2) formant un circuit intégré, une grille de connexion électrique (12) et un dissipateur thermique (6). La face passive de la pastille (2) est fixée par collage sur une face d'appui (10) du dissipateur (6). La grille de connexion présente une ouverture centrale (13a) lui conférant la forme d'un anneau central de grille (13), qui s'étend autour de la pastille et qui est fixé en appui sur ladite face d'appui du dissipateur. L'anneau central de grille (13) est fixé par soudage à ladite face d'appui (10) du dissipateur (6) respectivement en quatre points éloignés des coins de cet anneau central de grille et ladite face d'appui (10) du dissipateur (6) présente des pions de centrage et de fixation (16) en saillie engagés dans des passages traversants (17) de l'anneau central de grille (13).

摘要翻译： 半导体器件由形成集成电路的芯片（2），具有中心板的电连接栅极（12）和散热器（6）组成。 芯片的被动面优选地通过粘合剂固定到散热器的推力面（10）和格栅的中心板上，该中心板具有使其呈圆周延伸的环（13）形式的孔。 中心格栅环的分支（14）优选地通过焊接固定到远离栅格角的点处的消散器的推力面上。 此外，推力面具有与中心格栅环的角部中的凹部（17）接合的定心和固定钉（16）。 钉子倾向于沿着对角线向外拉环。