公开(公告)号：EP1890872A4

公开(公告)日：2015-04-22

申请号：EP06760562

申请日：2006-05-31

Applicant: TEXAS INSTRUMENTS INC

Inventor： EDWARDS DARVIN R ,  CHIU TZ-CHENG ,  ZENG KEJUN

IPC: B32B15/08 ,  B32B15/20 ,  H01L23/532

CPC classification number: H05K3/3436 ,  H01L21/4846 ,  H01L23/49816 ,  H01L23/49866 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/09 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2203/1105 ,  Y02P70/613 ,  Y10T428/12715 ,  Y10T428/1291 ,  Y10T428/24917 ,  H01L2924/00

Abstract: A metal interconnect structure ( 100 ) comprising a bond pad ( 101 ), which has copper with at least 70 volume percent composed of crystal grains expanding more than 1 mum in their main direction, and 30 or less volume percent composed of crystal grains, which expand less than 1 mum in their main crystal direction. A body ( 102 ) of tin alloy is in contact with the bond pad.