Abstract:
A metal interconnect structure ( 100 ) comprising a bond pad ( 101 ), which has copper with at least 70 volume percent composed of crystal grains expanding more than 1 mum in their main direction, and 30 or less volume percent composed of crystal grains, which expand less than 1 mum in their main crystal direction. A body ( 102 ) of tin alloy is in contact with the bond pad.
Abstract:
A self-leveling heat sink includes a spring-arm device having at least one aperture and at least one spring-arm is coupled to a substrate. The substrate has at least one package mounted thereon, so that when the spring-arm device is mounted to the substrate the at least one package passes through the at least one aperture. A heat sink operable to remove heat from the at least one package has at least one heat sink post operable to receive a heat sink clip located at the distal end of each of the at least one spring-arms. Each of the at least one spring-arms extending from an inside edge of the at least one aperture and operable to couple the heat sink to the at least one package.