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1.发明授权ADHESION PROMOTER AND SELF-PRIMING ARYLCYCLOBUTENE RESIN COMPOSITIONS 失效结合与ADHÄSIONSFÄHIGEARYLCYCLOBUTANHARZZUSAMMENSETZUNG
公开(公告)号：EP0788530B1
公开(公告)日：1998-10-07
申请号：EP95936268.2
申请日：1995-09-28
IPC分类号： C09D183/04 , C09D165/00
CPC分类号： C09D183/04 , C09D183/06 , C09D183/08 , C08L2666/14
摘要： A coating composition comprising: a hydrolyzed or partially hydrolyzed alkoxysilane, a solvent, and an arylcyclobutene; is useful in a variety of applications, including coatings for multichip modules, flat panel displays and integrated circuits. The preferred alkoxysilanes correspond to formula (I) wherein R is C1-C6 alkylidene, C1-C6 alkylene, arylene, or a direct bond; Y is C1-C6 alkyl, C2-C6 alkenyl, aryl, 3-methacryloxy, 3-acryloxy, 3-aminoethylamino, or 3-amino; R' is independently in each occurrence C1-C6 alkyl; and Z is C1-C6 alkyl, C2-C6 alkenyl or OR'.
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2.发明公开LOW DIELECTRIC CONSTANT POLYMERS HAVING GOOD ADHESION AND TOUGHNESS AND ARTICLES MADE WITH SUCH POLYMERS 审中-公开以较低的总介电常数GOOD责任和强度聚合物和文章制成品
公开(公告)号：EP1157059A1
公开(公告)日：2001-11-28
申请号：EP99964308.3
申请日：1999-12-21
CPC分类号： C08G61/10 , C08G2261/312 , H01L23/49894 , H01L23/5329 , H01L2924/0002 , H05K1/0326 , H01L2924/00
摘要： A cured polyphenylene polymer having a glass transition temperature no greater than 465 °C. An integrated circuit article having a fracture toughness as determined by the modified edge liftoff test of at least 0.3 MPa-M1/2.
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公开(公告)号：EP0889920B1
公开(公告)日：2002-02-13
申请号：EP97939622.3
申请日：1997-08-28
发明人： GODSCHALX, James, P. , ROMER, Duane, R. , SO, Ying, Hung , LYSENKO, Zenon , MILLS, Michael, E. , BUSKE, Gary, R. , TOWNSEND, Paul, H., III , SMITH, Dennis, W., Jr. , MARTIN, Steven, J. , DEVRIES, Robert, A.
IPC分类号： C08G61/10
CPC分类号： C08G61/10 , C08G2261/312
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4.发明公开
公开(公告)号：EP0788530A2
公开(公告)日：1997-08-13
申请号：EP95936268.0
申请日：1995-09-28
CPC分类号： C09D183/04 , C09D183/06 , C09D183/08 , C08L2666/14
摘要： A coating composition comprising: a hydrolyzed or partially hydrolyzed alkoxysilane, a solvent, and an arylcyclobutene; is useful in a variety of applications, including coatings for multichip modules, flat panel displays and integrated circuits. The preferred alkoxysilanes correspond to formula (I) wherein R is C1-C6 alkylidene, C1-C6 alkylene, arylene, or a direct bond; Y is C1-C6 alkyl, C2-C6 alkenyl, aryl, 3-methacryloxy, 3-acryloxy, 3-aminoethylamino, or 3-amino; R' is independently in each occurrence C1-C6 alkyl; and Z is C1-C6 alkyl, C2-C6 alkenyl or OR'.
摘要翻译： 一种涂料组合物，其包含：水解或部分水解的烷氧基硅烷，溶剂和芳基环丁烯; 可用于各种应用，包括多芯片模块涂层，平板显示器和集成电路。 优选的烷氧基硅烷符合式（I），其中R为C 1 -C 6亚烷基，C 1 -C 6亚烷基，亚芳基或直接键; Y是C1-C6烷基，C2-C6链烯基，芳基，3-甲基丙烯酰氧基，3-丙烯酰氧基，3-氨基乙氨基或3-氨基; R'在每种情况下独立地为C1-C6烷基; Z是C1-C6烷基，C2-C6链烯基或OR'。
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5.发明公开A COMPOSITION CONTAINING A CROSS-LINKABLE MATRIX PRECURSOR AND A PORAGEN, AND A POROUS MATRIX PREPARED THEREFROM 有权A组合含有可交联MATRIXPERCURSOR和多孔结构制作材料及由其制成的多孔基质
公开(公告)号：EP1141128A1
公开(公告)日：2001-10-10
申请号：EP99962822.5
申请日：1999-11-22
发明人： BRUZA, Kenneth, J. , GODSCHALX, James, P. , SHAFFER, Edward, O., II , SMITH, Dennis, W., Jr. , TOWNSEND, Paul, H., III , BOUCK, Kevin, J. , NIU, Qing, Shan, J.
CPC分类号： H01L21/02126 , C08J9/26 , C08J2365/00 , C08L25/06 , C08L65/00 , H01L21/02118 , H01L21/02203 , H01L21/02282 , H01L21/312 , C08L2666/04 , C08L25/00 , C08L2666/06
摘要： A suitable cross-linkable matrix precursor and a poragen can be treated to form a porous cross-linked matrix having a Tg of greater than 300° C. The porous matrix material has a lower dielectric constant than the corresponding non-porous matrix material, making the porous matrix material particularly attractive for a variety of electronic applications including integrated circuits, multichip modules, and flat panel display devices.
摘要翻译： 合适的可交联基体前体和致孔剂可以被处理，以形成具有大于300℃的多孔性基体材料具有比相应的非多孔基质材料更低的介电常数，使得Tg的多孔交联的基质 多孔基体材料用于各种电子应用，包括集成电路，多芯片模块，和平板显示装置特别有吸引力的。
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6.发明公开ADHESION PROMOTER AND SELF-PRIMING RESIN COMPOSITIONS AND ARTICLES MADE THEREFROM 有权结合与ADHÄSIONSFÄHIGE的树脂组合物及其制品由其制成的
公开(公告)号：EP1112329A1
公开(公告)日：2001-07-04
申请号：EP99943863.3
申请日：1999-08-23
发明人： STOKICH, Theodore, M., Jr. , MARTIN, Brian, B. , STRANDJORD, Andrew, J. , HETZNER, Jack, E. , HARRIS, Robert, F. , TOWNSEND, Paul, H., III , FRYE, Donald, C. , SCHMIDT, Donald, L.
IPC分类号： C09D165/02 , C09D171/12
CPC分类号： C09D165/02 , C08G2261/312 , C08L71/126 , C08L83/00
摘要： A composition is comprised of the following: a) a hydrolyzed or partially hydrolyzed silane selected from alkoxysilanes and acyloxysilanes; b) a solvent consisting of an organic liquid or mixture of two or more organic liquids in which component (a) and component (c) are soluble and c) a cross-linking prepolymer, oligomer, resin or mixtures thereof that forms a low dielectric constant cross-linked polyarylene. A coating may be made using the composition wherein the coating is comprised of a cross-linked polymer of a low dielectric cross-linking prepolymer, oligomer, resin or mixture thereof and a hydrolyzed or partially hydrolyzed silane, said coating being adhered to a surface of a substrate wherein said surface is comprised of a first material that is a metal, ceramic or polymer and a second material that is (i) a metal, ceramic, or polymer and (ii) different than the first material.
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公开(公告)号：EP0889920A1
公开(公告)日：1999-01-13
申请号：EP97939622.0
申请日：1997-08-28
发明人： GODSCHALX, James, P. , ROMER, Duane, R. , SO, Ying, Hung , LYSENKO, Zenon , MILLS, Michael, E. , BUSKE, Gary, R. , TOWNSEND, Paul, H., III , SMITH, Dennis, W., Jr. , MARTIN, Steven, J. , DEVRIES, Robert, A.
IPC分类号： C08G61
CPC分类号： C08G61/10 , C08G2261/312
摘要： An oligomer, uncured polymer or cured polymer comprising the reaction product of one or more polyfunctional compounds containing two or more cyclopentadienone groups and at least one polyfunctional compound containing two or more aromatic acetylene groups wherein at least some of the polyfunctional compounds contain three or more reactive groups. Such oligomers and uncured polymers may be cured to form cured polymers which are useful as dielectrics in the microelectronics industry, especially for dielectrics in integrated circuits.
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