-
1.发明公开LOW DIELECTRIC CONSTANT POLYMERS HAVING GOOD ADHESION AND TOUGHNESS AND ARTICLES MADE WITH SUCH POLYMERS 审中-公开以较低的总介电常数GOOD责任和强度聚合物和文章制成品
公开(公告)号：EP1157059A1
公开(公告)日：2001-11-28
申请号：EP99964308.3
申请日：1999-12-21
CPC分类号： C08G61/10 , C08G2261/312 , H01L23/49894 , H01L23/5329 , H01L2924/0002 , H05K1/0326 , H01L2924/00
摘要： A cured polyphenylene polymer having a glass transition temperature no greater than 465 °C. An integrated circuit article having a fracture toughness as determined by the modified edge liftoff test of at least 0.3 MPa-M1/2.
-
公开(公告)号：EP0889920B1
公开(公告)日：2002-02-13
申请号：EP97939622.3
申请日：1997-08-28
发明人： GODSCHALX, James, P. , ROMER, Duane, R. , SO, Ying, Hung , LYSENKO, Zenon , MILLS, Michael, E. , BUSKE, Gary, R. , TOWNSEND, Paul, H., III , SMITH, Dennis, W., Jr. , MARTIN, Steven, J. , DEVRIES, Robert, A.
IPC分类号： C08G61/10
CPC分类号： C08G61/10 , C08G2261/312
-
3.发明授权ETHYNYL SUBSTITUTED AROMATIC COMPOUNDS, SYNTHESIS, POLYMERS AND USES THEREOF 失效WITH乙炔基取代的芳香族化合物，的合成法及其衍生物聚合物及其用途
公开(公告)号：EP0854849B1
公开(公告)日：2001-10-31
申请号：EP96929953.6
申请日：1996-09-11
IPC分类号： C07C22/08 , C07C15/54 , C07C13/567 , C07C43/285 , C08G61/00
CPC分类号： C08G61/00 , C07C13/567 , C07C15/54 , C07C17/263 , C07C22/08 , C07C43/285 , C07C321/30 , C07C2603/18 , C07F9/5325
-
公开(公告)号：EP0386141B1
公开(公告)日：1995-01-11
申请号：EP89900478.2
申请日：1988-11-07
IPC分类号： C07C255/50 , C07C255/51 , C07C261/00
CPC分类号： C07C261/02 , C08G73/0655
摘要： Phenyl cyanates substituted at both ortho positions and further substituted with at least one halo at the meta or para positions are prepared. They enhance ignition resistance, fire retardance, and toughness of polytriazines when added in varying amounts to polycyanate monomers before cure.
-
公开(公告)号：EP0386141A1
公开(公告)日：1990-09-12
申请号：EP89900478.0
申请日：1988-11-07
CPC分类号： C07C261/02 , C08G73/0655
摘要： Sont préparés des cyanates de phényle substitués aux deux positions ortho, et également substitués avec au moins un halo aux positions méta ou para. Ils augmentent la résistance à l'inflammabilité, la résistance au feu ainsi que celle des polytriazines lorsqu'on les ajoute dans des quantités variables à des monomères de polycyanates avant le durcissement.
-
6.发明公开A COMPOSITION CONTAINING A CROSS-LINKABLE MATRIX PRECURSOR AND A PORAGEN, AND A POROUS MATRIX PREPARED THEREFROM 有权A组合含有可交联MATRIXPERCURSOR和多孔结构制作材料及由其制成的多孔基质
公开(公告)号：EP1141128A1
公开(公告)日：2001-10-10
申请号：EP99962822.5
申请日：1999-11-22
发明人： BRUZA, Kenneth, J. , GODSCHALX, James, P. , SHAFFER, Edward, O., II , SMITH, Dennis, W., Jr. , TOWNSEND, Paul, H., III , BOUCK, Kevin, J. , NIU, Qing, Shan, J.
CPC分类号： H01L21/02126 , C08J9/26 , C08J2365/00 , C08L25/06 , C08L65/00 , H01L21/02118 , H01L21/02203 , H01L21/02282 , H01L21/312 , C08L2666/04 , C08L25/00 , C08L2666/06
摘要： A suitable cross-linkable matrix precursor and a poragen can be treated to form a porous cross-linked matrix having a Tg of greater than 300° C. The porous matrix material has a lower dielectric constant than the corresponding non-porous matrix material, making the porous matrix material particularly attractive for a variety of electronic applications including integrated circuits, multichip modules, and flat panel display devices.
摘要翻译： 合适的可交联基体前体和致孔剂可以被处理，以形成具有大于300℃的多孔性基体材料具有比相应的非多孔基质材料更低的介电常数，使得Tg的多孔交联的基质 多孔基体材料用于各种电子应用，包括集成电路，多芯片模块，和平板显示装置特别有吸引力的。
-
公开(公告)号：EP0889920A1
公开(公告)日：1999-01-13
申请号：EP97939622.0
申请日：1997-08-28
发明人： GODSCHALX, James, P. , ROMER, Duane, R. , SO, Ying, Hung , LYSENKO, Zenon , MILLS, Michael, E. , BUSKE, Gary, R. , TOWNSEND, Paul, H., III , SMITH, Dennis, W., Jr. , MARTIN, Steven, J. , DEVRIES, Robert, A.
IPC分类号： C08G61
CPC分类号： C08G61/10 , C08G2261/312
摘要： An oligomer, uncured polymer or cured polymer comprising the reaction product of one or more polyfunctional compounds containing two or more cyclopentadienone groups and at least one polyfunctional compound containing two or more aromatic acetylene groups wherein at least some of the polyfunctional compounds contain three or more reactive groups. Such oligomers and uncured polymers may be cured to form cured polymers which are useful as dielectrics in the microelectronics industry, especially for dielectrics in integrated circuits.
-
8.发明公开ETHYNYL SUBSTITUTED AROMATIC COMPOUNDS, SYNTHESIS, POLYMERS AND USES THEREOF 失效与乙炔基取代的芳烃合成方法FOR THEIR及其衍生物聚合物及其用途
公开(公告)号：EP0854849A1
公开(公告)日：1998-07-29
申请号：EP96929953.0
申请日：1996-09-11
CPC分类号： C08G61/00 , C07C13/567 , C07C15/54 , C07C17/263 , C07C22/08 , C07C43/285 , C07C321/30 , C07C2603/18 , C07F9/5325
摘要： Compounds of ethynyl aromatic compounds having structure (I), wherein each Ar is an aromatic group of inertly-substituted aromatic group; each R is independently hydrogen, an alkyl, aryl or inertly-substituted alkyl or aryl group; L is a covalent bond or a group which links one Ar to at least one other Ar; n and m are integers of at least 2; and q is an integer of at least 1, form polymers which have high thermal stability. The monomers are useful for coating a wide variety of substances such as dielectric coatings where high thermal resistance is desirable including electronic components such as computer chips.
摘要翻译： 乙炔基芳族化合物的化合物形式，其具有高的热稳定性的聚合物。 单体是用于涂布多种物质有用：例如介电涂层，其中高耐热性是理想的，包括电子元件：如计算机芯片。
-
-
-
-
-
-
-
搜索结果
8 条记录 (耗时 0.014 秒)
