公开(公告)号：EP1563573A2

公开(公告)日：2005-08-17

申请号：EP03790027.1

申请日：2003-11-18

Applicant: THE SIEMON COMPANY

Inventor： CELELLA, Brian ,  PAGLIARULO, Vito ,  MULLIN, Daniel

IPC: H01R12/04

CPC classification number: H05K1/0248 ,  H05K1/0228 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/09781 ,  H05K2201/0979 ,  H05K2201/10189

Abstract: A printed circuit board (16) providing crossatalk compensation. The printed circuit board includes first plated through holes (41-48) for receiving a first connecting component and second plated through holes (51-58) for receiving a second connecting component. A signal carrying trace transmits a signal from one of the first plated through hole to one of the second plated through holes. A phase delay control trace (60) is in electrical connection with one of the first plated through holes. The phase delay control trace (60) affects phase delay of the signal from the one of the first plated through holes to the one of the second plated through holes.

Abstract translation: 提供交叉阻滞补偿的印刷电路板（16）。 印刷电路板包括用于接收第一连接部件的第一电镀通孔（41-48）和用于接收第二连接部件的第二电镀通孔（51-58）。 信号承载迹线将来自第一电镀通孔中的一个的信号传输至第二电镀通孔中的一个。 相位延迟控制轨迹（60）与第一电镀通孔中的一个电连接。 相位延迟控制迹线（60）影响从第一电镀通孔之一到第二电镀通孔之一的信号的相位延迟。