公开(公告)号：EP2890417A4

公开(公告)日：2016-04-27

申请号：EP13832936

申请日：2013-08-30

申请人： THORATEC CORP

发明人： SCHIMPF SAMUEL ,  MCCHRYSTAL MARK ,  STARK JOSEPH C III ,  SIEBENHAAR ANDRE

IPC分类号： A61M1/10

CPC分类号： A61M1/1086 ,  A61M1/101 ,  A61M1/1012 ,  A61M1/1015 ,  A61M1/1017 ,  A61M1/1031 ,  A61M1/1036 ,  A61M1/12 ,  A61M1/122 ,  A61M2205/3317 ,  A61M2205/3334 ,  A61M2205/3365 ,  A61M2207/00 ,  F04D13/064 ,  F04D15/0077 ,  G01B7/003 ,  G01B7/30 ,  G01D5/142 ,  G01R33/072 ,  H05K1/028 ,  H05K1/119 ,  H05K1/189 ,  H05K3/30 ,  H05K3/303 ,  H05K3/32 ,  H05K3/4691 ,  H05K2201/052 ,  H05K2201/10151 ,  Y10T29/49009 ,  Y10T29/49128

摘要： A molded interconnect device can carry a Hall sensor for transducing a position of a rotor of the implantable blood pump. The molded interconnect device includes one or more integrated electronic circuit traces configured to electrically connect the hall sensor with a printed circuit board of the implantable blood pump, and the molded interconnect device is configured to be mounted to the printed circuit board.