摘要:
A plasma device includes a slot antenna (30) for supplying a high frequency electromagnetic field (F) supplied through a feeding part into a processing vessel (11). The feeding part has a cavity (35) for forming a resonator and converting the fed high frequency electromagnetic field (F) into a rotating electromagnetic field and supplying the rotating electromagnetic field to the slot antenna (30).
摘要:
In a plasma processing system, microwaves generated by a microwave generator (86) are guided to a plane antenna (62) to introduce the microwaves, which are attenuated exponentially, into a processing vessel (22) in which an object to be processed (W) is subjected to a plasma process. A microwave absorbing means (96) is disposed in a peripheral portion of the plane antenna (62) to absorb the microwaves propagating from a central portion of the plane antenna and to control the amount of reflected microwave. Thus the amount of the microwaves reflected toward the central portion of the plane antenna (62) by a peripheral portion of the plane antenna (62) is reduced to some extent so that electromagnetic field intensity is distributed uniformly.
摘要:
Guide members (37) extending from the microwave entrance to a ring member (34) are arranged in the direction of propagation of microwave in a radial waveguide. The guide members (37) contribute to prevention of complex electromagnetic mode due to a microwave reflected from the peripheral portion of the radial waveguide. Therefore, a uniform plasma can be produced because the radiation into the process chamber is uniform even not by disposing any electromagnetic absorbing member at the peripheral portion of the radial waveguide. Since the microwave reflected from the peripheral portion of the radial waveguide can be used to produce a plasma if any electromagnetic absorbing member is not disposed, the plasma can be produced efficiently, and excessive heat is not generated.
摘要:
The present invention aims to decrease reflected waves in a vacuum chamber to suppress standing waves, thereby easily controlling a plasma density so that uniform treatment can be performed. An electromagnetic wave absorber 6 composed of a resistor such as carbon, a dielectric having a large dielectric loss, such as water, or a magnetic material such as ferrite-based ceramic, or a combination of these, is provided on an inner wall surface of a first vacuum chamber 21. Microwaves introduced from a waveguide 25 into the first vacuum chamber 21 via a transmissive window 23 are absorbed to the electromagnetic wave absorber 6 to suppress reflected waves, whereby a plasma density distribution with a nearly planned pattern is easily formed at an ECR point.
摘要:
A gas supply part (51) is provided in a vacuum vessel (2) so as to surround a region facing a wafer (10) so that a process gas is jetted out from the gas supply part (51) toward the wafer (10). Plasma producing microwaves are turned on and off at a frequency of 30 Hz to 500 Hz to be intermittently supplied from a radio-frequency power generating part (6) into the vacuum vessel (2). Thus, the gas remaining on the wafer (10) is replaced with a new process gas while the microwaves are turned on. Thus, the difference in degree of dissociation between the central portion and peripheral portion of the wafer (10) is not so great to uniformly carry out a plasma process.