公开(公告)号：EP2902846A4

公开(公告)日：2016-06-01

申请号：EP12884755

申请日：2012-09-24

Applicant: TORAY INDUSTRIES

Inventor： MASUDA YUKI ,  KAMEMOTO SATOSHI ,  ONISHI HIROYUKI ,  TOMIKAWA MASAO

IPC: G03F7/004 ,  G03F7/023

CPC classification number: G03F7/039 ,  G03F7/0226 ,  G03F7/0233 ,  G03F7/40

Abstract: Disclosed is a positive-type photosensitive resin composition including (a) an alkali-soluble polyimide, (b) a compound having two or more epoxy groups in a molecule, and (c) a photo acid generator, wherein the content of the compound having two or more epoxy groups in a molecule (b) is within a range of 5 to 50 parts by weight based on 100 parts by weight of the alkali-soluble polyimide (a). The present invention provides a positive-type photosensitive resin composition capable of obtaining a high-resolution cured film which exhibits low warpage and also does not cause pattern embedment by reflow during a heating treatment at a low temperature of 200°C or lower.