公开(公告)号：EP2865702A4

公开(公告)日：2016-01-27

申请号：EP13887799

申请日：2013-12-26

Applicant: TORAY INDUSTRIES

Inventor： WAKITA JUNJI ,  JO YUKARI ,  TOMIKAWA MASAO

IPC: C08G73/10 ,  B32B27/34 ,  G02B5/20 ,  H01L51/50 ,  H05B33/02 ,  H05B33/10

CPC classification number: C08G73/1007 ,  B29D11/00634 ,  B29K2079/08 ,  B29K2995/002 ,  B29K2995/0026 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1053 ,  C08G73/106 ,  C08G73/1064 ,  C08G73/1067 ,  C08G73/1071 ,  C08G73/1082 ,  C09D179/08 ,  G02B5/223 ,  G02B5/287 ,  H01L27/3241 ,  H01L51/0024 ,  H01L51/0097 ,  H01L51/52

公开(公告)号：EP1909142A4

公开(公告)日：2010-11-10

申请号：EP06732022

申请日：2006-04-18

Applicant: TORAY INDUSTRIES

Inventor： YUBA TOMOYUKI ,  FUJITA YOJI ,  TOMIKAWA MASAO

IPC: G03F7/085 ,  C08K5/544 ,  G03F7/075

CPC classification number: G03F7/0751 ,  C08K5/0025 ,  C08K5/544 ,  G03F7/0045 ,  G03F7/0226 ,  G03F7/0755 ,  Y10S430/106 ,  Y10S430/111 ,  Y10S430/115 ,  Y10S430/117

公开(公告)号：EP1508837A4

公开(公告)日：2009-11-04

申请号：EP03733112

申请日：2003-05-28

Applicant: TORAY INDUSTRIES

Inventor： MIYOSHI KAZUTO ,  OKUDA RYOJI ,  TOMIKAWA MASAO

IPC: G03F7/037 ,  G03F7/004 ,  G03F7/022 ,  G03F7/023 ,  H01L27/32 ,  H01L51/52 ,  H05B33/10 ,  H05B33/14

CPC classification number: G03F7/0048 ,  G03F7/0233 ,  G03F7/037 ,  H01L27/3295 ,  H01L51/5253

公开(公告)号：EP1365289A4

公开(公告)日：2006-09-27

申请号：EP02700653

申请日：2002-02-21

Applicant: TORAY INDUSTRIES

Inventor： SUWA MITSUHITO ,  MIYOSHI KAZUTO ,  TOMIKAWA MASAO

IPC: G03F7/022 ,  G03F7/023 ,  G03F7/037 ,  G03F7/004 ,  H05B33/14 ,  H05K3/06

CPC classification number: G03F7/0226 ,  G03F7/0233 ,  Y10S430/107

Abstract: A precursor composition for an alkali-developable positive photosensitive resin. It is characterized by comprising the following (a), (b1) or (b2), and (c). (a) A polyamic acid ester and/or polyamic acid polymer which are soluble in an aqueous alkali solution. (b1) A heat-crosslinkable compound which contains a phenolic hydroxyl group and a methylol group substituted by an organic group R and represented by the general formula (1) (provided that R is not hydrogen) (1) (b2) A heat-crosslinkable compound which contains a urea-derived organic group substituted by organic groups R and represented by the general formula (2). (2) (c) An esterified quinone diazide compound.

公开(公告)号：EP1132773A4

公开(公告)日：2002-09-18

申请号：EP00931608

申请日：2000-05-30

Applicant: TORAY INDUSTRIES

Inventor： TOMIKAWA MASAO ,  SUWA MITSUHITO ,  FUJITA YOJI

IPC: C08G73/10 ,  G03F7/022 ,  G03F7/023 ,  C08L77/06 ,  C08L79/08 ,  G03F7/037

CPC classification number: G03F7/0233 ,  C08G73/10 ,  G03F7/022

Abstract: A positive-type photosensitive polyimide precursor composition comprising a hydroxylated polyimide precursor and the following photosensitive compound (a) or (b): (a) an ester of a phenol having a dipole moment of 0.1 to 1.6 D with naphthoquinone diazide sulfonic acid, or (b) a mixture or ester of a phenol represented by general formula (8) with naphthoquinone diazide sulfonic acid: wherein R , R , R and R are each alkyl or the like; R is hydroxyl or the like; aa, bb, cc, and dd are each an integer of 0 to 3; and ee is an integer of 1 to 3.

Abstract translation: 本发明涉及一种正型感光性树脂前体组合物，其特征在于，其含有以下述通式（1）表示的结构单元作为主要成分的聚合物，此外，其具有满足以下条件（ a）和/或（b）。 本发明提供了一种可显影光敏组合物。 （a）包括萘醌二叠氮磺酸的酯和偶极矩0.1至1.6德拜的酚化合物（b）包括由通式（8）表示的酚化合物和萘醌二叠氮磺酸和/或 由通式（8）表示的酚化合物和萘醌二叠氮磺酸的酯（通式（1）中，R 1表示具有至少两个碳原子的二价至八价有机基团， 2>表示具有至少两个碳原子的二价至六价有机基团，R 3表示氢或具有1至10个碳的有机基团，n为10至100,000的整数，m为整数 范围0〜2，p和q为0〜4的整数，p和q不同时为0）（式中，R 23，R 24，R 26 >和R 27各自表示氢原子或C 1-8烷基，烷氧基，羧基或酯基，至少一个R 25是羟基 组，而其余表示氢原子和C 1-8烷基。 aa，bb，cc和dd表示0〜3的整数。但aa +bb≤5，bb +dd≤5，aa + bb> 0e表示1〜3的整数。

公开(公告)号：EP3187559A4

公开(公告)日：2018-07-18

申请号：EP15830699

申请日：2015-08-05

Applicant: TORAY INDUSTRIES

Inventor： ARIMOTO SHINJI ,  FUJIWARA TAKENORI ,  TOMIKAWA MASAO

IPC: C09J179/08 ,  C08G73/10 ,  C08K5/544 ,  C08L79/08 ,  C08L83/04 ,  C09J7/00 ,  C09J11/06 ,  C09J183/04 ,  C11D7/50 ,  H01L21/02 ,  H01L21/304

CPC classification number: H01L21/6835 ,  B32B7/12 ,  B32B43/006 ,  B32B2457/14 ,  C08G73/10 ,  C08K5/544 ,  C08L79/08 ,  C08L83/04 ,  C09J5/00 ,  C09J7/00 ,  C09J11/06 ,  C09J179/08 ,  C09J183/04 ,  C09J183/14 ,  C09J2203/10 ,  C09J2205/302 ,  C09J2400/10 ,  C09J2483/00 ,  C11D7/50 ,  C11D7/5013 ,  C11D7/5022 ,  H01L21/02 ,  H01L21/0206 ,  H01L21/304 ,  H01L21/76898 ,  H01L2221/68327 ,  H01L2221/68381 ,  Y02P20/582

Abstract: The present invention provides: a temporary-bonding adhesive having excellent heat resistance, whereby a semiconductor circuit formation substrate and a support substrate can be bonded by a single type of adhesive layer, the adhesive force thereof does not change over the course of steps for manufacturing a semiconductor device or the like, and the adhesive can subsequently be easily de-bonded at room temperature under mild conditions; and a method for manufacturing a semiconductor device using the temporary-bonding adhesive. The present invention is a temporary-bonding adhesive characterized by being a polyimide copolymer having at least an acid dianhydride residue and a diamine residue, the diamine residue including both of (A1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 1 to 15, and (B1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 16 to 100, the polyimide copolymer containing 40-99.99 mol% of the (A1) residue and 0.01-60 mol% of the (B1) residue.

公开(公告)号：EP3112394A4

公开(公告)日：2017-08-16

申请号：EP15754960

申请日：2015-02-24

Applicant: TORAY INDUSTRIES

Inventor： TOMIKAWA MASAO ,  WATANABE TAKUO ,  LEE CHUNGSEO

IPC: C08G73/10 ,  B32B7/12 ,  B32B27/28 ,  B32B27/34 ,  C08G77/455 ,  C08K5/06 ,  C08L79/08 ,  C09J7/00 ,  C09J7/02 ,  C09J11/06 ,  C09J179/08 ,  H01L21/304 ,  H01L21/683 ,  H01L23/29 ,  H01L23/31

CPC classification number: H01L21/6836 ,  B32B7/12 ,  B32B27/281 ,  B32B2307/304 ,  B32B2307/306 ,  B32B2457/00 ,  B32B2457/14 ,  C08G73/1039 ,  C08G73/1046 ,  C08G73/106 ,  C08G73/1082 ,  C08G77/455 ,  C08G2170/00 ,  C08L61/28 ,  C09J7/28 ,  C09J7/29 ,  C09J179/08 ,  C09J2203/326 ,  H01L21/304 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Provided are: a polyimide resin which has high heat resistance and is capable of uniformly performing temporary adhesion over a large area with no void or the like; a resin composition using the same; and a laminated film. The polyimide resin of the present invention has at least an acid anhydride residue and a diamine residue and contains a residue of a polysiloxane diamine in an amount of not less than 60% by mole in the total amount of the diamine residue.

Abstract translation: 本发明提供一种聚酰亚胺树脂，其具有高耐热性并且能够在没有空隙等的大面积上均匀地执行临时粘合; 使用其的树脂组合物; 和层压膜。 本发明的聚酰亚胺树脂至少具有酸酐残基和二胺残基，并且在二胺残基的总量中含有不少于60摩尔％的聚硅氧烷二胺残基。

公开(公告)号：EP2902846A4

公开(公告)日：2016-06-01

申请号：EP12884755

申请日：2012-09-24

Applicant: TORAY INDUSTRIES

Inventor： MASUDA YUKI ,  KAMEMOTO SATOSHI ,  ONISHI HIROYUKI ,  TOMIKAWA MASAO

IPC: G03F7/004 ,  G03F7/023

CPC classification number: G03F7/039 ,  G03F7/0226 ,  G03F7/0233 ,  G03F7/40

Abstract: Disclosed is a positive-type photosensitive resin composition including (a) an alkali-soluble polyimide, (b) a compound having two or more epoxy groups in a molecule, and (c) a photo acid generator, wherein the content of the compound having two or more epoxy groups in a molecule (b) is within a range of 5 to 50 parts by weight based on 100 parts by weight of the alkali-soluble polyimide (a). The present invention provides a positive-type photosensitive resin composition capable of obtaining a high-resolution cured film which exhibits low warpage and also does not cause pattern embedment by reflow during a heating treatment at a low temperature of 200°C or lower.

公开(公告)号：EP2881417A4

公开(公告)日：2016-01-27

申请号：EP13824982

申请日：2013-07-30

Applicant: TORAY INDUSTRIES

Inventor： MIYAZAKI DAICHI ,  TOMIKAWA MASAO

IPC: C08G73/10

CPC classification number: C08G69/32 ,  C03C17/32 ,  C08G73/1042 ,  C08G73/1053 ,  C08G73/1067 ,  C08G73/1071 ,  C08J5/18 ,  C09D179/08 ,  Y10T428/31623

Abstract: An object is to provide a polyamic acid resin composition that can form a varnish with a low viscosity and serves to produce, through curing, coat film with good mechanical characteristics. Another object is to provide a polyamic acid resin composition in which the acid anhydride terminal group is low in reactivity with diamine and which can give a varnish that does not suffer significant precipitation of diamine. These objects can be met by a polyamic acid resin composition that contains: (a) polyamic acid and (b) a compound as represented by chemical formula (1). (In Chemical formula (1), Z is a di- or higher-valent organic group containing 2 or more carbon atoms, V is a structure as represented by chemical formula (2), and k is an integer of 2 or more.) (In In Chemical formula (2), ´ represents oxygen or sulfur atom and W represents an electron-withdrawing group, and R 11 and R 12 represent independently a hydrogen atom or a hydrocarbon group containing 1 to 10 carbon atoms.

公开(公告)号：EP2902847A4

公开(公告)日：2016-04-27

申请号：EP13840268

申请日：2013-09-11

Applicant: TORAY INDUSTRIES

Inventor： ONISHI HIROYUKI ,  MASUDA YUKI ,  TOMIKAWA MASAO

IPC: G03F7/023 ,  C08G73/10 ,  C08L79/08 ,  G03F7/004

CPC classification number: G03F7/0233 ,  C08G73/1042 ,  C08G73/105 ,  C08G73/1075 ,  C08G73/1082 ,  C08G73/14 ,  C09D179/08 ,  G03F7/0226 ,  G03F7/40 ,  C08K5/22 ,  C08K5/357

Abstract: The present invention provides a positive-type photosensitive resin composition capable of obtaining a cured film which exhibits low warpage, and is also excellent in high sensitivity and high resolution during firing at a lower temperature of 250°C or lower. Disclosed is a positive-type photosensitive resin composition including (a) a polyimide resin including a structural unit represented by the general formula (1) and a structural unit represented by the general formula (2), and (b) a quinonediazide compound, wherein the polyimide resin including a structural unit represented by the general formula (1) and a structural unit represented by the general formula (2) has an imidation ratio of 85% or more, and also a ratio of the structural unit represented by the general formula (1) to the structural unit represented by the general formula (2) is within a range of 30:70 to 90:10, in which X 1 in the general formula (1) represents a tetracarboxylic acid residue including 1 to 4 aromatic rings, and Y 1 represents an aromatic diamine residue including 1 to 4 aromatic rings, and in which X 2 in the general formula (2) represents a tetracarboxylic acid residue including 1 to 4 aromatic rings, and Y 2 represents a diamine residue including at least two or more alkylene glycol units in the main chain.