Abstract:
A positive photosensitive resin precursor composition characterized by comprising (a) a polymer consisting mainly of structural units bonded to each other in the manner shown by general formula (1) and (b) a photo-acid generator, being capable of forming a pattern through light irradiation and subsequent development, and having a total carboxyl group content of 0.02 to 2.0 mmol per g of the polymer. It provides a photosensitive resin composition which is capable of alkali development and is highly sensitive. (R represents a tri- to octavalent C2+ organic group; R represents a di- to hexavalent C2+ organic group; R represents hydrogen or a C1-20 organic group; n is an integer of 3 to 100,000; m is 1 or 2; and p and q each is an integer of 0 to 4, provided that p+q>0).
Abstract:
Disclosed is a directly imageable waterless lithographic printing plate precursor including at least a heat sensitive layer and a silicone rubber layer formed on a substrate in this order, wherein the heat sensitive layer contains at least a novolac resin, a polyurethane and a light-to-heat conversion material, and also has a phase separation structure including at least a phase containing a novolac resin and a phase containing a polyurethane. The present invention provides a directly imageable waterless lithographic printing plate precursor which has high sensitivity and is less likely to cause blister, that is, having wide latitude.
Abstract:
The objective is to provide a direct drawing-type waterless lithographic printing original plate which is highly sensitive and is not susceptible to formation of blisters, namely a direct drawing-type waterless lithographic printing original plate which has a wide latitude. Provided is a direct drawing-type waterless lithographic printing original plate which has at least a heat-sensitive layer and a silicone rubber layer on a substrate in this order. The direct drawing-type waterless lithographic printing original plate is characterized in that the heat-sensitive layer contains non-photosensitive particles and the average particle diameter of the non-photosensitive particles is not less than 1/2 of the average film thickness of a portion of the heat-sensitive layer where the non-photosensitive particles are not present.