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公开(公告)号:EP1779438B2
公开(公告)日:2019-07-31
申请号:EP05755884.3
申请日:2005-06-22
发明人: SUGIMOTO, Masahiro , KACHI, Tetsu , NAKANO, Yoshitaka , UESUGI, Tsutomu , UEDA, Hiroyuki , SOEJIMA, Narumasa
IPC分类号: H01L29/778 , H01L21/335
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公开(公告)号:EP1815523B1
公开(公告)日:2016-09-14
申请号:EP05828962.0
申请日:2005-11-14
IPC分类号: H01L29/812 , H01L29/78 , H01L29/778 , H01L29/06 , H01L29/08 , H01L29/20 , H01L29/41
CPC分类号: H01L29/7802 , H01L29/0649 , H01L29/0653 , H01L29/0692 , H01L29/0696 , H01L29/0843 , H01L29/0847 , H01L29/0891 , H01L29/2003 , H01L29/41 , H01L29/778 , H01L29/7788 , H01L29/8122
摘要: A semiconductor device is provided with a drain electrode 22, a semiconductor base plate 32, an electric current regulation layer 42 covering a part of a surface of the semiconductor base plate 32 and leaving a non-covered surface 55 at the surface of the semiconductor base plate 32, a semiconductor layer 50 covering a surface of the electric current regulation layer 42, and a source electrode 62 formed at a surface of the semiconductor layer 50. A drift region 56, a channel forming region 54, and a source region 52 are formed within the semiconductor layer 50. The drain electrode 22 is connected to a first terminal of a power source, and the source electrode 62 is connected to a second terminal of the power source. With this semiconductor layer 50, it is possible to increase withstand voltage or reduce the occurrence of current leakage.
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公开(公告)号:EP1842238B1
公开(公告)日:2010-07-21
申请号:EP06701454.8
申请日:2006-01-20
IPC分类号: H01L29/778 , H01L29/45 , H01L29/423 , H01L21/335 , H01L29/20
CPC分类号: H01L29/452 , H01L29/2003 , H01L29/42316 , H01L29/66462 , H01L29/7787
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公开(公告)号:EP1842238A2
公开(公告)日:2007-10-10
申请号:EP06701454.8
申请日:2006-01-20
IPC分类号: H01L29/778
CPC分类号: H01L29/452 , H01L29/2003 , H01L29/42316 , H01L29/66462 , H01L29/7787
摘要: A semiconductor device 10 comprises a heterojunction between a lower semiconductor layer 26 made of p-type gallium nitride and an upper semiconductor layer 28 made of n-type AlGaN, wherein the upper semiconductor layer 28 has a larger band gap than the lower semiconductor layer 26. The semiconductor device 10 further comprises a drain electrode 32 formed on a portion of a top surface of the upper semiconductor layer 28, a source electrode 34 formed on a different portion of the top surface of the upper semiconductor layer 28, and a gate electrode 36 electrically connected to the lower semiconductor layer 26. The semiconductor device 10 can operate as normally-off.
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