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公开(公告)号:EP3467876A1
公开(公告)日:2019-04-10
申请号:EP18196700.1
申请日:2018-09-25
发明人: TOMITA, Hidemoto , UEDA, Hiroyuki , MORI, Tomohiko
IPC分类号: H01L29/739 , H01L29/78 , H01L29/20 , H01L29/08 , H01L21/336
摘要: A nitride semiconductor apparatus includes a nitride semiconductor layer (12), a gate insulating film (28), a source electrode (20), a drain electrode (30), and a gate electrode (26). The nitride semiconductor layer (12) includes a first body layer, a second body layer, a drift layer (44), a first source layer, and a second source layer. The drift layer (44) includes a first drift layer (46) that extends from a position in contact with a bottom surface of the first body layer to a position in contact with a bottom surface of the second body layer, and an electric field relaxation layer (48) that is in contact with a lower end portion of a side surface of the first body layer and a lower end portion of a side surface of the second body layer, is in contact with the first drift layer (46), and has a second conduction type impurity concentration lower than that of the first drift layer (46).
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公开(公告)号:EP1815523B1
公开(公告)日:2016-09-14
申请号:EP05828962.0
申请日:2005-11-14
IPC分类号: H01L29/812 , H01L29/78 , H01L29/778 , H01L29/06 , H01L29/08 , H01L29/20 , H01L29/41
CPC分类号: H01L29/7802 , H01L29/0649 , H01L29/0653 , H01L29/0692 , H01L29/0696 , H01L29/0843 , H01L29/0847 , H01L29/0891 , H01L29/2003 , H01L29/41 , H01L29/778 , H01L29/7788 , H01L29/8122
摘要: A semiconductor device is provided with a drain electrode 22, a semiconductor base plate 32, an electric current regulation layer 42 covering a part of a surface of the semiconductor base plate 32 and leaving a non-covered surface 55 at the surface of the semiconductor base plate 32, a semiconductor layer 50 covering a surface of the electric current regulation layer 42, and a source electrode 62 formed at a surface of the semiconductor layer 50. A drift region 56, a channel forming region 54, and a source region 52 are formed within the semiconductor layer 50. The drain electrode 22 is connected to a first terminal of a power source, and the source electrode 62 is connected to a second terminal of the power source. With this semiconductor layer 50, it is possible to increase withstand voltage or reduce the occurrence of current leakage.
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公开(公告)号:EP1779438B2
公开(公告)日:2019-07-31
申请号:EP05755884.3
申请日:2005-06-22
发明人: SUGIMOTO, Masahiro , KACHI, Tetsu , NAKANO, Yoshitaka , UESUGI, Tsutomu , UEDA, Hiroyuki , SOEJIMA, Narumasa
IPC分类号: H01L29/778 , H01L21/335
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公开(公告)号:EP3352203A1
公开(公告)日:2018-07-25
申请号:EP17206608.6
申请日:2017-12-12
IPC分类号: H01L21/336 , H01L29/78 , H01L29/16 , H01L29/20
CPC分类号: H01L29/7802 , H01L21/0254 , H01L21/26546 , H01L21/30612 , H01L21/30625 , H01L21/308 , H01L21/76805 , H01L21/76895 , H01L23/535 , H01L29/063 , H01L29/1095 , H01L29/1608 , H01L29/2003 , H01L29/66068 , H01L29/66333 , H01L29/66522 , H01L29/66712 , H01L29/7395
摘要: A switching element (10) includes a semiconductor substrate (12) that includes a first n-type semiconductor layer (44), a p-type body layer (42) constituted by an epitaxial layer, and a second n-type semiconductor layer (40) separated from the first n-type semiconductor layer (44) by the body layer (42), a gate insulating film (28) that covers a range across the surface of the first n-type semiconductor layer (44), the surface of the body layer (42), and the surface of the second n-type semiconductor layer (40), and a gate electrode (26) that faces the body layer (42) through the gate insulating film (28). An interface (50) between the first n-type semiconductor layer (44) and the body layer (42) includes an inclined surfaces (52,63) and in the bottom of the body layer (42) a surface parallel with the upper surface (12a). The inclined surfaces (52,63) is inclined such that the depth of the body layer (42) increases as a distance from two opposite ends end (42a) of the body layer (42) increases in a horizontal direction towards the middle of the body layer. An inclined surface (52,63) is disposed below the gate electrode (26).
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公开(公告)号:EP1842238B1
公开(公告)日:2010-07-21
申请号:EP06701454.8
申请日:2006-01-20
IPC分类号: H01L29/778 , H01L29/45 , H01L29/423 , H01L21/335 , H01L29/20
CPC分类号: H01L29/452 , H01L29/2003 , H01L29/42316 , H01L29/66462 , H01L29/7787
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公开(公告)号:EP1842238A2
公开(公告)日:2007-10-10
申请号:EP06701454.8
申请日:2006-01-20
IPC分类号: H01L29/778
CPC分类号: H01L29/452 , H01L29/2003 , H01L29/42316 , H01L29/66462 , H01L29/7787
摘要: A semiconductor device 10 comprises a heterojunction between a lower semiconductor layer 26 made of p-type gallium nitride and an upper semiconductor layer 28 made of n-type AlGaN, wherein the upper semiconductor layer 28 has a larger band gap than the lower semiconductor layer 26. The semiconductor device 10 further comprises a drain electrode 32 formed on a portion of a top surface of the upper semiconductor layer 28, a source electrode 34 formed on a different portion of the top surface of the upper semiconductor layer 28, and a gate electrode 36 electrically connected to the lower semiconductor layer 26. The semiconductor device 10 can operate as normally-off.
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