公开(公告)号：EP3742871A1

公开(公告)日：2020-11-25

申请号：EP19741873.4

申请日：2019-01-15

申请人： Taiyo Ink Mfg. Co., Ltd.

发明人： SHIINA Touko ,  SATO Kazuya ,  ARAI Yasuaki ,  SHIMAMIYA Mariko

IPC分类号： H05K3/28 ,  B32B15/08 ,  B32B27/00 ,  C08J5/12 ,  C09D201/00 ,  G03F7/004 ,  H05K1/02

摘要： Provided is a curable resin composition in which cracks and peeling do not easily occur in a cured coating film while maintaining adhesiveness with a base material (insulating portion) or a circuit (conductive portion), even in the case of forming a cured coating film having an area where the coating film of the curable resin composition is overlapping on the circuit board. The curable resin composition according to the present invention is a curable resin composition comprising a curable resin, characterized in that, when a cured coating film α comprising a cured product of the curable resin composition is formed on the surface of the base material, the shear strength between the insulating portion and the cured coating film α is referred to as A (MPa); when a cured coating film α comprising a cured product of the curable resin composition is formed on the surface of the conductive portion of the base material, the shear strength between the conductive portion and the cured coating film α is referred to as B (MPa); and when a cured coating film α comprising a cured product of the curable resin composition is formed on the surface of a cured coating film β comprising the cured product of the curable resin composition, the shear strength between the cured coating film α and the cured coating film β is referred to as C (MPa); then A, B and C are all 1 MPa or more and 15 MPa or less; and A and B are 0.5 times or more and 5 times or less than C.