公开(公告)号：EP3067374A4

公开(公告)日：2017-07-26

申请号：EP14859821

申请日：2014-11-04

申请人： TAIYO INK MFG CO LTD

发明人： SHIMURA MASAYUKI ,  FURUTA YOSHIYUKI ,  YUMOTO MASAO

IPC分类号： C08F20/10 ,  C08F8/14 ,  C08F220/06 ,  C08F220/32 ,  C09D4/00 ,  H05K3/06 ,  H05K3/28

CPC分类号： C09D4/00 ,  C08F8/14 ,  C08F220/06 ,  C08F220/32 ,  C09D11/101 ,  C09D11/30 ,  C09D133/14 ,  H05K1/0313 ,  H05K3/0023 ,  H05K3/064 ,  H05K3/287 ,  H05K2203/0759

摘要： Provided are: a curable composition that shows good adhesion on a printed wiring board, particularly a flexible substrate or the like, and has a high hardness; a resist coating film of the curable composition; and a printed wiring board having a resist pattern of the resist coating film. The curable composition comprises: (A) a photobase generator; (B-1) an epoxy group-containing (meth)acrylate compound or (B-2) a carboxyl group-containing (meth)acrylate compound; (C) a photopolymerization initiator; and (D-1) a thermosetting component (excluding the (B-1) epoxy group-containing (meth)acrylate compound) or (D-2) a thermosetting component (excluding the (B-2) carboxyl group-containing (meth)acrylate compound).

摘要翻译： 本发明提供一种在印刷布线板，特别是柔性基板等上显示良好的密合性且硬度高的固化性组合物， 该可固化组合物的抗蚀剂涂膜; 以及具有抗蚀剂涂布膜的抗蚀剂图案的印刷线路板。 该可固化组合物包含：（A）光产碱剂; （B-1）含环氧基的（甲基）丙烯酸酯化合物或（B-2）含羧基的（甲基）丙烯酸酯化合物; （C）光聚合引发剂; 和（D-2）热固性成分（不含（B-2）含羧基的（甲基）丙烯酸酯化合物）以外的（D-1） ）丙烯酸酯化合物）。

公开(公告)号：EP3054752A1

公开(公告)日：2016-08-10

申请号：EP14849338.0

申请日：2014-09-30

申请人： Taiyo Ink Mfg. Co., Ltd.

发明人： SHIMURA Masayuki ,  FURUTA Yoshiyuki ,  YUMOTO Masao

IPC分类号： H05K3/28 ,  B41M5/00 ,  C08F2/48 ,  C09D4/02 ,  C09D11/30

摘要： Provided are: a curable composition that has excellent flexibility and shows excellent adhesion to both a plastic substrate and a conductor layer; a coating film of the curable composition; and a printed circuit board comprising a pattern-cured coating film obtained from the coating film. The present invention relates to: a curable composition for a printed circuit board, which is characterized by comprising (A) a block copolymer, (B) a hydroxyl group-containing (meth)acrylate compound and (C) a photopolymerization initiator; a coating film obtained by photo-curing the curable composition; and a printed circuit board comprising a resist pattern formed from the coating film.

公开(公告)号：EP1857478A4

公开(公告)日：2008-05-14

申请号：EP06711602

申请日：2006-01-12

申请人： TAIYO INK MFG CO LTD

发明人： USHIKI SHIGERU ,  KUSAMA MASATOSHI ,  MAKITA SHOHEI

IPC分类号： C08F236/20 ,  B41J2/01 ,  B41M5/00 ,  C08F220/02 ,  C08F222/40 ,  C08F226/06 ,  C09D11/00 ,  H05K3/28

CPC分类号： H05K3/285 ,  C08F226/02 ,  C08F236/20 ,  C09D11/101 ,  C09D11/30 ,  H05K3/28 ,  H05K2203/013

摘要： A curable resin composition for ink-jet printing characterized by comprising (A) a bisallylnadiimide compound represented by the following general formula (1): [Chemical formula 1] (1) (wherein R1 represents C2-18 alkyl, aryl, or aralkyl), (B) a bismaleimide compound represented by the following general formula (2): [Chemical formula 2] (2) (wherein R2 represents C2-32 alkyl, aryl, or aralkyl), and (C) a diluent and having a viscosity at 25°C of 150 mPa·s or lower.

公开(公告)号：EP1341039A4

公开(公告)日：2006-09-20

申请号：EP01999859

申请日：2001-11-27

申请人： UNIV KANAGAWA ,  TAIYO INK MFG CO LTD

发明人： NISHIKUBO TADATOMI ,  KAMEYAMA ATSUSHI ,  SASAKI MASAKI ,  KUSAMA MASATOSHI

IPC分类号： C08F2/44 ,  C08F2/50 ,  C08F20/28 ,  C08F283/10 ,  C08F290/02 ,  C08F290/06 ,  C08G65/18 ,  C08G65/332 ,  C08L63/00 ,  C08L71/00 ,  C08L101/00 ,  G03F7/027 ,  G03F7/032 ,  G03F7/038

CPC分类号： G03F7/038 ,  C08F20/28 ,  C08F283/10 ,  C08F290/06 ,  C08F290/061 ,  C08G65/18 ,  C08G65/332 ,  C08L63/00 ,  C08L71/00 ,  G03F7/027 ,  C08L2666/22

摘要： A photocurable and thermosetting resin composition comprising (A) an actinic radiation curable resin bearing one or more structures represented by the general formula (1), (B) a photopolymerization initiator, (C) a diluent, and (D) a thermosetting component: (1) wherein R1 is hydrogen or C¿1-6? alkyl; R?2, R3, and R4¿ are each hydrogen, C¿1-6? alkyl, aryl, aralkyl, cyano, fluoro, or furyl; and X is a polybasic acid anhydride residue.

公开(公告)号：EP1624001A4

公开(公告)日：2006-08-02

申请号：EP04731714

申请日：2004-05-07

申请人： TAIYO INK MFG CO LTD

发明人： KAKINUMA M ,  KUSAMA M ,  USHIKI S

IPC分类号： C08F220/10 ,  B41M5/00 ,  C08F2/00 ,  C08F2/46 ,  C08F10/00 ,  C08F20/00 ,  C09D11/00 ,  C09D11/322 ,  C09D11/324 ,  C09D11/38 ,  H05K3/28

CPC分类号： C09D11/101 ,  H05K3/287 ,  H05K2203/013

摘要： A photocuring/thermosetting inkjet composition contains (A) a monomer having a (meth)acryloyl group and a thermosetting functional group in the molecule, (B) a photoreactive diluent other than the component (A) having a weight-average molecular weight of not more than 700, and (C) a photopolymerization initiator, and has a viscosity of not more than 150 mPa·s at 25˚C. A solder resist pattern is directly drawn on a printed wiring board by an inkjet printer using the above-mentioned composition, and the pattern is primarily cured by irradiation with an active energy beam and then further cured by heat.

公开(公告)号：EP1338624A4

公开(公告)日：2005-08-17

申请号：EP01983799

申请日：2001-11-14

申请人： TAIYO INK MFG CO LTD

发明人： TAKAHASHI RIEKO ,  KIMURA NORIO ,  YODA KYOICHI ,  WATANABE YASUKAZU

IPC分类号： C08G59/50 ,  C08G59/68 ,  C08G63/00 ,  C08L63/00 ,  H05K1/09 ,  H05K3/00 ,  H05K3/40 ,  H05K3/46

CPC分类号： C08L63/00 ,  C08G59/5086 ,  H05K1/095 ,  H05K3/0094 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/0209 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2203/1461 ,  Y10T428/249985

摘要： A liquid thermosetting resin composition comprising (A) an epoxy resin, (B) a curing catalyst, and (C) a filler, which is characterized by exhibiting a viscosity of 1500 dPa s or below at 25°C, a gel time of 300 s or above at a temperature at which the composition exhibits a melt viscosity of 10 dPa s or below, and a gel time of 600 s or below at 130°C. In producing a printed wiring board by forming an interlayer dielectric layer of a resin and a conductive circuit on the surface of a wiring substrate having a conductive circuit pattern including holes, the holes are plugged by filling the holes with the above composition, precuring the resulting composition by heating, abrading and removing the protrusions of the composition from the surface, and curing the remaining composition completely by additional heating. Thus, the via holes or through holes of a printed wiring board can be plugged with good workability.

摘要翻译： 一种液体的热固性树脂组合物包括（A）环氧树脂，（B）固化催化剂，和（C）的填料，并且通过在25℃下参展不超过1500分帕·秒，凝胶时间的粘度特征的 的不小于300秒在哪个组合物表现出不超过10分帕·秒的熔融粘度，在130℃的凝胶时间不超过600秒的温度。 在通过叠加层间树脂绝缘层和具有导电电路图案包括孔部的布线基板的表面上的导电电路上制备印刷电路板的，空穴填充过程执行通过填充有上述孔部 上面提到的组合物，通过加热 - 影响前固化的，然后研磨并除去预固化组合物从突出的部分的表面限定所述孔的部分，并且进一步加热该预固化组合物，直到最终固化。

公开(公告)号：EP1545171A1

公开(公告)日：2005-06-22

申请号：EP03764152.9

申请日：2003-07-09

申请人： TAIYO INK MFG. CO., LTD.

发明人： OHNISHI, Shigekatsu, Taiyo InkMfg. Co., Ltd.

IPC分类号： H05K3/06 ,  H05K3/40

CPC分类号： H05K3/02 ,  H05K1/092 ,  H05K3/4061 ,  H05K2203/0514 ,  H05K2203/0793

摘要： A method for forming a circuit pattern on a ceramic green sheet is provided having excellent productivity at a low-cost. The method is characterized in that alkaline soluble conductive paste (a), which contains binder soluble in alkaline aqueous solution and conductive particles as main ingredients, is filled in the via-holes of the ceramic green sheet without using a mask, and subsequently alkaline soluble photosensitive conductive paste (b) is further applied on the green sheet for a circuit pattern and is dried. Thereafter, the pattern is exposed to a light and is developed.

摘要翻译： 本发明提供一种用于形成在陶瓷生片上的电路图案的方法以低成本具有优异的生产率。 该方法的特征DASS碱溶性导电性糊剂（A），它包含粘结剂溶于碱性溶液wässrige和导电粒子作为主要成分，被填充在陶瓷生片的通孔，而无需使用掩模，并随后碱溶性 感光性导电膏（b）中进一步施加在生坯片上的电路图案，并且干燥。 那里以后，图案暴露于光线和开发。

公开(公告)号：EP1168079A4

公开(公告)日：2002-07-03

申请号：EP00900871

申请日：2000-01-21

申请人： TAIYO INK MFG CO LTD

发明人： FUKUSHIMA KAZUNOBU ,  TOKAI HIROYUKI ,  TAKAGI KOUICHI ,  FURUHASHI TADASHI

IPC分类号： C08F2/44 ,  C08F2/50 ,  C08F220/14 ,  C08F222/10 ,  C08F290/06 ,  C08K3/22 ,  C08L51/08 ,  G03F7/00 ,  G03F7/004 ,  G03F7/027 ,  G03F7/033 ,  G03F7/038 ,  H01B1/22 ,  H01J9/02 ,  H01J11/12 ,  H01J11/14 ,  H01J11/22 ,  H01J11/24 ,  H01J11/26 ,  H01J11/34 ,  H01J11/44 ,  C08F290/00 ,  C08L101/00 ,  H01J11/02

CPC分类号： C08F290/061 ,  C08F2/44 ,  C08F2/50 ,  C08F220/14 ,  C08F290/06 ,  C08F290/062 ,  C08F2222/1053 ,  C08L51/08 ,  G03F7/0007 ,  G03F7/0047 ,  G03F7/033 ,  G03F7/0388 ,  H01J9/02 ,  H01J2217/49207 ,  C08F220/06

摘要： A photo-curable, electrically conductive composition comprising (A) black, electrically conductive particles having a relative surface area more than 20 m2/g, (B) an organic binder, (C) a photopolymerizable monomer and (D) a photopolymerization initiator is the essential feature of the composition of the invention, and a second embodiment is a composition which further comprises (E) inorganic particles. Such a photo-curable conductive composition is applied on transparent electrodes (3a, 3b) of a front glass substrate (1), is exposed to a light according to a predetermined pattern, is developed and burned, to thereby form a lower layer (black layer) electrode circuit of bus electrodes (4a, 4b). The composition can be used for forming a lower layer (black layer) electrode circuit which provides satisfactory conductivity and blackness at the same time in the formation of an electrode on a front substrate of a plasma display panel (PDP).

公开(公告)号：EP3901699A1

公开(公告)日：2021-10-27

申请号：EP19900953.1

申请日：2019-10-16

申请人： Taiyo Ink Mfg. Co., Ltd.

发明人： CHA Haneul ,  FUKUDA Shinichiro ,  NAKAI Koshin ,  SHIINA Touko

IPC分类号： G03F7/027 ,  C08F2/44 ,  C08F2/50 ,  G03F7/004 ,  H05K3/28

摘要： There is provided a curable resin composition in which it is easy for bubbles generated in a film of the curable resin composition applied on a substrate to escape and which is excellent in heat resistance, dryability, electroless gold platability, flexibility and bendability. The curable resin composition contains (A) an alkali-soluble resin, (B) a photopolymerization initiator, (C) a compound having a molecular weight of 300 to 1,000 and two ethylenically unsaturated groups, and (D) a thermosetting component. The viscosity variation of the curable resin composition is not more than 20 when 0.2 ml of the curable resin composition is interposed between two stainless steel sensor plates of 35 mm in diameter and left at 25°C for 60 seconds, and then the shear stress is varied from 0.0001 Pa to 1.0E+4 Pa.

公开(公告)号：EP3778794A1

公开(公告)日：2021-02-17

申请号：EP19776755.1

申请日：2019-03-26

申请人： Taiyo Ink Mfg. Co., Ltd.

发明人： WEI, Xiaozhu ,  YOSHIKAWA, Rina ,  ITO, Hideyuki ,  MATSUMOTO, Hiroshi ,  SHIMURA, Masayuki

IPC分类号： C09D11/30 ,  B41M5/00 ,  C09D11/38 ,  H05K3/28

摘要： [Problem to be Solved]
Provided is a curable composition for inkjet printing for obtaining a cured product excellent in heat resistance, adhesion to a substrate, and hardness.
[Solution]
The curable composition for inkjet printing comprises (A) a multi-branched oligomer or polymer having an ethylenically unsaturated group, (B) a photopolymerization initiator, and (C) a thermosetting compound.