公开(公告)号：EP2413351A1

公开(公告)日：2012-02-01

申请号：EP09842303.1

申请日：2009-09-01

申请人： Tanaka Denshi Kogyo K.K.

发明人： YAMASHITA Tsutomu ,  AKIMOTO Hideyuki ,  KUWAHARA Takeshi ,  OKAZAKI Junichi

IPC分类号： H01L21/60

CPC分类号： B23K35/302 ,  B23K35/0261 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/05624 ,  H01L2224/43 ,  H01L2224/4321 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45644 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/48247 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48664 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48864 ,  H01L2224/85207 ,  H01L2224/85439 ,  H01L2224/85464 ,  H01L2224/85469 ,  H01L2924/00011 ,  H01L2924/00015 ,  H01L2924/01205 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/01015 ,  H01L2924/01206 ,  H01L2924/01029 ,  H01L2924/01204 ,  H01L2924/01028 ,  H01L2924/01027 ,  H01L2924/0105 ,  H01L2224/45639 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/45671 ,  H01L2224/45666 ,  H01L2924/01008 ,  H01L2924/01007 ,  H01L2924/01006 ,  H01L2924/01078 ,  H01L2924/20755 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/01203 ,  H01L2924/01046 ,  H01L2924/20309 ,  H01L2924/013 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01033

摘要： To provide a covered Cu wire for ball bonding which can be avoid inconvenience oxidation of core material of Cu and/or Cu alloy on ball forming after pulling and cutting away.
A covered Cu wire comprising: core material of Cu-P alloy, and intermediate layer of Pd or Pt on the core material and surface layer of Au on the intermediate layer.

摘要翻译： 提供用于球接合的覆盖Cu线，其可以避免在拉拔切割后的球形成中Cu和/或Cu合金的芯材料的不便氧化。 一种覆盖的Cu线，包括：Cu-P合金的芯材，以及在中间层上的芯材料和Au的表面层上的Pd或Pt的中间层。