公开(公告)号：EP3340286A1

公开(公告)日：2018-06-27

申请号：EP17203245.0

申请日：2017-11-23

Applicant: Renesas Electronics Corporation

Inventor： MATSUBARA, Yuko

IPC: H01L21/607 ,  H01L23/495

CPC classification number: H01L24/48 ,  H01L21/4825 ,  H01L21/565 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49582 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/02166 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48824 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/78353 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83855 ,  H01L2224/85012 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85206 ,  H01L2224/92247 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2924/00015 ,  H01L2924/20301 ,  H01L2924/20305 ,  H01L2924/00

Abstract: As one embodiment, a method of manufacturing a semiconductor device, the method comprising the steps of:
(a) preparing a semiconductor chip having an insulating film, and a first main surface in which a plurality of electrodes respectively exposed in a plurality of openings formed in the insulating film are formed;
(b) preparing a base material including a second main surface over which the semiconductor chip is mounted, and a plurality of terminals;
(c) after the step (a) and the step (b), mounting the semiconductor chip over the second main surface of the base material;
(d) after the step (c), electrically connecting the plurality of electrodes and the plurality of terminals via a plurality of wires, respectively; and
(e) after the step (d), resin-sealing the semiconductor chip and the plurality of wires,
wherein in that , in the step (a),
each of the plurality of electrodes of the semiconductor chip includes a first electrode having a first bonding surface exposed in a first opening among the plurality of openings, and
in a plan view, each of the plurality of openings of the semiconductor chip has a plurality of sides including a first side extending in a first direction and a second side extending in a second direction intersecting the first direction, and
wherein in that the step (d) includes the steps of:
(ST2) bringing a ball portion of a first wire among the plurality of wires into contact with the first bonding surface of the first electrode ;
(ST3) after the step (ST2), pressing the ball portion of the first wire toward the first bonding surface with a first load;
(ST4) after the step (ST3), moving the ball portion of the first wire in a plurality of directions including two directions crossing each other in a plan view while pressing the ball portion against the first electrode with a second load smaller than the first load;
(ST5) after the step (ST4), by applying a first ultrasonic wave having a first frequency to the ball portion of the first wire while pressing the ball portion against the first electrode with a third load equal to the second load or smaller than the second load, making the ball portion reciprocate along a third direction in a plan view; and
(ST6) after the step (ST5), by applying the first ultrasonic wave having the first frequency while pressing the ball portion of the first wire against the first electrode with a fourth load larger than the third load and smaller than the first load, making the ball portion reciprocate along the third direction in a plan view, thereby bonding the ball portion and the first electrode.

公开(公告)号：EP3337638A1

公开(公告)日：2018-06-27

申请号：EP16837761.2

申请日：2016-08-17

Applicant: Lockheed Martin Corporation

Inventor： STOLTENBERG, Randall Mark ,  ZINN, Alfred A.

IPC: B23K37/00 ,  B23K31/00

CPC classification number: H01L24/85 ,  H01L24/45 ,  H01L24/46 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45193 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/49096 ,  H01L2224/49175 ,  H01L2224/7815 ,  H01L2224/7825 ,  H01L2224/78301 ,  H01L2224/78601 ,  H01L2224/78611 ,  H01L2224/8502 ,  H01L2224/851 ,  H01L2224/85205 ,  H01L2224/8584 ,  H01L2224/8593 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2224/05599 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2224/85399

Abstract: Wire bonding operations can be facilitated through the use of metal nanoparticle compositions. Both ball bonding and wedge bonding processes can be enhanced in this respect. Wire bonding methods can include providing a wire payout at a first location from a rolled wire source via a dispensation head, contacting a first metal nanoparticle composition and a first portion of the wire payout with a bonding pad, and at least partially fusing metal nanoparticles in the first metal nanoparticle composition together to form an adhering interface between the bonding pad and the first portion of the wire payout. The adhering interface can have a nanoparticulate morphology. Wire bonding systems can include a rolled wire source, a dispensation head configured to provide a wire payout, and an applicator configured to place a metal nanoparticle composition upon at least a portion of the wire payout or upon a bonding pad.

公开(公告)号：EP2880683A1

公开(公告)日：2015-06-10

申请号：EP13826185.4

申请日：2013-08-02

Applicant: Invensas Corporation

Inventor： CASKEY, Terrence ,  MOHAMMED, Ilyas ,  UZOH, Cyprian, Emeka ,  WOYCHIK, Charles ,  NEWMAN, Michael ,  MONADGEMI, Pezhman ,  CO, Reynaldo ,  CHAU, Ellis ,  HABA, Belgacem

IPC: H01L23/48 ,  H01L23/12

CPC classification number: H01L25/105 ,  H01L21/486 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/02379 ,  H01L2224/04042 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48108 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73257 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/381 ,  H05K1/0298 ,  H05K3/46 ,  Y10T29/49126 ,  Y10T29/49162 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A method for making an interposer includes forming a plurality of wire bonds bonded to one or more first surfaces of a first element. A dielectric encapsulation is formed contacting an edge surface of the wire bonds which separates adjacent wire bonds from one another. Further processing comprises removing at least portions of the first element, wherein the interposer has first and second opposite sides separated from one another by at least the encapsulation, and the interposer having first contacts and second contacts at the first and second opposite sides, respectively, for electrical connection with first and second components, respectively, the first contacts being electrically connected with the second contacts through the wire bonds.

Abstract translation: 一种制造内插器的方法包括形成结合到第一元件的一个或多个第一表面的多个引线键合。 电介质封装形成为接触将相邻的引线键彼此分开的引线键合的边缘表面。 进一步的处理包括去除第一元件的至少部分，其中插入件具有通过至少封装彼此分开的第一和第二相对侧，并且插入件分别在第一和第二相对侧具有第一触点和第二触点， 用于分别与第一和第二组件电连接，第一触点通过线键合与第二触点电连接。

公开(公告)号：EP2852974A1

公开(公告)日：2015-04-01

申请号：EP13724714.4

申请日：2013-05-21

Applicant: Invensas Corporation

Inventor： MOHAMMED, Ilyas

IPC: H01L23/00 ,  H01L23/538 ,  H01L25/10 ,  H01L21/48 ,  H01L23/495

CPC classification number: H01L23/5226 ,  H01L21/563 ,  H01L21/568 ,  H01L21/76877 ,  H01L21/76892 ,  H01L23/5389 ,  H01L24/06 ,  H01L24/18 ,  H01L24/19 ,  H01L24/20 ,  H01L24/45 ,  H01L24/49 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45101 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/4569 ,  H01L2224/49 ,  H01L2224/73267 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2225/06558 ,  H01L2225/1035 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/182 ,  H01L2924/191 ,  H01L2924/19107 ,  H05K3/4046 ,  H05K2201/10287 ,  H05K2203/1461 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/01049

Abstract: A method for making a microelectronic unit includes forming a plurality of wire bonds on a first surface in the form of a conductive bonding surface of a structure comprising a patternable metallic element. The wire bonds are formed having bases joined to the first surface and end surfaces remote from the first surface. The wire bonds have edge surfaces extending between the bases and the end surfaces. The method also includes forming a dielectric encapsulation layer over a portion of the first surface of the conductive layer and over portions of the wire bonds such that unencapsulated portions of the wire bonds are defined by end surfaces or portions of the edge surfaces that are uncovered by the encapsulation layer. The metallic element is patterned to form first conductive elements beneath the wire bonds and insulated from one another by portions of the encapsulation layer.

Abstract translation: 制造微电子单元的方法包括在包括可图案化的金属元件的结构的导电接合表面的形式的第一表面上形成多个引线接合。 线接合形成有连接到第一表面和远离第一表面的端表面的基底。 线接合具有在基部和端面之间延伸的边缘表面。 该方法还包括在导电层的第一表面的一部分上方并且在引线接合部分之上形成电介质封装层，使得引线接合的未封装部分由端面或边缘表面的未被 封装层。 金属元件被图案化以在引线键合下形成第一导电元件，并且通过封装层的一部分彼此绝缘。

公开(公告)号：EP2596528A2

公开(公告)日：2013-05-29

申请号：EP11749078.9

申请日：2011-07-18

Applicant: Heraeus Materials Technology GmbH & Co. KG

Inventor： MILKE, Eugen ,  DICK, Jürgen ,  PRENOSIL, Peter ,  WULFF, Frank-Werner

IPC: H01L23/49

CPC classification number: H01B5/02 ,  B21F45/00 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/4321 ,  H01L2224/4381 ,  H01L2224/43825 ,  H01L2224/43826 ,  H01L2224/43847 ,  H01L2224/43848 ,  H01L2224/45012 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45016 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/45644 ,  H01L2224/45664 ,  H01L2224/45686 ,  H01L2224/45687 ,  H01L2224/85001 ,  H01L2224/85207 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/00015 ,  H01L2224/45164 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/01083 ,  H01L2924/01049

Abstract: A bonding wire is provided containing a wire core made of a first material containing a metal and a wire jacket that envelopes the wire core and is made of a second material containing a metal. The wire core and the wire jacket are made of different metals and the bonding wire has an aspect ratio of no more than 0.8. The bonding wire efficiently prevents damage to bonding surfaces during the bonding process and short-circuiting during the use of corresponding sub-assemblies.

Abstract translation: 提供接合线，其包含由包含金属的第一材料制成的线芯和包封线芯的线护套，并且该线由包含金属的第二材料制成。 线芯和线套由不同的金属制成，键合线的纵横比不超过0.8。 接合线有效地防止了在接合过程中对接合面的损坏以及在使用相应的子组件期间的短路。

公开(公告)号：EP2312628A2

公开(公告)日：2011-04-20

申请号：EP10191035.4

申请日：2008-07-24

Applicant: Nippon Steel Materials Co., Ltd. ,  Nippon Micrometal Corporation

Inventor： Uno, Tomohiro ,  Kimura, Keiichi ,  Terashima, Shinichi ,  Yamada, Takashi ,  Nishibayashi, Akihito

IPC: H01L23/49

CPC classification number: H01L24/85 ,  H01L24/05 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/4312 ,  H01L2224/4321 ,  H01L2224/43825 ,  H01L2224/43847 ,  H01L2224/43848 ,  H01L2224/43986 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/456 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/45671 ,  H01L2224/45673 ,  H01L2224/4568 ,  H01L2224/45684 ,  H01L2224/48011 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48463 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48864 ,  H01L2224/78251 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85048 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2224/859 ,  H01L2924/00011 ,  H01L2924/00015 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01105 ,  H01L2924/01204 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/15747 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/3025 ,  H01L2924/3861 ,  H01L2924/01001 ,  H01L2924/01203 ,  H01L2924/01034 ,  H01L2924/01081 ,  H01L2924/20645 ,  H01L2924/20652 ,  H01L2924/20653 ,  H01L2924/00014 ,  H01L2924/20108 ,  H01L2224/45657 ,  H01L2224/45666 ,  H01L2924/01008 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/2076 ,  H01L2924/2065 ,  H01L2924/20651 ,  H01L2924/20654 ,  H01L2924/00 ,  H01L2224/45124 ,  H01L2924/013 ,  H01L2924/20751 ,  H01L2924/2075 ,  H01L2924/00013 ,  H01L2924/01049

Abstract: It is an object of the present invention to provide a copper-based bonding wire whose material cost is low, having excellent ball bondability, reliability in a heat cycle test or reflow test, and storage life, enabling an application to thinning of a wire used for fine pitch connection. The bonding wire includes a core material having copper as a main component and an outer layer which is provided on the core material and contains a metal M and copper, in which the metal M differs from the core material in one or both of components and composition. The outer layer is 0.021 to 0.12 µ m in thickness.

Abstract translation: 本发明的目的是提供一种铜基接合线，其材料成本低，具有优异的球接合性，热循环试验或回流试验的可靠性以及储存寿命，使得能够使用的线材变薄 用于细间距连接。 接合线包括具有铜作为主要成分的芯材和设置在芯材上并且包含金属M和铜的外层，其中金属M与芯材料在组分和组成中的一种或两种中不同 。 外层的厚度为0.021〜0.12μm。

公开(公告)号：EP1447842A1

公开(公告)日：2004-08-18

申请号：EP02802024.6

申请日：2002-10-17

Applicant: Sunitomo Electric Wintec, Incorporated

Inventor： KAIMORI, S. SUMITOMO ELECTRIC IND. LTD. ,  NONAKA, T. Sumitomo Electric Wintec, Inc. ,  FUKAGAYA, M. Sumitomo Electric Wintec, Inc. ,  IOKA, M. Sumitomo Electric Wintec, Inc.

IPC: H01L21/60

CPC classification number: H01L24/85 ,  C25D5/50 ,  C25D7/0607 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05624 ,  H01L2224/4312 ,  H01L2224/4321 ,  H01L2224/43825 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/456 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/78268 ,  H01L2224/85045 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2924/00011 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01204 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/20106 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/3025 ,  H01L2924/01001 ,  H01L2924/01004 ,  H01L2924/01008 ,  H01L2924/01048 ,  H01L2924/01026 ,  H01L2924/01003 ,  H01L2924/00014 ,  H01L2924/01203 ,  H01L2224/45644 ,  H01L2924/2011 ,  H01L2924/01205 ,  H01L2924/00 ,  H01L2924/20111 ,  H01L2924/01006

Abstract: A bonding wire having a core mainly consisting of copper and a coating layer formed on the core, wherein the coating layer is made of an oxidation-resistant metal having a melting point higher than that of copper, and the elongation of this bonding wire per unit sectional area is 0.021%/µm 2 or more; and a bonding wire having a core mainly consisting of copper and a coating layer formed on the core, wherein the coating layer is made of a metal having oxidation resistance higher than that of copper, and the relationship of 0.007 ≦ X ≦ 0.05 is satisfied wherein an area ratio X is (the area of the coating layer/the area of the core at the section of wire being cut vertically) are provided. The bonding wires thus provided are inexpensive and excellent in ball formation characteristic and bonding characteristic. Further, a ball bonding method characterized in using the above bonding wire is also provided.

Abstract translation: 具有主要由铜构成的芯和形成在芯上的涂层的接合线，其中，所述涂层由熔点高于铜的耐氧化金属制成，并且每单位的该接合线的伸长率 截面积为0.021％/ m 2以上; 以及具有主要由铜构成的芯和在芯上形成的涂层的接合线，其中，所述涂层由耐氧化性高于铜的金属制成，并且0.007≤X= 0.05，其中面积比X是（涂层的面积/芯线截面垂直截面处的芯的面积）。 由此提供的接合线便宜并且球形成特性和接合特性优异。 此外，还提供了使用上述接合线的球接合方法。

公开(公告)号：EP0924320A3

公开(公告)日：2001-09-12

申请号：EP98308393.2

申请日：1998-10-14

Applicant: Totoku Electric Co., Ltd.

Inventor： Kitazawa, Hiroshi ,  Yamaguchi, Tatsuo ,  Tsukada, Etsuro

IPC: C25D5/44 ,  C25D5/10 ,  C25D5/50

CPC classification number: H01L24/45 ,  C25D5/10 ,  C25D5/44 ,  C25D5/50 ,  H01L24/43 ,  H01L2224/43 ,  H01L2224/431 ,  H01L2224/45015 ,  H01L2224/45118 ,  H01L2224/45124 ,  H01L2224/45573 ,  H01L2224/45574 ,  H01L2224/45601 ,  H01L2224/45618 ,  H01L2224/45624 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/4566 ,  H01L2224/45664 ,  H01L2224/45666 ,  H01L2224/45669 ,  H01L2224/45671 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  Y10T29/49117 ,  H01L2924/0132 ,  H01L2924/01201 ,  H01L2924/01026 ,  H01L2924/01025 ,  H01L2924/01024 ,  H01L2924/01022 ,  H01L2924/013 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/0002

Abstract: A copper plated aluminum wire improved in the adhesion is fabricated by a method which comprises a zinc displacement step of forming a zinc thin layer by zinc displacement on the surface of an aluminum or aluminum alloy conductor, an electroplating step of coating the surface of the zinc thin layer continuously with copper layers by electroplating to have a copper coated aluminum conductor, and a thermal diffusion step of heat treating the copper coated aluminum conductor at a temperature of 120 °C to 600 °C under an inert gas atmosphere for thermal diffusion to ease the electrodeposition stress. Accordingly, the resultant copper plated aluminum wire can easily be shaped by cold plastic working process, decreased in the diameter at higher efficiency, and improved in the power of adhesion. A plated aluminum wire is provided comprising an anchor metal layer by displacement plating, a low thermally conductive metal layer by electroplating, and a high electrically conductive metal layer by electroplating which all are deposited in a sequence on the outer surface an aluminum or aluminum alloy conductor. Accordingly, the resultant plated aluminum wire or insulating plated aluminum wire can be minimized in the overall weight and prevented from disconnection caused by thermal diffusion. A plated aluminum wire is provided comprising an anchor metal layer by displacement plating and a high electrically conductive metal layer by electroplating which both are deposited in a sequence on the outer surface an aluminum or aluminum alloy conductor. Accordingly, the resultant plated aluminum wire or insulating plated aluminum wire can be minimized in the overall weight. A composite light-weighted plated wire is provided having an electrically conductive metal layer, which has a potential equal to or higher than that of zinc, deposited by electroplating on the outer surface of a zinc anchor metal layer provided on an aluminum conductor, said electroplating carried out under a condition that the concentration of hydrogen ion in an electrolyte solution is higher than 4 (pH) as an electrolysis parameter and the thickness of plating x (micrometer) is 0.2 Accordingly, the resultant composite light-weighted plated wire can be improved in the adhesion between the aluminum conductor and the electrically conductive metal layer, easily shaped by plastic forming process, decreased in the diameter at higher efficiency, and improved in the reliability of soldering work.

Abstract translation: 镀铜铝线材在粘合改进通过包括铝或铝合金导体的表面上形成由锌置换锌薄层的锌置换步骤，以电镀锌的表面上涂覆的步骤的方法制造 薄层连续铜层通过电镀以具有铜涂覆的铝导体，以及热处理的铜涂覆的铝导体在120℃至600℃的温度下在惰性气体气氛中对热扩散来缓解下热扩散步骤 电沉积压力。 因此，所得到的铜镀铝导线可以很容易地通过冷塑性加工工艺来成形，减少在较高效率的直径，并且在粘合性的功率提高。 本发明提供一种镀敷铝电线，包括通过置换镀敷锚定金属层，通过电镀低导热金属层，和高导电性金属层，通过电镀，所有被沉积在一个序列中的铝或铝合金导体的外表面上 ， 因此，所得到的镀铝导线或绝缘的镀铝导线可以在整体重量被最小化，并从断开由热扩散引起的防止。 本发明提供一种镀敷铝电线，包括通过置换镀覆的锚定金属层和通过电镀高导电性金属层，其两者都沉积在序列铝或铝合金导体的外表面上。 因此，所得到的镀铝导线或绝缘的镀铝导线可以在整体重量被最小化。 本发明提供一种复合材料重量轻的镀线具有导电金属层，其具有的电势等于或高于锌的高，通过电镀在铝导体设置在锌锚金属层的外表面上沉积，所述电镀 的条件下进行确实氢离子的电解质的溶液中的浓度是小于4（pH值）更高，因为电解参数和电镀X（微米）的厚度为0.2

公开(公告)号：EP1115565A1

公开(公告)日：2001-07-18

申请号：EP99948286.2

申请日：1999-09-16

Applicant: Kulicke & Soffa Investments, Inc.

Inventor： SEUNTIENS, Jeffrey, M.

IPC: B32B15/02 ,  B21F19/00

CPC classification number: H01L24/48 ,  B21C37/042 ,  H01B1/02 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/4312 ,  H01L2224/4321 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/48247 ,  H01L2224/48455 ,  H01L2224/4847 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01202 ,  H01L2924/01204 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/0102 ,  H01L2924/01004 ,  H01L2924/013 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/00013 ,  H01L2924/01006

Abstract: Composite wires characterized by a noble metal annulus welded to a wire core comprising an electrically-conductive, non-noble metal. Methods of forming the composite wire and semiconductor packaging having at least one lead bonded to the composite wire are also disclosed.

Abstract translation: 复合导线，其中贵金属环形空间被焊接到导电的非贵重金属线芯上。 还公开了形成复合线的方法和具有与复合线接合的至少一个引线的半导体封装。

公开(公告)号：EP3147938A4

公开(公告)日：2017-06-14

申请号：EP15882901

申请日：2015-12-28

Applicant: NIPPON MICROMETAL CORP ,  NIPPON STEEL & SUMIKIN MAT CO

Inventor： YAMADA TAKASHI ,  ODA DAIZO ,  OISHI RYO ,  UNO TOMOHIRO

IPC: H01L23/49 ,  C22C9/00

CPC classification number: H01L24/45 ,  C22C5/04 ,  C22C9/00 ,  C22C9/06 ,  H01L24/05 ,  H01L24/43 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/05624 ,  H01L2224/4312 ,  H01L2224/43125 ,  H01L2224/43825 ,  H01L2224/43826 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45572 ,  H01L2224/45664 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48507 ,  H01L2224/48824 ,  H01L2224/85075 ,  H01L2224/85203 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2924/00011 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2224/45644 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01015 ,  H01L2924/01005 ,  H01L2924/01004 ,  H01L2924/01026 ,  H01L2924/01012 ,  H01L2924/01022 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/01014 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01203 ,  H01L2924/01202 ,  H01L2924/01204 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/01007 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/01033 ,  H01L2924/00

Abstract: There is provided a bonding wire for a semiconductor device including a coating layer having Pd as a main component on a surface of a Cu alloy core material and a skin alloy layer containing Au and Pd on a surface of the coating layer, the bonding wire further improving 2nd bondability on a Pd-plated lead frame and achieving excellent ball bondability even in a high-humidity heating condition. The bonding wire for a semiconductor device including the coating layer having Pd as a main component on the surface of the Cu alloy core material and the skin alloy layer containing Au and Pd on the surface of the coating layer has a Cu concentration of 1 to 10 at% at an outermost surface thereof and has the core material containing a metallic element of Group 10 of the Periodic Table of Elements in a total amount of 0.1 to 3.0% by mass, thereby achieving improvement in the 2nd bondability and excellent ball bondability in the high-humidity heating condition. Furthermore, a maximum concentration of Au in the skin alloy layer is preferably 15 at% to 75 at%.

Abstract translation: 提供一种用于半导体器件的接合线，该接合线包括在Cu合金芯材的表面上具有Pd作为主要成分的涂层和在该涂层的表面上包含Au和Pd的表皮合金层，该接合线进一步 即使在高湿度加热条件下，也改善了镀钯引线框架上的第二焊接性并实现优异的球焊性。 包括在Cu合金芯材表面上具有Pd作为主要成分的涂层和在涂层表面上包含Au和Pd的表皮合金层的半导体器件用接合线具有1到10的Cu浓度 并且具有含有总量为0.1〜3.0质量％的元素周期表第10族的金属元素的芯材，由此实现第2接合性的提高和在第2接合性方面的优异的球接合性 高湿度的加热条件。 此外，表皮合金层中Au的最大浓度优选为15原子％至75原子％。