公开(公告)号：EP2561029A2

公开(公告)日：2013-02-27

申请号：EP11718802.9

申请日：2011-04-05

申请人： Trillion Science, Inc.

发明人： LIANG, Rong-Chang ,  SUN, Yuhao ,  SONG, Hua ,  TSENG, Chin-Jen ,  CHUANG, Hsiao, Ken

IPC分类号： C09J163/00

CPC分类号： C09J163/00 ,  C08K3/36 ,  C08K5/3445 ,  C08K5/5435 ,  C08L33/00 ,  C08L2666/04 ,  C08L2666/24 ,  H05K3/323

摘要： An adhesive composition comprising: (i) a one part curable epoxy adhesive and (ii) a low profile additive (LPA), the low profile additive being a polymer that is compatible with the epoxy adhesive such that it forms a single phase when admixed with the adhesive composition and that separates from the adhesive to form a network of stress-absorbing nodules therein when the adhesive is cured, the low profile additive being present in an amount sufficient to prevent or reduce shrinkage and/or the formation of voids or cracks when the adhesive is cured. In one embodiment the LPA is a block copolymer including at least one flexible block and at least one rigid block that makes the low profile additive compatible with the epoxy adhesive such that a mixture of the uncured epoxy resin and the low profile additive forms a homogenous solution and as the epoxy resin is cured, the low profile additive forms a stress absorbing network of nodules in the cured epoxy resin matrix.

公开(公告)号：EP2756048A2

公开(公告)日：2014-07-23

申请号：EP12773435.8

申请日：2012-09-10

申请人： Trillion Science, Inc.

发明人： LEE, Jiannrong ,  SUN, Yuhao ,  AUNG, Maung, Kyaw ,  TSENG, Chin-Jen ,  CHANG, Chiapu ,  ROKUTANDA, Shuji ,  LIANG, Rong-Chang

IPC分类号： C09J9/02 ,  C09J7/00 ,  H01B1/20 ,  H01R13/24 ,  H01R43/00 ,  B32B37/22

CPC分类号： C09J9/02 ,  B32B3/10 ,  B32B5/16 ,  B32B7/12 ,  B32B27/14 ,  B32B27/281 ,  B32B27/285 ,  B32B27/286 ,  B32B27/308 ,  B32B27/36 ,  B32B27/365 ,  B32B37/12 ,  B32B37/14 ,  B32B37/226 ,  B32B38/06 ,  B32B38/10 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2264/105 ,  B32B2266/045 ,  B32B2307/202 ,  B32B2309/08 ,  B32B2310/0843 ,  B32B2457/00 ,  B65G17/36 ,  C08K9/02 ,  C08K2201/001 ,  C09J7/00 ,  C09J7/10 ,  C09J2201/28 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2463/00 ,  H05K3/321 ,  Y10T156/1066 ,  Y10T428/24893 ,  Y10T428/249921

摘要： A method for fabricating an electronic device or component such as an anisotropic conductive film comprising: distributing a plurality of conductive particles into an array of microcavities formed on a surface of a continuous carrier belt, rotating the belt carrying the conductive particles while conveying a surface of an adhesive layer into contact with the surface of the rotating belt, transferring the conductive particles from the microcavities on the belt to the adhesive layer in predefined locations in the adhesive layer corresponding to the array of microcavities on the belt, and separating the adhesive layer from the surface of the belt. In one embodiment, the position of the microcavities is varied in a controlled manner.