公开(公告)号：EP2982727A4

公开(公告)日：2016-11-02

申请号：EP14778798

申请日：2014-03-27

Applicant: SHOWA DENKO KK

Inventor： UCHIDA HIROSHI ,  ISHIBASHI YOSHITAKA

IPC: C09J163/10 ,  C08F299/02 ,  C09J7/02 ,  C09J9/02 ,  C09J133/14 ,  H01B1/00 ,  H01B1/22 ,  H01B1/24 ,  H01B5/00

CPC classification number: C09J9/02 ,  C08K3/08 ,  C08K7/18 ,  C08K2003/0806 ,  C08K2003/0831 ,  C08K2003/085 ,  C08K2003/0862 ,  C09D133/068 ,  C09J7/00 ,  C09J7/10 ,  C09J133/14 ,  C09J163/10 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  H01B1/22

Abstract: Provided are a conductive adhesive and an anisotropic conductive film capable of suppressing deterioration by halogen at an adhesion portion, and using an epoxy (meth) acrylate resin, and further provided is an electronic device using such a conductive adhesive and an anisotropic conductive film. In a conductive adhesive and an anisotropic conductive film comprising conductive fillers and a binder resin, an epoxy (meth)acrylate resin contained in the binder resin is formed by adding a (meth) acrylic acid to an epoxy compound having the sum of total chlorine atom concentration and total bromine atom concentration of 300 mass ppm or less, and preferably 50 mass ppm or less, and the conductive fillers are dispersed in the binder resin containing the epoxy (meth)acrylate resin. The epoxy (meth) acrylate resin can be obtained by using raw material compound (substrate) having a carbon-carbon double bond, epoxidizing the carbon-carbon double bond preferably using hydrogen peroxide as an oxidant, and further adding a (meth)acrylic acid thereto.

公开(公告)号：EP2899020A4

公开(公告)日：2016-05-18

申请号：EP13838906

申请日：2013-09-18

Applicant: DEXERIALS CORP

Inventor： KURODA DAISUKE

IPC: B32B15/08 ,  B32B7/02 ,  C09J7/02 ,  C09J9/02 ,  C09J11/04 ,  C09J201/00 ,  G02B5/22 ,  H01B5/14

CPC classification number: G06F1/16 ,  B32B15/06 ,  B32B15/08 ,  B32B15/082 ,  B32B15/085 ,  B32B15/088 ,  B32B15/09 ,  B32B15/092 ,  B32B15/095 ,  B32B15/20 ,  B32B25/12 ,  B32B25/16 ,  B32B25/20 ,  B32B27/08 ,  B32B27/20 ,  B32B27/28 ,  B32B27/281 ,  B32B27/285 ,  B32B27/286 ,  B32B27/288 ,  B32B27/30 ,  B32B27/302 ,  B32B27/304 ,  B32B27/306 ,  B32B27/308 ,  B32B27/322 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B27/38 ,  B32B2250/03 ,  B32B2250/05 ,  B32B2264/108 ,  B32B2307/202 ,  B32B2307/204 ,  B32B2307/206 ,  B32B2307/212 ,  B32B2307/402 ,  B32B2307/4023 ,  B32B2307/4026 ,  B32B2307/41 ,  B32B2307/416 ,  B32B2405/00 ,  B32B2457/20 ,  C09J7/29 ,  C09J9/02 ,  C09J2201/602 ,  C09J2201/622 ,  C09J2203/318 ,  C09J2400/163 ,  G02B5/208 ,  G06F3/0412

Abstract: A conductive sheet has a structure in which a conductive adhesive layer laminated on one side of a base substrate and a light-shielding insulating layer laminated on another side of the base substrate. The base substrate has a structure in which the same kind of metal layers are formed on respective sides of a resin film. The light-shielding insulating layer of the conductive sheet has a surface having a surface resistivity of 1.0 × 10 8 ©/square or more, a gloss value of 80% or less, and an optical density of 1 or more.

公开(公告)号：EP2949719A1

公开(公告)日：2015-12-02

申请号：EP14743132.4

申请日：2014-01-16

Applicant: Toray Industries, Inc.

Inventor： SHIMADA, Akira ,  AOKI, Koichi

IPC: C09J179/08 ,  C09J11/04 ,  C09J163/00 ,  H01L21/52

CPC classification number: H01L23/295 ,  C08G59/4042 ,  C08K2003/2227 ,  C08K2003/282 ,  C08K2003/385 ,  C08K2201/003 ,  C09J7/28 ,  C09J9/00 ,  C09J163/00 ,  C09J179/08 ,  C09J2201/122 ,  C09J2201/602 ,  C09J2400/163 ,  C09J2479/08 ,  H01L23/293 ,  H01L23/3737 ,  H01L23/49568 ,  H01L2924/0002 ,  Y10T428/2804 ,  Y10T428/31721 ,  H01L2924/00

Abstract: The purpose of the present invention is to provide an adhesive composition having high heat conductivity and excellent adhesion, in which the dispersibility of a heat-conductive filler is controlled, and in which thermal stress during cooling/heating cycle testing can be alleviated. An adhesive composition containing a soluble polyimide (A), an epoxy resin (B), and a heat-conductive filler (C), the adhesive composition characterized by containing three types of diamine residues having a specific structure, and in that the content of the epoxy resin (B) is 30-100 parts by weight with respect to 100 parts by weight of the soluble polyimide (A).

Abstract translation: 本发明的目的是提供一种具有高导热性和优异的粘合性的粘合剂组合物，其中控制导热填料的分散性，并且可以减轻制冷/加热循环试验期间的热应力。 一种含有可溶性聚酰亚胺（A），环氧树脂（B）和导热性填料（C）的粘合剂组合物，其特征在于含有三种具有特定结构的二胺残基，其含量 相对于100重量份的可溶性聚酰亚胺（A），环氧树脂（B）为30〜100重量份。

公开(公告)号：EP2612755A4

公开(公告)日：2015-05-06

申请号：EP11821577

申请日：2011-08-19

Applicant: POLYMATECH CO LTD

Inventor： WATANABE YASUYOSHI

IPC: D06N3/00 ,  C09J7/02 ,  H01L23/373 ,  H05K7/20

CPC classification number: H01B7/428 ,  C08K3/22 ,  C08K2003/2227 ,  C09J7/29 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/106 ,  C09J2400/263 ,  D06N3/0002 ,  D06N3/0006 ,  D06N3/0063 ,  D06N2209/062 ,  D06N2213/045 ,  H01L23/3733 ,  H01L23/3737 ,  H01L2924/0002 ,  H05K7/20481 ,  Y10T442/164 ,  Y10T442/176 ,  H01L2924/00

Abstract: A thermally conductive sheet includes a mesh sheet and a thermally conductive composition containing a resin composition and a thermally conductive filler and coating both sides of the mesh sheet so as to form a thermally conductive layer. The thermally conductive sheet is prevented from trapping air bubbles so as to exhibit high thermal conductivity, and is so strong that does not easily tear. The mesh sheet 14 has mesh holes defined by thread 14a and 14b intersecting with each other. The intersection of the threads 14a and 14b is provided with a bubble inclusion inhibition part 18 for preventing air bubbles from being trapped in the interface between the thermally conductive composition 12 and the mesh sheet 14. The bubble inclusion inhibition part 18 may be a fused portion 18a, a pressure-bonded portion 18b or the like.

公开(公告)号：EP2784141A3

公开(公告)日：2014-12-03

申请号：EP14161541.9

申请日：2014-03-25

Applicant: FUJIFILM Corporation

Inventor： Kawashima, Takeaki

IPC: H01L23/48 ,  H01L21/60 ,  C09J9/02 ,  C09J7/00 ,  C08K3/08 ,  C08K3/36 ,  C08K9/02

CPC classification number: H01B7/0009 ,  C08K3/08 ,  C08K3/36 ,  C08K9/02 ,  C08K2201/016 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/28 ,  C09J2201/602 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2205/106 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/27003 ,  H01L2224/2711 ,  H01L2224/27334 ,  H01L2224/29016 ,  H01L2224/29076 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/2949 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/81191 ,  H01L2224/83192 ,  H01L2224/83345 ,  H01L2224/83851 ,  H01L2924/15788 ,  H01R43/16 ,  H05K3/321 ,  H05K2201/10378 ,  H05K2201/10674 ,  Y10T29/49208 ,  Y10T428/24479 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An anisotropic conductive film (100, 110, 120, 130, 140, 150, 160, 170) includes: an insulation region (102, 122, 132, 142, 12, 162, 172) having a planer shape and containing an insulating filler at a first content rate; and a plurality of conductive particle holding regions (104, 124, 134, 144, 154, 164, 174) arranged in the insulation region, the conductive particle holding regions holding conductive particles (106) and containing the insulating filler at a second content rate lower than the first content rate, the conductive particle holding regions being arranged discretely in a planar direction of the insulation region. A method of making conductive connection between a first terminal arranged on a first member and a second terminal arranged on a second member includes: temporarily tacking the anisotropic conductive film to the first member; holding the first and second members such that the first and second terminals face to each other across the temporarily tacked anisotropic conductive film; pressing the first and second members to each other; and heating the anisotropic conductive film.

公开(公告)号：EP2714283A2

公开(公告)日：2014-04-09

申请号：EP12735629.3

申请日：2012-06-01

Applicant: Stokvis Tape Group B.V.

Inventor： DANDOY, Jacques

IPC: B05B13/02 ,  B05B5/08

CPC classification number: B05B13/0264 ,  B05B5/082 ,  C09J7/38 ,  C09J2201/602

Abstract: A suspension device 70 for simultaneously suspending a product 71 and providing a conductive path away from the product, the device comprising an adhesive portion 703 for adhering to the item, an attachment portion 701 for attaching to a mount and a conductive portion 702 arranged to form an electrical path 702, 72, 73 from the item to be coated to a conductor (ground / earth / voltage charge). Ideally, the suspension device is used to hang up and electrically ground an article to be electro-sprayed. The suspension device may be multilayered, with a sticky layer, and a support layer. A conductive strip is preferably mounted on the adhesive layer. The mounting portion may be provided with a hole, which can be engaged by a mounting hook. When electrospraying is completed, the mounting portion of the conductive hanging tape / tab is removed, leaving the adhesive portion behind to cover the uncoated areas.

Abstract translation: 一种用于同时悬挂物品和提供远离产品的导电路径的悬挂装置，该悬挂装置包括用于粘附到待涂覆物品的粘合部分，用于附接到其上安装悬挂装置的安装件的安装部分以及导电 部分布置成形成从待涂覆物品到导体的电路径。

公开(公告)号：EP2612755A1

公开(公告)日：2013-07-10

申请号：EP11821577.1

申请日：2011-08-19

Applicant: Polymatech Co., Ltd.

Inventor： WATANABE Yasuyoshi

IPC: B32B27/12 ,  B32B27/20 ,  H01L23/36 ,  H05K7/20

CPC classification number: H01B7/428 ,  C08K3/22 ,  C08K2003/2227 ,  C09J7/29 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/106 ,  C09J2400/263 ,  D06N3/0002 ,  D06N3/0006 ,  D06N3/0063 ,  D06N2209/062 ,  D06N2213/045 ,  H01L23/3733 ,  H01L23/3737 ,  H01L2924/0002 ,  H05K7/20481 ,  Y10T442/164 ,  Y10T442/176 ,  H01L2924/00

Abstract: A thermally conductive sheet includes a mesh sheet and a thermally conductive composition containing a resin composition and a thermally conductive filler and coating both sides of the mesh sheet so as to form a thermally conductive layer. The thermally conductive sheet is prevented from trapping air bubbles so as to exhibit high thermal conductivity, and is so strong that does not easily tear. The mesh sheet 14 has mesh holes defined by thread 14a and 14b intersecting with each other. The intersection of the threads 14a and 14b is provided with a bubble inclusion inhibition part 18 for preventing air bubbles from being trapped in the interface between the thermally conductive composition 12 and the mesh sheet 14. The bubble inclusion inhibition part 18 may be a fused portion 18a, a pressure-bonded portion 18b or the like.

Abstract translation: 导热片包括网片和含有树脂组合物和导热填料的导热组合物，并且将网片的两面涂覆以形成导热层。 防止导热片捕获气泡，从而表现出高的导热性，并且非常牢固，不易撕裂。 网状片14具有由彼此相交的螺纹14a和14b限定的网孔。 螺纹14a和14b的交点设置有气泡夹杂物抑制部分18，用于防止气泡被捕获在导热组合物12和网片14之间的界面中。气泡包合抑制部分18可以是熔融部分 18a，压接部18b等。

公开(公告)号：EP2530130A1

公开(公告)日：2012-12-05

申请号：EP11736927.2

申请日：2011-01-21

Applicant: Nitto Denko Corporation

Inventor： BUZOUJIMA, Yasushi ,  TAMAI, Hironori ,  DAIGAKU, Noritsugu

IPC: C09J7/02 ,  C09J9/02 ,  C09J11/04 ,  C09J133/00

CPC classification number: C09J9/02 ,  C09J7/22 ,  C09J7/28 ,  C09J7/38 ,  C09J133/08 ,  C09J2201/32 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2400/163 ,  C09J2433/00 ,  Y10T428/27 ,  Y10T428/273

Abstract: Provided is an electroconductive pressure-sensitive adhesive tape which is satisfactorily less corrosive and is capable of maintaining stable electrical conductivity over the long term.
The electroconductive pressure-sensitive adhesive tape has at least one acrylic pressure-sensitive adhesive layer. The electroconductive pressure-sensitive adhesive tape has a volume resistance of 1× 10 1 Ω and has a total amount of acrylic acid ions and methacrylic acid ions extracted from the electroconductive pressure-sensitive adhesive tape of 20 ng/cm 2 or less per unit area of the acrylic pressure-sensitive adhesive layer, where the extraction is performed with pure water under conditions of 100°C for 45 minutes, and the total amount is measured through ion chromatography.

Abstract translation: 提供一种导电压敏粘合带，其耐腐蚀性低，并且能够长期保持稳定的导电性。 导电粘合带具有至少一个丙烯酸类压敏粘合剂层。 导电性粘合带的体积电阻为1×10 1©，导电性粘合带的丙烯酸离子和甲基丙烯酸离子的总量为每单位面积20ng / cm 2以下 的丙烯酸类压敏粘合剂层，其中在100℃的条件下用纯水进行萃取45分钟，并且通过离子色谱法测量总量。

公开(公告)号：EP2524952A1

公开(公告)日：2012-11-21

申请号：EP12159913.8

申请日：2012-03-16

Applicant: DelSolar Co., Ltd.

Inventor： Lin, Ching-Huang ,  Liang, Rong-Chang ,  Tsai, Pei-Chang

IPC: C09J7/00 ,  C09J9/02 ,  H01R4/04 ,  H01B1/22

CPC classification number: C09J7/00 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/28 ,  C09J2201/32 ,  C09J2201/602 ,  C09J2203/322 ,  H01B1/22 ,  H01L31/0508 ,  H01L31/0512 ,  H01R4/04 ,  Y02E10/50 ,  Y10T428/14 ,  Y10T428/1438 ,  Y10T428/1443 ,  Y10T428/1471 ,  Y10T428/28

Abstract: An electrode tape (100, 200, 300, 660, 760, 860) and a method for manufacturing the same are disclosed. The electrode tape (100, 200, 300, 660, 760, 860) includes an adhesive film (101, 201, 301, 661) and a conductive structure (102, 202). The adhesive film (101, 201, 301, 661) includes a first adhesive surface (103, 203, 303, 662) and a second adhesive surface (104, 204, 304, 663) which faces an opposite direction to the first adhesive surface (103, 203, 303, 662). The conductive structure (102, 202) is embedded in the adhesive film (101, 201, 301, 661) with a first contact point (105, 623a, 624a) exposed on the first adhesive surface (103, 203, 303, 662) and a second contact point (106, 623b, 624b) exposed on the second adhesive surface (104, 204, 304, 663).

Abstract translation: 公开了电极带（100,200,300,660,760,860）及其制造方法。 电极带（100,200,300,660,760,860）包括粘合膜（101,201,301,661）和导电结构（102,202）。 粘合膜（101,201,301,661）包括第一粘合表面（103,203,303,666）和与第一粘合表面相反的方向的第二粘合表面（104,204,304,663） （103,203,303,662）。 导电结构（102,202）嵌入在粘合膜（101,201,301,661）中，第一接触点（105,623a，624a）暴露在第一粘合剂表面（103,203,303,662）上， 和暴露在第二粘合表面（104,204,304,663）上的第二接触点（106,62b，624b）。

公开(公告)号：EP1951836B1

公开(公告)日：2011-09-14

申请号：EP06827563.5

申请日：2006-11-07

Applicant: 3M Innovative Properties Company

Inventor： CONNELL, Glen ,  KROPP, Michael A. ,  LARSON, Eric G.

IPC: C09J163/00 ,  C09J9/02 ,  C09J11/00

CPC classification number: C09J9/02 ,  C08G59/4261 ,  C08G59/5086 ,  C08G59/621 ,  C08G59/686 ,  C08K3/08 ,  C08L63/00 ,  C08L2666/02 ,  C09J7/10 ,  C09J7/35 ,  C09J163/00 ,  C09J2201/602 ,  C09J2463/00 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0212 ,  Y10T428/31511

Abstract: The invention provides anisotropically conductive adhesive compositions, which comprise a mixture of a multifunctional glycidyl ether epoxy resin, a phenoxy resin, a core-shell polymer, optionally a thermoplastic resin, a thermally activated curing agent, and electrically conductive particles.