公开(公告)号：EP2974801A4

公开(公告)日：2016-12-28

申请号：EP14764591

申请日：2014-03-12

Applicant: UBE INDUSTRIES

Inventor： TERADA TAKESHI ,  NAGAO KEIGO ,  NAKAYAMA TAKESHIGE ,  TAKASAWA RYOICHI

IPC: B05D7/24 ,  B05D3/02 ,  C08G73/10 ,  C08K5/17 ,  C08K5/3445 ,  C08L79/08 ,  C09D5/25 ,  C09D179/08

CPC classification number: C08G73/10 ,  C08G73/1046 ,  C08G73/1067 ,  H01B3/306

Abstract: The present invention relates to a method for producing a polyimide insulating coating layer, the method comprising a step of: applying a polyimide precursor composition to a substrate and baking the composition on the substrate, wherein the polyimide precursor composition comprises a polyamic acid and a basic compound selected from the group consisting of imidazoles and amine compounds, and wherein in the baking step, the length of time for which the polyimide precursor composition is heated is 10 seconds to 180 seconds; the average temperature increasing rate from 100°C to 280°C is 5°C/s or more; and the highest heating temperature is 300°C to 500°C.

Abstract translation: 聚酰亚胺绝缘涂层的制造方法技术领域本发明涉及一种聚酰亚胺绝缘涂层的制造方法，该方法包括以下步骤：将聚酰亚胺前体组合物涂布在基材上，并在该基材上进行烧成，其中，聚酰亚胺前体组合物含有聚酰胺酸和碱 选自咪唑和胺化合物的化合物，并且其中在烘烤步骤中，加热聚酰亚胺前体组合物的时间长度为10秒至180秒; 100℃至280℃的平均升温速度为5℃/ s以上; 最高加热温度为300〜500℃。

公开(公告)号：EP2803702A4

公开(公告)日：2015-08-26

申请号：EP13735890

申请日：2013-01-10

Applicant: UBE INDUSTRIES

Inventor： NAKAYAMA TAKESHIGE ,  TAKASAKI SUSUMU ,  NAKAYAMA TOMONORI ,  HIROSHIGE KENSUKE

IPC: C08L79/08 ,  B29C39/00 ,  B29C39/38 ,  B29K79/00 ,  B29K105/00 ,  B29L31/34 ,  C08G73/10 ,  C08J5/18 ,  C08K5/3445

CPC classification number: C08J5/18 ,  B29C39/006 ,  B29C39/38 ,  B29K2079/08 ,  B29K2105/0002 ,  B29K2105/0073 ,  B29L2031/3475 ,  C08G73/10 ,  C08J2379/08 ,  C08K5/3445 ,  C08L79/08 ,  Y10T428/31721

公开(公告)号：EP2597111A4

公开(公告)日：2015-01-28

申请号：EP11809760

申请日：2011-07-22

Applicant: UBE INDUSTRIES

Inventor： TAKASAWA RYOICHI ,  OKA TAKUYA ,  KOHAMA YUKINORI ,  NAKAGAWA MIHARU ,  HISANO NOBUHARU ,  KOHDA MASAFUMI ,  NAKAYAMA TAKESHIGE ,  NAKAYAMA TOMONORI

IPC: C08G73/10

CPC classification number: C08G73/00 ,  C08G73/1042 ,  C08G73/1075 ,  C08G73/1082 ,  C09D179/08

公开(公告)号：EP2596949A4

公开(公告)日：2014-01-15

申请号：EP11809768

申请日：2011-07-21

Applicant: UBE INDUSTRIES

Inventor： NAKAYAMA TOMONORI ,  SONOYAMA KENJI ,  NAKAYAMA TAKESHIGE

IPC: B32B27/34 ,  B32B15/088 ,  C08G73/10 ,  C08J5/22 ,  H05K1/03

CPC classification number: C09D177/10 ,  B32B27/281 ,  C08G73/1067 ,  C08J7/047 ,  C08J2379/08 ,  C08L79/08 ,  H01L31/03926 ,  H05K1/0393 ,  H05K2201/0154 ,  Y02E10/50 ,  Y10T156/10 ,  Y10T428/31721

公开(公告)号：EP3153539A4

公开(公告)日：2018-02-28

申请号：EP15803165

申请日：2015-06-04

Applicant: UBE INDUSTRIES

Inventor： NAKAYAMA TOMONORI ,  INOUE SHOHEI ,  NAKAYAMA TAKESHIGE ,  YAMASHITA HIROO ,  KITAYAMA NAOKI

IPC: C08G73/10 ,  C08J5/18

CPC classification number: C08G73/1032 ,  B05D3/007 ,  C08G73/10 ,  C08G73/1039 ,  C08G73/1078 ,  C08J5/18 ,  C08J2379/08

Abstract: The present invention relates to a method for producing a polyimide film, comprising steps of: applying a polyamic acid solution composition, which comprises at least one solvent selected from the group consisting of N-methylformamide, N,N-dimethylpropionamide, N,N-dimethylisobutylamide and tetramethylurea, and a polyamic acid, to a substrate; and then imidizing the polyamic acid by subjecting the composition to heat treatment, to obtain the polyimide film.

公开(公告)号：EP3154110A4

公开(公告)日：2017-12-13

申请号：EP15803159

申请日：2015-06-05

Applicant: UBE INDUSTRIES

Inventor： NAKAYAMA TAKESHIGE ,  NAKAYAMA TOMONORI ,  KITAYAMA NAOKI

IPC: H01M4/139 ,  H01M4/1391 ,  H01M4/1393 ,  H01M4/1395 ,  H01M4/62

CPC classification number: H01M4/62 ,  H01M4/139 ,  H01M4/1391 ,  H01M4/1393 ,  H01M4/1395 ,  H01M4/622

Abstract: Disclosed is a method for manufacturing an electrode by forming an electrode mixture layer on a surface of a current collector using an electrode mixture composition containing an aqueous polyimide precursor solution composition and a specific crosslinking agent, the aqueous polyimide precursor solution composition being obtained by dissolving a specific polyamide acid in an aqueous solvent together with a specific imidazole, and subsequently performing heat treatment to remove the solvent and perform an imidization reaction of the polyamide acid. It is preferable that the imidazole is an imidazole selected from the group consisting of 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 4-ethyl-2-methylimidazole, and 1-methyl-4-ethylimidazole.

公开(公告)号：EP2722174A4

公开(公告)日：2015-02-18

申请号：EP12801082

申请日：2012-06-14

Applicant: UBE INDUSTRIES

Inventor： NAKAYAMA TOMONORI ,  NAKAYAMA TAKESHIGE

IPC: B32B27/34 ,  B05D3/02 ,  B05D7/24

CPC classification number: C09D179/08 ,  C08G73/1067 ,  Y10T428/264 ,  Y10T428/265

公开(公告)号：EP2450408A4

公开(公告)日：2014-04-02

申请号：EP10794118

申请日：2010-06-28

Applicant: UBE INDUSTRIES

Inventor： NAKAYAMA TAKESHIGE ,  TAKABAYASHI SEIICHIROU ,  NAKAYAMA TOMONORI

IPC: C08L79/08 ,  C08G73/10 ,  C08K3/00

CPC classification number: C08L79/08 ,  C08J3/205 ,  C08J2379/08 ,  C08K3/013

Abstract: There is provided a filler-containing dispersion solution exhibiting very improved filler dispersion stability by dispersing a filler in a solvent using a polyimide precursor solution composition. Furthermore, in the filler-containing dispersion solution, a tetracarboxylic dianhydride and/or its derivative is reacted with a diamine compound to prepare a filler-containing polyimide precursor solution composition, which is then used to provide a polyimide in which a filler is dispersed.

公开(公告)号：EP3133680A4

公开(公告)日：2017-12-13

申请号：EP15779450

申请日：2015-04-17

Applicant: UBE INDUSTRIES

Inventor： NAKAYAMA TAKESHIGE ,  NAKAYAMA TOMONORI ,  KITAYAMA NAOKI

IPC: H01M4/62 ,  H01M4/13 ,  H01M4/1391 ,  H01M4/1393 ,  H01M4/1395

CPC classification number: H01M4/0404 ,  H01M4/04 ,  H01M4/0471 ,  H01M4/13 ,  H01M4/131 ,  H01M4/133 ,  H01M4/134 ,  H01M4/139 ,  H01M4/1391 ,  H01M4/1393 ,  H01M4/1395 ,  H01M4/386 ,  H01M4/387 ,  H01M4/485 ,  H01M4/622 ,  H01M10/0525

Abstract: An electrode is produced by forming an electrode layer on a surface of a current collector using an electrode composition containing a binder including a polyamide acid that is obtained from a specific aromatic tetracarboxylic acid compound and a diamine component containing a diamine having a carboxyl group, and subsequently performing heat treatment to remove a solvent and perform an imidization reaction of the polyamide acid. It is preferable that the electrode composition further contains a crosslinking agent having an epoxy group or an oxazoline group. It is also preferable that the electrode composition further contains a pyridine compound.

公开(公告)号：EP2485307A4

公开(公告)日：2016-02-10

申请号：EP10820427

申请日：2010-09-22

Applicant: UBE INDUSTRIES

Inventor： NAKAYAMA TAKESHIGE ,  NAKAYAMA TOMONORI ,  TAKABAYASHI SEIICHIROU ,  HIRANO TETSUJI

IPC: H01M4/62 ,  H01G11/28 ,  H01G11/30 ,  H01G11/38 ,  H01M4/133 ,  H01M4/134 ,  H01M4/1393 ,  H01M4/1395 ,  H01M10/0525

CPC classification number: H01B1/22 ,  H01G11/28 ,  H01G11/30 ,  H01G11/38 ,  H01M4/133 ,  H01M4/134 ,  H01M4/1393 ,  H01M4/1395 ,  H01M4/622 ,  H01M10/0525 ,  Y02E60/122 ,  Y02E60/13

Abstract: The present invention relates to a binder resin composition for an electrode, including a polyamic acid and a solvent, wherein the polyamic acid is (i) a polyamic acid which includes a tetracarboxylic acid component including 10 to 100 mol% of 4,4'-oxydiphthalic acid and 90 to 0 mol% of 3,3',4,4'-biphenyltetracarboxylic acid and/or pyromellitic acid and a diamine component including an aromatic diamine having 1 to 4 aromatic rings, (ii) a polyamic acid which includes a tetracarboxylic acid component including 3,3',4,4'-biphenyltetracarboxylic acid dianhydride and a diamine component including 10 to 90 mol% of p-phenylene diamine and 90 to 10 mol% of 4,4'-diaminodiphenyl ether, or (iii) a polyamic acid which includes a tetracarboxylic acid component including 3,3',4,4'-biphenyltetracarboxylic acid dianhydride and a diamine component including 40 mol% or more of a bis[4-(4-aminophenoxy)phenyl] compound.