-
1.PRINTABLE SEMICONDUCTOR STRUCTURES AND RELATED METHODS OF MAKING AND ASSEMBLING 有权
Title translation: PRINTABLE半导体结构及制造和组装相关方法公开(公告)号:EP1915774A4
公开(公告)日:2012-05-02
申请号:EP06771761
申请日:2006-06-01
Applicant: UNIV ILLINOIS
Inventor: NUZZO RALPH G , ROGERS JOHN A , MENARD ETIENNE , LEE KEON JAE , KHANG DAHL-YOUNG , SUN YUGANG , MEITL MATTHEW , ZHU ZHENGTAO , KO HEUNG CHO , MACK SHAWN
IPC: H01L21/302 , B82Y10/00 , H01L21/336 , H01L21/683 , H01L21/8242 , H01L23/62 , H01L29/06 , H01L29/16 , H01L29/22 , H01L29/66 , H01L29/786 , H01L51/00 , H01R12/00 , H05K3/36
CPC classification number: H01L29/0665 , B82Y10/00 , H01L21/6835 , H01L27/1266 , H01L27/1292 , H01L29/0673 , H01L29/1606 , H01L29/22 , H01L29/66742 , H01L29/7781 , H01L29/78696 , H01L2221/6835 , H01L2221/68354 , H01L2221/68368 , H01L2221/68377 , H01L2924/0002 , H01L2924/1033 , H01L2924/19041 , H01L2924/30105 , H01L2924/3025 , H01L2924/00