-
1.CONTROLLED BUCKLING STRUCTURES IN SEMICONDUCTOR INTERCONNECTS AND NANOMEMBRANES FOR STRETCHABLE ELECTRONICS 审中-公开
标题翻译: GESTEUERTE KNICKSTRUKTUREN在HALBLEITERVERBINDUNGEN UND NANOMEMBRANENFÜRDEHNBARE ELEKTRONIKARTIKEL公开(公告)号:EP2064710A4
公开(公告)日:2011-05-04
申请号:EP07841968
申请日:2007-09-06
申请人: UNIV ILLINOIS
发明人: ROGERS JOHN A , MEITL MATTHEW , SUN YUGANG , KO HEUNG CHO , CARLSON ANDREW , CHOI WON MOOK , STOYKOVICH MARK , JIANG HANQING , HUANG YONGGANG , NUZZO RALPH G , KANG SEONG JUN , LEE KEON JAE , ZHU ZHENGTAO , MENARD ETIENNE , KIM HOON-SIK , KHANG DAHL-YOUNG , AHN JONG-HYUN
CPC分类号: H01L27/0688 , B81B3/0078 , B82Y10/00 , H01L21/6835 , H01L21/8221 , H01L21/8258 , H01L27/0605 , H01L27/1292 , H01L27/1446 , H01L27/281 , H01L29/0665 , H01L29/0673 , H01L29/16 , H01L29/1602 , H01L29/1606 , H01L29/20 , H01L29/7781 , H01L29/7842 , H01L29/78681 , H01L29/78696 , H01L31/0203 , H01L51/0097 , H01L2924/00011 , H01L2924/0002 , H01L2924/13091 , H01L2924/30105 , H05K1/0283 , H05K1/0313 , H05K3/20 , H05K2201/0133 , H05K2201/09045 , H05K2203/0271 , H01L2924/00 , H01L2224/80001 , H01L2924/00012
-
2.METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICONDUCTOR ELEMENTS 审中-公开
标题翻译: 方法与设备可打印的半导体元件的生产和装配公开(公告)号:EP1759422A4
公开(公告)日:2011-04-06
申请号:EP05755193
申请日:2005-06-02
申请人: UNIV ILLINOIS
发明人: NUZZO RALPH G , ROGERS JOHN A , MENARD ETIENNE , LEE KEON JAE , KHANG DAHL-YOUNG , SUN YUGANG , MEITL MATTHEW , ZHU ZHENGTAO
IPC分类号: H01L21/20 , B81C1/00 , H01L21/02 , H01L21/30 , H01L21/326 , H01L21/4763 , H01L21/77 , H01L23/48 , H01L27/01 , H01L29/06 , H01L29/08 , H01L29/786 , H01L31/0312 , H01L31/18
CPC分类号: H01L23/02 , B81C2201/0185 , B82Y10/00 , H01L21/02521 , H01L21/02603 , H01L21/02628 , H01L21/308 , H01L21/322 , H01L21/6835 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/29 , H01L24/32 , H01L24/80 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0753 , H01L27/1285 , H01L27/1292 , H01L29/04 , H01L29/06 , H01L29/0665 , H01L29/0673 , H01L29/0676 , H01L29/068 , H01L29/12 , H01L29/76 , H01L29/78603 , H01L29/78681 , H01L29/78696 , H01L31/0392 , H01L31/03926 , H01L31/1804 , H01L31/1864 , H01L31/1896 , H01L33/007 , H01L33/0079 , H01L33/32 , H01L2221/68368 , H01L2221/68381 , H01L2224/03 , H01L2224/0332 , H01L2224/0345 , H01L2224/03614 , H01L2224/0362 , H01L2224/05073 , H01L2224/05082 , H01L2224/05124 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/05552 , H01L2224/05553 , H01L2224/05554 , H01L2224/05555 , H01L2224/05644 , H01L2224/05666 , H01L2224/08225 , H01L2224/2919 , H01L2224/32225 , H01L2224/80 , H01L2224/80006 , H01L2224/80121 , H01L2224/80862 , H01L2224/80895 , H01L2224/83 , H01L2224/83005 , H01L2224/83121 , H01L2224/83192 , H01L2224/83193 , H01L2224/8385 , H01L2224/83862 , H01L2224/9202 , H01L2224/94 , H01L2224/95 , H01L2224/97 , H01L2924/00012 , H01L2924/01032 , H01L2924/0665 , H01L2924/10253 , H01L2924/10329 , H01L2924/12032 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/1305 , H01L2924/1306 , H01L2924/13063 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15159 , H01L2924/15162 , H01L2924/15788 , H01L2924/1579 , Y02E10/547 , Y02P70/521 , Y10S977/707 , Y10S977/724 , H01L2924/00014 , H01L2924/00
摘要: The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
摘要翻译: 本发明提供了用于制造可印刷的半导体元件和组装可印刷的半导体元件到衬底上表面的方法和装置。 方法,设备和设备部件本发明的能够产生宽范围的柔性电子和光电子器件和基底包含聚合物材料上的设备的阵列。 本发明因此提供了可拉伸的半导体结构,并且能够在拉伸构型良好的性能可拉伸电子器件。
-
3.PRINTABLE SEMICONDUCTOR STRUCTURES AND RELATED METHODS OF MAKING AND ASSEMBLING 有权
标题翻译: PRINTABLE半导体结构及制造和组装相关方法公开(公告)号:EP1915774A4
公开(公告)日:2012-05-02
申请号:EP06771761
申请日:2006-06-01
申请人: UNIV ILLINOIS
发明人: NUZZO RALPH G , ROGERS JOHN A , MENARD ETIENNE , LEE KEON JAE , KHANG DAHL-YOUNG , SUN YUGANG , MEITL MATTHEW , ZHU ZHENGTAO , KO HEUNG CHO , MACK SHAWN
IPC分类号: H01L21/302 , B82Y10/00 , H01L21/336 , H01L21/683 , H01L21/8242 , H01L23/62 , H01L29/06 , H01L29/16 , H01L29/22 , H01L29/66 , H01L29/786 , H01L51/00 , H01R12/00 , H05K3/36
CPC分类号: H01L29/0665 , B82Y10/00 , H01L21/6835 , H01L27/1266 , H01L27/1292 , H01L29/0673 , H01L29/1606 , H01L29/22 , H01L29/66742 , H01L29/7781 , H01L29/78696 , H01L2221/6835 , H01L2221/68354 , H01L2221/68368 , H01L2221/68377 , H01L2924/0002 , H01L2924/1033 , H01L2924/19041 , H01L2924/30105 , H01L2924/3025 , H01L2924/00
-
-