公开(公告)号：EP2064710A4

公开(公告)日：2011-05-04

申请号：EP07841968

申请日：2007-09-06

Applicant: UNIV ILLINOIS

Inventor： ROGERS JOHN A ,  MEITL MATTHEW ,  SUN YUGANG ,  KO HEUNG CHO ,  CARLSON ANDREW ,  CHOI WON MOOK ,  STOYKOVICH MARK ,  JIANG HANQING ,  HUANG YONGGANG ,  NUZZO RALPH G ,  KANG SEONG JUN ,  LEE KEON JAE ,  ZHU ZHENGTAO ,  MENARD ETIENNE ,  KIM HOON-SIK ,  KHANG DAHL-YOUNG ,  AHN JONG-HYUN

IPC: H01B7/06 ,  H01R35/00

CPC classification number: H01L27/0688 ,  B81B3/0078 ,  B82Y10/00 ,  H01L21/6835 ,  H01L21/8221 ,  H01L21/8258 ,  H01L27/0605 ,  H01L27/1292 ,  H01L27/1446 ,  H01L27/281 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/16 ,  H01L29/1602 ,  H01L29/1606 ,  H01L29/20 ,  H01L29/7781 ,  H01L29/7842 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0203 ,  H01L51/0097 ,  H01L2924/00011 ,  H01L2924/0002 ,  H01L2924/13091 ,  H01L2924/30105 ,  H05K1/0283 ,  H05K1/0313 ,  H05K3/20 ,  H05K2201/0133 ,  H05K2201/09045 ,  H05K2203/0271 ,  H01L2924/00 ,  H01L2224/80001 ,  H01L2924/00012

公开(公告)号：EP2064734A4

公开(公告)日：2014-03-26

申请号：EP07842903

申请日：2007-09-20

Applicant: UNIV ILLINOIS

Inventor： ROGERS JOHN A ,  NUZZO RALPH G ,  MEITL MATTHEW ,  KO HEUNG CHO ,  YOON JONGSEUNG ,  MENARD ETIENNE ,  BACA ALFRED J

IPC: H01L29/20 ,  B81C1/00 ,  B82Y10/00 ,  B82Y20/00 ,  H01L21/78 ,  H01L31/0687 ,  H01L31/072

CPC classification number: H01L31/0735 ,  B81C1/0046 ,  B81C2201/0191 ,  B82Y10/00 ,  B82Y20/00 ,  B82Y40/00 ,  H01L21/7813 ,  H01L29/155 ,  H01L29/20 ,  H01L31/03046 ,  H01L31/068 ,  H01L31/0687 ,  H01L31/072 ,  H01L31/0725 ,  H01L31/184 ,  H01L31/1844 ,  H01L33/0079 ,  H01L2924/0002 ,  Y02E10/52 ,  Y02E10/544 ,  Y02E10/547 ,  Y02P70/521 ,  Y10T156/1195 ,  H01L2924/00

Abstract: Provided are methods for making a device or device component by providing a multilayer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a plurality of transferable structures. The transferable structures are printed onto a device substrate or device component supported by a device substrate. The methods and systems provide means for making high-quality and low-cost photovoltaic devices, transferable semiconductor structures, (opto-)electronic devices and device components.

Abstract translation: 提供了通过提供具有多个功能层和多个释放层的多层结构来制造器件或器件部件的方法，并且通过分离一个或多个释放层从多层结构释放功能层以产生多个 可转让结构。 可转移结构被印刷到由器件衬底支撑的器件衬底或器件部件上。 这些方法和系统提供了制造高质量和低成本的光伏器件，可转移半导体结构（光电）器件和器件部件的手段。

公开(公告)号：EP1915774A4

公开(公告)日：2012-05-02

申请号：EP06771761

申请日：2006-06-01

Applicant: UNIV ILLINOIS

Inventor： NUZZO RALPH G ,  ROGERS JOHN A ,  MENARD ETIENNE ,  LEE KEON JAE ,  KHANG DAHL-YOUNG ,  SUN YUGANG ,  MEITL MATTHEW ,  ZHU ZHENGTAO ,  KO HEUNG CHO ,  MACK SHAWN

IPC: H01L21/302 ,  B82Y10/00 ,  H01L21/336 ,  H01L21/683 ,  H01L21/8242 ,  H01L23/62 ,  H01L29/06 ,  H01L29/16 ,  H01L29/22 ,  H01L29/66 ,  H01L29/786 ,  H01L51/00 ,  H01R12/00 ,  H05K3/36

CPC classification number: H01L29/0665 ,  B82Y10/00 ,  H01L21/6835 ,  H01L27/1266 ,  H01L27/1292 ,  H01L29/0673 ,  H01L29/1606 ,  H01L29/22 ,  H01L29/66742 ,  H01L29/7781 ,  H01L29/78696 ,  H01L2221/6835 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2221/68377 ,  H01L2924/0002 ,  H01L2924/1033 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/00

公开(公告)号：EP2104954A4

公开(公告)日：2016-02-17

申请号：EP07874095

申请日：2007-10-31

Applicant: UNIV ILLINOIS ,  SEMPRIUS INC

Inventor： ROGERS JOHN ,  NUZZO RALPH ,  MEITL MATTHEW ,  MENARD ETIENNE ,  BACA ALFRED J ,  MOTALA MICHAEL ,  AHN JONG-HYUN ,  PARK SANG-IL ,  YU CHANG-JAE ,  KO HEUNG CHO ,  STOYKOVICH MARK ,  YOON JONGSEUNG

IPC: H01L27/12 ,  B82Y10/00 ,  H01L25/075 ,  H01L29/786 ,  H01L31/054 ,  H01L31/0725 ,  H01L31/18 ,  H01S5/42

CPC classification number: H01L21/00 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L25/042 ,  H01L25/0753 ,  H01L25/167 ,  H01L25/50 ,  H01L27/1214 ,  H01L27/124 ,  H01L27/1285 ,  H01L27/1292 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14643 ,  H01L29/78603 ,  H01L29/78681 ,  H01L31/02005 ,  H01L31/02008 ,  H01L31/02168 ,  H01L31/02325 ,  H01L31/02327 ,  H01L31/0288 ,  H01L31/03046 ,  H01L31/043 ,  H01L31/0525 ,  H01L31/0543 ,  H01L31/0547 ,  H01L31/0693 ,  H01L31/0725 ,  H01L31/167 ,  H01L31/1804 ,  H01L31/1824 ,  H01L31/1868 ,  H01L31/1876 ,  H01L31/1892 ,  H01L33/005 ,  H01L33/0079 ,  H01L33/06 ,  H01L33/30 ,  H01L33/483 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0091 ,  H01S5/021 ,  H01S5/02284 ,  H01S5/183 ,  H01S5/3013 ,  H01S5/34326 ,  H01S5/423 ,  Y02E10/52 ,  Y02E10/547 ,  Y02P70/521 ,  H01L2924/00

Abstract: Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity.

Abstract translation: 提供的是至少部分地通过基于印刷的组装和器件部件的集成制造的光学器件和系统。 在具体实施方案中，本发明提供包括大面积高性能宏电子器件的可印刷半导体元件的发光系统，光收集系统，光感测系统和光伏系统。 本发明的光学系统包括通过印刷技术组装，组织和/或与其它器件部件集成的半导体元件，其显示与使用常规高温处理方法制造的基于单晶半导体的器件相似的性能特征和功能。 本发明的光学系统具有通过提供一系列有用的器件功能的打印访问的器件几何形状和配置，诸如形状因子，部件密度和部件位置。 本发明的光学系统包括显示一系列有用的物理和机械性能的装置和装置阵列，包括灵活性，可塑性，适应性和可伸长性。

公开(公告)号：EP1759422A4

公开(公告)日：2011-04-06

申请号：EP05755193

申请日：2005-06-02

Applicant: UNIV ILLINOIS

Inventor： NUZZO RALPH G ,  ROGERS JOHN A ,  MENARD ETIENNE ,  LEE KEON JAE ,  KHANG DAHL-YOUNG ,  SUN YUGANG ,  MEITL MATTHEW ,  ZHU ZHENGTAO

IPC: H01L21/20 ,  B81C1/00 ,  H01L21/02 ,  H01L21/30 ,  H01L21/326 ,  H01L21/4763 ,  H01L21/77 ,  H01L23/48 ,  H01L27/01 ,  H01L29/06 ,  H01L29/08 ,  H01L29/786 ,  H01L31/0312 ,  H01L31/18

CPC classification number: H01L23/02 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02521 ,  H01L21/02603 ,  H01L21/02628 ,  H01L21/308 ,  H01L21/322 ,  H01L21/6835 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/04 ,  H01L29/06 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/12 ,  H01L29/76 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03926 ,  H01L31/1804 ,  H01L31/1864 ,  H01L31/1896 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/32 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/03 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/03614 ,  H01L2224/0362 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2224/08225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/80 ,  H01L2224/80006 ,  H01L2224/80121 ,  H01L2224/80862 ,  H01L2224/80895 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15788 ,  H01L2924/1579 ,  Y02E10/547 ,  Y02P70/521 ,  Y10S977/707 ,  Y10S977/724 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

Abstract translation: 本发明提供了用于制造可印刷的半导体元件和组装可印刷的半导体元件到衬底上表面的方法和装置。 方法，设备和设备部件本发明的能够产生宽范围的柔性电子和光电子器件和基底包含聚合物材料上的设备的阵列。 本发明因此提供了可拉伸的半导体结构，并且能够在拉伸构型良好的性能可拉伸电子器件。