ELEMENTAL SILICON NANOPARTICLE PLATING AND METHOD FOR THE SAME
    3.
    发明公开
    ELEMENTAL SILICON NANOPARTICLE PLATING AND METHOD FOR THE SAME 审中-公开
    纳米硅的从小学及其方法分离

    公开(公告)号:EP1444386A4

    公开(公告)日:2007-02-07

    申请号:EP02780390

    申请日:2002-09-30

    申请人: UNIV ILLINOIS

    摘要: According to the invention, silicon nanoparticles are applied to a substrate using an electrochemical plating process, analogous to metal plating. An electrolysis tank of an aqueous or non-aqueous solution, such as alcohol, ether, or other solvents in which the particles are dissolved operates at a current flow between the electrodes. In applying silicon nanoparticles to a silicon, metal, or non-conducting substrate, a selective area plating may be accomplished by defining areas of different conductivity on the substrate. Silicon nanoparticle composite platings and stacked alternating material platings are also possible. The addition of metal ions into the silicon nanoparticle solution produces a composite material plating. Either composite silicon nanoparticle platings or pure silicon nanoparticle platings may be stacked with each other or with convention metal platings.

    FAMILY OF DISCRETELY SIZED SILICON NANOPARTICLES AND METHOD FOR PRODUCING THE SAME
    6.
    发明公开
    FAMILY OF DISCRETELY SIZED SILICON NANOPARTICLES AND METHOD FOR PRODUCING THE SAME 审中-公开
    家庭的硅纳米颗粒用于生产连续的尺寸和工艺

    公开(公告)号:EP1446355A4

    公开(公告)日:2007-11-21

    申请号:EP02803286

    申请日:2002-10-18

    申请人: UNIV ILLINOIS

    摘要: A family of discrete and uniformly sized silicon nanoparticles, including 1 (blue emitting), 1.67 (green emitting), 2.15 (yellow emitting), 2.9 (red emitting) and 3.7 nm (infrared emitting) nanoparticles, and a method that produces the family. The nanoparticles produced by the method of the invention are highly uniform in size. A very small percentage of significantly larger particles are produced, and such larger particles are easily filtered out. The method for producing the silicon nanoparticles of the invention utilizes a gradual advancing electrochemical etch of bulk silicon, e.g., a silicon wafer (10). The etch is conducted with use of an appropriate intermediate or low etch current density. An optimal current density for producing the family is ~ 10 milli Ampere per square centimeter (10mA/cm2). Higher current density favors l nm particles, and lower the larger particles. Blue (1 nm) particles, if any appreciable quantity exist depending on the selected current density, may be removed by, for example, shaking or ultrasound. After the etch, the pulverized wafer is immersed in dilute HF for a short time, while the particles are still connected to the wafer to weaken the linkages between the larger particles. This may be followed by separation of nanoparticles from the surface of the silicon. Once separated, various methods may be employed to form plural nanoparticles into crystals, films and other desirable forms. The nanoparticles may also be coated or doped. The invention produces the family of a discrete set of sized particles and not a continuous size distribution. Particles may be isolated from the family, i.e., it is possible to produce any one of the sizes of particles from the family after the basic method steps have been executed to produce the family of particles.