Abstract:
Reregistration system for determining and positioning the location of a wafer substrate target surface (275) with respect to a plurality of charged particle beams used to directly write an integrated circuit pattern simultaneously at a plurality of locations on the substrate. Reregistration is accomplished by scanning two or more of the charged particle beams (100, 150) over a corresponding number of reregistration fiducial marks (200, 250) on the substrate (275). The reregistration marks (200, 250) may consist of a material having a high atomic number or predefined topographical features. Electrons scattered from these marks (200, 250) are detected and converted to electrical signals. The temporal relationship between the scanning beams (100, 150) and the resultant electrical signals may then be used to determine substrate location.
Abstract:
Method of fabricating aperture and lens array plates (100, 200) in silicon using photo or electron beam lithographic patterning followed by indiffusion of boron and anisotropic silicon etching and assembling to form screen lenses. In one embodiment, a screen lens is formed of one each aperture and lens plate (100, 200), mounted back-to-back. In another embodiment, a screen lens is formed of a single lens (or aperture) plate (400).