公开(公告)号：EP1994196A1

公开(公告)日：2008-11-26

申请号：EP07758228.6

申请日：2007-03-09

申请人： VEECO INSTRUMENTS INC.

发明人： SFERLAZZO, Piero ,  MAO, Ming ,  CHEN, Jinliang ,  FELSENTHAL, David ,  HIERONYMI, Robert, Gabriel ,  EROR, Miroslav

IPC分类号： C23C14/50 ,  C23C14/35

CPC分类号： C23C14/352 ,  C23C14/505 ,  C23C14/568 ,  C23C14/5833

摘要： The present invention relates to a sputter deposition system 10 and to methods of use thereof for processing substrates 12 using planetary sputter deposition methods. The sputter deposition system 10 includes a deposition chamber 14 having an azimuthal axis 16. A rotatable member 30 and 32 is situated in the chamber 14 and includes a plurality of magnetrons 34 provided thereon. Each magnetron 34 includes a corresponding one of a plurality of sputtering targets 36. The rotatable member 30, 32 is configured to position each of the magnetrons 34 to direct sputtered material from the corresponding one of the sputtering targets 36 to a deposition zone 50 defined in the deposition chamber 14. A transport mechanism 66 is situated in the deposition chamber 14 and includes an arm 68 rotatable about the azimuthal axis 16. A substrate holder 72 is attached to the arm 68 of the transport mechanism 66 and supports the substrate 12 as the arm 68 rotates the substrate holder 72 to intersect the deposition zone 50 for depositing sputtered material on the substrate 12.