利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

889 条记录 (耗时 0.027 秒)

    ELECTROLESS COPPER OR COPPER ALLOY PLATING BATH AND METHOD FOR PLATING
    8.
    发明公开
    ELECTROLESS COPPER OR COPPER ALLOY PLATING BATH AND METHOD FOR PLATING 审中-公开

    公开(公告)号：EP3578683A1

    公开(公告)日：2019-12-11

    申请号：EP18176836.7

    申请日：2018-06-08

    申请人： Atotech Deutschland GmbH

    发明人： KULKO, Roman-David ,  ZARWELL, Sebastian ,  KLAEDEN, Kilian ,  PETER, Anna ,  BECK, Birgit

    IPC分类号： C23C18/40 ,  C23C18/48

    摘要： An electroless copper plating bath for depositing a copper or copper alloy layer on a surface of a substrate, comprising
    a) copper ions;
    b) at least one reducing agent suitable for reducing copper ions to metallic copper;
    c) at least one complexing agent for copper ions;
    characterized in that the electroless copper plating bath further comprises
    d) at least one compound according to formula (1):

    wherein
    Z 1 and Z 2 are independently selected from the group consisting of hydrogen; carboxylic acid group; carboxylate group; sulfonic acid group; sulfonate group; carboxamide group; nitrile group; nitro group; substituted or non-substituted trialkylammonium group; substituted or non-substituted 2-carboxyvinyl group; substituted or non-substituted 2-vinylcarboxylate group; substituted or non-substituted 2-(trialkylammonium)vinyl group; substituted or non-substituted hydroxamic acid group; and substituted or non-substituted oxime group;
    with the proviso that at least one of Z 1 and Z 2 is not hydrogen;
    and
    wherein R 1 , R 2 , R 3 and R 4 are defined as follows:
    i. R 1 , R 2 , R 3 and R 4 are hydrogen; or
    ii. R 1 with R 2 are forming together a substituted or non-substituted aromatic ring moiety, R 3 and R 4 are hydrogen; or
    iii. R 3 with R 4 are forming together a substituted or non-substituted aromatic ring moiety, R 1 and R 2 are hydrogen; or
    iv. R 1 with R 2 as well as R 3 with R 4 are forming together a substituted or non-substituted aromatic ring moiety, respectively.


    The invention further concerns a method for depositing at least a copper or copper alloy layer on a surface of a substrate, a layer system and a kit-of-parts for providing the inventive electroless copper plating bath.