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1.发明公开
公开(公告)号：EP2581156A4
公开(公告)日：2015-02-25
申请号：EP11792572
申请日：2011-06-10
IPC分类号： B22F9/00 , B22F1/00 , B22F1/02 , B82Y30/00 , C22C5/06 , H01B1/00 , H01B1/22 , H01L21/52 , H01L23/00 , H05K3/32 , H05K3/34
CPC分类号： C09J1/00 , B22F1/0018 , B22F1/0062 , B22F2303/10 , B22F2998/00 , B32B37/12 , B82Y30/00 , C22C5/06 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2224/29 , H01L2224/29101 , H01L2224/29299 , H01L2224/29339 , H01L2224/838 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/1301 , H01L2924/13033 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15747 , H05K3/32 , H05K3/3463 , H05K2201/0224 , H05K2201/0257 , H05K2203/1131 , B22F2303/01 , B22F2301/255 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/2929
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2.发明授权
公开(公告)号：EP2581156B1
公开(公告)日：2016-06-01
申请号：EP11792572.7
申请日：2011-06-10
IPC分类号： B22F9/00 , B22F1/00 , B22F1/02 , H01B1/00 , H01B1/22 , H01L21/52 , H05K3/32 , H01L23/00 , H05K3/34 , B82Y30/00 , C22C5/06
CPC分类号： C09J1/00 , B22F1/0018 , B22F1/0062 , B22F2303/10 , B22F2998/00 , B32B37/12 , B82Y30/00 , C22C5/06 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2224/29 , H01L2224/29101 , H01L2224/29299 , H01L2224/29339 , H01L2224/838 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/1301 , H01L2924/13033 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15747 , H05K3/32 , H05K3/3463 , H05K2201/0224 , H05K2201/0257 , H05K2203/1131 , B22F2303/01 , B22F2301/255 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/2929
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3.发明公开LOW-TEMPERATURE-SINTERABLE BONDING MATERIAL, AND BONDING METHOD USING THE BONDING MATERIAL 有权BEI NIEDRIGER TEMPERATUR烧烤炉BINDEMATERIAL SOWIE BINDEVERFAHREN MIT DEM BINDEMATERIAL
公开(公告)号：EP2581156A1
公开(公告)日：2013-04-17
申请号：EP11792572.7
申请日：2011-06-10
CPC分类号： C09J1/00 , B22F1/0018 , B22F1/0062 , B22F2303/10 , B22F2998/00 , B32B37/12 , B82Y30/00 , C22C5/06 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2224/29 , H01L2224/29101 , H01L2224/29299 , H01L2224/29339 , H01L2224/838 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/1301 , H01L2924/13033 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15747 , H05K3/32 , H05K3/3463 , H05K2201/0224 , H05K2201/0257 , H05K2203/1131 , B22F2303/01 , B22F2301/255 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/2929
摘要： Provided is a bonding material which enables formation of a bonded article in nitrogen, and can exhibit bonding strength to withstand practical use while having reduced bonding fluctuations between samples without a heat treatment procedure under pressurized or high temperature conditions.
The bonding material comprises: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic substance having 8 carbon atoms or less; a dispersion medium having a boiling point of 230°C or higher; and a flux component including an organic matter having at least two carboxyl groups. Particularly, it is preferable to use the silver nanoparticles and submicron silver particles in combination.摘要翻译： 提供一种能够在氮气中形成接合体的接合材料，并且在加压或高温条件下，在不进行热处理的情况下，可以显示接合强度以抵抗实际应用，同时降低样品之间的接合波动。 接合材料包括：平均一次粒径为1〜200nm的银纳米粒子，并涂布有碳原子数为8以下的有机物质; 沸点为230℃以上的分散介质; 以及包含具有至少两个羧基的有机物质的助熔剂成分。 特别优选组合使用银纳米粒子和亚微米银粒子。
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