INJECTION DEVICE AND RESIN INJECTION METHOD

    公开(公告)号:EP2505334B1

    公开(公告)日:2018-12-05

    申请号:EP10832990.5

    申请日:2010-10-14

    Abstract: As an injection screw 2 applies pressure, a holding pressure plunger 22 is moved backward under the pressure of a resin to flow the resin into a holding pressure path 9, and the resin in a resin path 6 is pressurized (primary holding pressure process). A shutoff plunger 12 is closed, and the resin in the resin path 6 and the holding pressure path 9 is pressurized by the holding pressure plunger 22 (secondary holding pressure process). Further, the shutoff plunger 12 is opened, and the holding pressure plunger 22 is moved forward until its tip projects into the resin path 6 to discharge all the resin in the holding pressure path 9 to the resin path 6, whereby the resin beside the injection screw 2 as compared with the shutoff plunger 12 is held with respect to the holding pressure path 9.

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