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公开(公告)号：EP1393881A2
公开(公告)日：2004-03-03
申请号：EP03027012.8
申请日：2000-12-14
IPC分类号： B29C45/76
CPC分类号： B29C45/14836 , B29C45/14065 , B29C45/14655 , B29C45/1671 , B29C45/2673 , B29C45/561 , B29C45/7653 , B29C45/82 , B29C2045/14098 , B29C2945/76006 , B29C2945/76307 , B29C2945/76498 , B29C2945/76531 , B29C2945/76568 , B29C2945/76732 , B29C2945/76785
摘要： A resin sealing method for semiconductor devices, which is designed to thoroughly accommodate board thickness variations and prevent formation of burrs and which is easy to maintain. To this end, a first clamping step with 70-80% of the ordinary force is carried out until the mould is filled by an amount of 80-90% of the complete filling. Thereafter, the clamping force is increased to 100% of the ordinary force.
摘要翻译： 一种用于半导体器件的树脂密封方法，其被设计成完全适应板厚变化并防止毛刺形成并且易于维护。 为此，进行具有70-80％普通力的第一夹紧步骤，直到模具填充完全填充物的80-90％的量。 此后，夹紧力增加到普通力的100％。
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公开(公告)号：EP1238775A1
公开(公告)日：2002-09-11
申请号：EP00981706.5
申请日：2000-12-14
发明人： OGATA, Kenji, c/o Dai-Ichi Seiko Co Ltd , NISHIGUCHI, Masashi, c/o Dai-Ichi Seiko Co Ltd , MITSUI, Yoshihiro, c/o Dai-Ichi Seiko Co Ltd
CPC分类号： B29C45/14836 , B29C45/14065 , B29C45/14655 , B29C45/1671 , B29C45/2673 , B29C45/561 , B29C45/7653 , B29C45/82 , B29C2045/14098 , B29C2945/76006 , B29C2945/76307 , B29C2945/76498 , B29C2945/76531 , B29C2945/76568 , B29C2945/76732 , B29C2945/76785
摘要： A resin sealing mold for semiconductor devices, which is designed to thoroughly accommodate board thickness variations and prevent formation of burrs and which is easy to maintain. To this end, a plurality of pistons (42) supporting, at one of their respective ends, lower mold cavities (56) have the other ends thereof slidably inserted in hydraulic cylinder blocks installed on lower mold sets (40).
摘要翻译： 一种用于半导体器件的树脂密封模具，其被设计成彻底地适应板厚变化并防止毛刺的形成并且易于维护。 为此，在其各自的一端处支撑下模腔（56）的多个活塞（42）的另一端可滑动地插入安装在下模组（40）上的液压缸体中。
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3.发明公开
公开(公告)号：EP0897786A3
公开(公告)日：2002-03-20
申请号：EP98810777.7
申请日：1998-08-13
申请人： K.K. Holding AG
CPC分类号： G05B13/024 , B29C45/76 , B29C45/77 , B29C2045/776 , B29C2945/76006 , B29C2945/76257 , B29C2945/76384 , B29C2945/76531 , B29C2945/76561 , B29C2945/76595 , B29C2945/76658 , B29C2945/76732 , B29C2945/76862 , B29C2945/76876 , B29C2945/76979
摘要： Eine Spritzgiessanlage mit einer von einer Regeleinheit (5) aufgrund vorgegebener Regelparameter wie Einspritzgeschwindigkeit, Nachdruckhöhe, Nachdruckzeit und Formtemperatur geregelten Einspritzvorrichtung (4) weist eine Auswerteeinheit (11) auf, die jeweils auf der Grundlage eines Druckverlaufs, der mittels eines in Angussnähe in einer Kavität (2) angeordneten Drucksensors (12) ermittelt wird, die Regelparameter auf Bestehen eines Nachregelungsbedarfs überprüft und gegebenenfalls korrigiert. Dabei werden jeweils aus dem Druckverlauf, meist unter Heranziehung eines einem Gutteil entsprechenden Referenzverlaufs, Führungsgrössen bestimmt, aus denen mittels eines neuronalen Netzes eine Bewertung für den Regelparameter abgeleitet wird. Werden z. B. bei mindestens zwei voraufgehenden Schüssen bestimmte Schwellen überschreitende auf einen zu hohen Wert deutende Abweichungen der Bewertung der Nachdruckhöhe festgestellt, so wird sie für den nächsten Schuss mit einem ebenfalls ermittelten Korrekturfaktor
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公开(公告)号：EP3248749A1
公开(公告)日：2017-11-29
申请号：EP16171037.1
申请日：2016-05-24
申请人： TcTech Sweden AB
发明人： Jäderberg, Jan
IPC分类号： B29C33/06 , B29C45/73 , B29C45/76 , B29C45/78 , B29C51/42 , B29C51/46 , B29C59/02 , B29C33/02
CPC分类号： B29C45/78 , B29C33/02 , B29C45/73 , B29C45/76 , B29C51/42 , B29C51/421 , B29C51/46 , B29C59/02 , B29C2035/0811 , B29C2945/76033 , B29C2945/76254 , B29C2945/76531 , B29C2945/76732 , B29C2945/76933 , B29C2945/76946
摘要： The present disclosure relates to a method and a device for determining the temperature of an active surface in a plastic embossing tool. A tool half is fed with a high frequency AC current. The voltage, current and phase difference input to the tool is determined, and from these parameters, a resistivity of a top layer, where a greater part of the heat development takes place, is determined. This resistivity in turn can be used to determine the temperature in the top layer. Using this information, a manufacturing process can be closely monitored and controlled, for instance to ensure that a minimum temperature is attained for a predetermined time during embossing.
摘要翻译： 本公开涉及用于确定塑料压印工具中的活性表面的温度的方法和设备。 一半工具用高频AC电流供电。 确定输入到工具的电压，电流和相位差，并且从这些参数确定发生大部分热发生的顶层的电阻率。 该电阻率又可用于确定顶层中的温度。 利用这些信息，可以密切监测和控制制造过程，例如确保压花过程中达到预定时间的最低温度。
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公开(公告)号：EP2507028A4
公开(公告)日：2013-11-27
申请号：EP10832450
申请日：2010-11-17
CPC分类号： B29C45/7626 , B29C45/04 , B29C45/1761 , B29C45/1769 , B29C45/2618 , B29C45/40 , B29C45/4005 , B29C45/4225 , B29C45/64 , B29C45/66 , B29C45/76 , B29C45/80 , B29C2045/1785 , B29C2045/363 , B29C2045/4068 , B29C2045/4078 , B29C2945/76387 , B29C2945/76418 , B29C2945/76732 , B29D1/00 , B29L2031/748 , Y10S425/809
摘要： Described herein is a mold. The mold includes a first mold half and a second mold half. A molding cavity is definable between the first mold half and the second mold half within which a molded article is moldable. The mold also includes a core configured to form a seal on the molded article. The first mold half and the second mold half are configured to remain in a mold closed configuration with molding and stripping of the molded article.
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6.发明授权
公开(公告)号：EP0897786B1
公开(公告)日：2006-03-22
申请号：EP98810777.7
申请日：1998-08-13
申请人： Kistler Holding AG
CPC分类号： G05B13/024 , B29C45/76 , B29C45/77 , B29C2045/776 , B29C2945/76006 , B29C2945/76257 , B29C2945/76384 , B29C2945/76531 , B29C2945/76561 , B29C2945/76595 , B29C2945/76658 , B29C2945/76732 , B29C2945/76862 , B29C2945/76876 , B29C2945/76979
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公开(公告)号：EP0960012B8
公开(公告)日：2005-10-26
申请号：EP98907502.3
申请日：1998-02-11
申请人： Moldflow Corporation
发明人： TRIPLETT, Timothy
IPC分类号： B29C45/80 , B29C45/76 , G05B19/042
CPC分类号： B29C45/1774 , B29C33/0083 , B29C45/27 , B29C45/76 , B29C45/78 , B29C2945/76006 , B29C2945/7604 , B29C2945/76254 , B29C2945/76531 , B29C2945/76732 , B29C2945/76993
摘要： The present invention relates to injection mold hot runner control devices and more particularly to an injection molding control device. The present invention utilizes a signal processor (13) to convert analog signals received from mold temperature sensors (5) into a digital signal in the vicinity of a mold (1) and to transmit such feedback signal to a receiver (4) connected to a controller at a location remote from the mold. The mold controller (4) processes the feedback signal and generates a corresponding control signal. The control signal is transmitted from the remotely located controller (4) to the controlled device, typically mold heaters. A single controller and a single mold signal processor may be used to be able to control numerous molds by utilizing signals on different lines or frequencies or in other means of signal differentiation known to those skilled in the art.
摘要翻译： 注射模具热流道控制装置技术领域本发明涉及注射模具热流道控制装置，尤其涉及一种注射模制控制装置 本发明利用信号处理器（13）将从模具温度传感器（5）接收到的模拟信号转换成模具（1）附近的数字信号，并将该反馈信号传输到连接到模具 控制器在远离模具的位置。 模具控制器（4）处理反馈信号并产生相应的控制信号。 控制信号从远程控制器（4）传送到受控设备，通常是模具加热器。 可以使用单个控制器和单个模具信号处理器来通过利用不同线路或频率上的信号或本领域技术人员已知的其他信号区分手段来控制大量模具。
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公开(公告)号：EP1412158A1
公开(公告)日：2004-04-28
申请号：EP02749725.4
申请日：2002-07-01
发明人： DUROUX, Bernard , SETTIER, Roger
IPC分类号： B29C45/56
CPC分类号： B29D11/00596 , B29C45/561 , B29C45/77 , B29C2045/0079 , B29C2045/5635 , B29C2045/567 , B29C2945/76006 , B29C2945/76257 , B29C2945/76391 , B29C2945/76575 , B29C2945/76732 , B29C2945/76869 , B29K2995/0026 , B29L2011/0058 , B60R1/082
摘要： A method of manufacture of high optical quality transparent plastic for use as a mirror or glass substitute.
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公开(公告)号：EP0960012A4
公开(公告)日：2002-03-27
申请号：EP98907502
申请日：1998-02-11
申请人： AMERICAN MSI CORP
发明人： TRIPLETT TIMOTHY
IPC分类号： B29C45/73 , B29C33/00 , B29C45/17 , B29C45/27 , B29C45/76 , B29C45/78 , B29C45/80 , G05B19/042
CPC分类号： B29C45/1774 , B29C33/0083 , B29C45/27 , B29C45/76 , B29C45/78 , B29C2945/76006 , B29C2945/7604 , B29C2945/76254 , B29C2945/76531 , B29C2945/76732 , B29C2945/76993
摘要： The present invention relates to injection mold hot runner control devices and more particularly to an injection molding control device. The present invention utilizes a signal processor (13) to convert analog signals received from mold temperature sensors (5) into a digital signal in the vicinity of a mold (1) and to transmit such feedback signal to a receiver (4) connected to a controller at a location remote from the mold. The mold controller (4) processes the feedback signal and generates a corresponding control signal. The control signal is transmitted from the remotely located controller (4) to the controlled device, typically mold heaters. A single controller and a single mold signal processor may be used to be able to control numerous molds by utilizing signals on different lines or frequencies or in other means of signal differentiation known to those skilled in the art.
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公开(公告)号：EP3326732A4
公开(公告)日：2018-08-01
申请号：EP15898884
申请日：2015-07-17
申请人： EISHIN TECH CO LTD
发明人： KUBO CHIKANARI
CPC分类号： B22C7/02 , B29C45/67 , B29C67/241 , B29C2945/76568 , B29C2945/76658 , B29C2945/76732 , B29K2091/00
摘要： Provided is a clamp device having a simple and low-cost vertical movement mechanism 5b for making the height of a sprue 4a of a rubber mold 3 equal to an injection nozzle 7 of a wax injection molding machine for producing a wax model. The clamp device has: a clamp mechanism section 5a, which is provided with a mounting table 9 for mounting the mold 3, a clamp plate 10, and a clamp drive unit 11 for changing vertical distance between the mounting table 9 and the clamp plate 10; and a vertical movement mechanism 5b for vertically moving the clamping mechanism section 5a. The mold 3 is clamped when the clamp drive unit changes the distance between the mounting table and the clamp plate from a first distance L to a second distance L'. The vertical movement mechanism 5b moves the clamp mechanism section 5a by (L - L')/n (where 1.5 ‰¤ n ‰¤ 2.5).
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