摘要:
The present invention discloses, inter alia, a micro-electromechanical device (MEMD) for sensing and for harvesting electrical energy responsive to being subjected to mechanical forces, comprising at least one first conductive element fixedly mounted on a first support, wherein the at least one first conductive element is chargeable with electrons; and at least one second conductive element inertia-mounted on a second support such that the first and second supports are electrically isolated from each other.
摘要:
L'invention concerne une membrane en carbone amorphe pour un microsystème électromécanique, la membrane en carbone amorphe présentant une épaisseur comprise enre 1 nm et 50 nm, et de préférence comprise entre 3 nm et 20 nm, dans laquelle la membrane en carbone amorphe présente un taux d'hybridation de type sp 3 compris entre 20% et 40%.
摘要:
The invention describes an electrostatic microgenerator (1) having electret films (2, 22) which are arranged above one another in a double layer and each have a metal layer arranged on one side thereof as an electrode. The films are embedded in a hermetically sealed casing in a loosely wound manner. Applying pressure to a first desired pressure surface (8), which is provided on the outside parallel to the capacitor plates (3, 4) formed in this manner, makes it possible to generate an electrical voltage by changing the distance between the capacitor plates (3, 4).
摘要:
The present invention relates to a semiconductor device, comprising a semiconductor substrate (10) having a first (12a) and a second (12b) side. There is provided at least one via (15) extending through said substrate (10) having first (16a) and second (16b) end surfaces, said first end surface (16a) constituting an transducer electrode for interacting with a movable element (14) arranged at the first side (12a) of the substrate (10). A shield (17) is provided on and covers at least part of the first side (12a) of the substrate (10), the shield/mask (17) comprising a conductive layer (19a) and an insulating material layer (19b) provided between the substrate (10) and the conductive layer (19a). The mask has an opening (18) exposing only a part of the first surface (16a) of the via. Preferably the opening (18) in the mask is precisely aligned with the movable element, and the area of the opening is accurately defined.