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    POLYMERIC MATERIALS
    2.
    发明公开
    POLYMERIC MATERIALS 审中-公开
    聚合物材料

    公开(公告)号：EP3030603A1

    公开(公告)日：2016-06-15

    申请号：EP14742310.7

    申请日：2014-07-14

    申请人： Victrex Manufacturing Limited

    发明人： WOOD, Alan

    IPC分类号： C08J5/12 ,  B32B27/28

    CPC分类号： C08L61/16 ,  B29C45/16 ,  B29K2071/00 ,  B29K2271/00 ,  B29L2015/00 ,  B32B3/12 ,  B32B7/02 ,  B32B27/12 ,  B32B27/288 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2262/101 ,  B32B2262/106 ,  B32B2307/704 ,  B32B2307/714 ,  B32B2605/003 ,  C08J5/12 ,  C08J2371/00

    摘要： A component comprises a first part and a second part, wherein said second part is in contact with said first part, wherein: (i) said first part comprises a first polymer which is semi-crystalline and includes phenylene moieties, carbonyl moieties and ether moieties; (ii) said second part comprises a second polymer which is semi-crystalline and includes phenylene moieties, carbonyl moieties and ether moieties; (iii) the melting temperature (Tm) of the second polymer is less than the melting temperature (Tm) of the first polymer. In a preferred embodiment, said first polymer is polyetheretherketone and said second polymer is a copolymer having a repeat unit of formula VIII and a repeat unit of formula IX.

    摘要翻译： 组件包含第一部分和第二部分，其中所述第二部分与所述第一部分接触，其中：（i）所述第一部分包含第一聚合物，其为半结晶且包含亚苯基部分，羰基部分和醚部分 ; （ii）所述第二部分包含第二聚合物，所述第二聚合物是半结晶的且包含亚苯基部分，羰基部分和醚部分; （iii）第二聚合物的熔化温度（Tm）小于第一聚合物的熔化温度（Tm）。 在一个优选的实施方案中，所述第一聚合物是聚醚醚酮，并且所述第二聚合物是具有式VIII的重复单元和式IX的重复单元的共聚物。

    THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE OF SAME
    3.
    发明公开
    THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE OF SAME 审中-公开
    热塑性树脂组合物形式的制品THEREOF

    公开(公告)号：EP2452980A4

    公开(公告)日：2015-01-14

    申请号：EP10797203

    申请日：2010-07-09

    申请人： DAICEL EVONIK LTD

    发明人： MUTSUDA MITSUTERU

    IPC分类号： C08L71/10

    CPC分类号： C08L61/16 ,  C08G2650/40 ,  C08L71/00 ,  Y10T428/26

    摘要： A thermoplastic resin composition of which the molding efficiency can be improved by a high flowability and a high crystallization temperature while ensuring desired physical properties (e.g., strength) in a molded product, and a molded product of the composition are provided. The thermoplastic resin composition comprises a plurality of thermoplastic resins having a melt viscosity different from each other and containing a unit which comprises an arylene group and an ether group and/or a carbonyl group; when the thermoplastic resin composition at least comprises a first thermoplastic resin having a melt viscosity of 150 to 1500 Pa · s at a temperature of 400°C and a shear rate of 1216 s -1 , and a second thermoplastic resin, and the melt viscosity ratio of the first thermoplastic resin relative to the second thermoplastic resin at a temperature of 400°C and a shear rate of 1216 s -1 [the former/the latter] is 1.5/1 to 10/1, the resin composition has a flowability and mechanical properties compatible with each other and an increased crystallization temperature, and shortens the molding cycle.

    RESIN COMPOSITION AND MOLDED ARTICLE
    5.
    发明授权
    RESIN COMPOSITION AND MOLDED ARTICLE 有权

    公开(公告)号：EP2592116B1

    公开(公告)日：2018-02-28

    申请号：EP11803468.5

    申请日：2011-06-27

    申请人： Tsinghua University ,  Daikin Industries, Ltd.

    发明人： XIE Xuming ,  MASUDA Haruhisa

    IPC分类号： C08L71/10 ,  C08L27/18 ,  C08L61/16 ,  C08L71/00

    CPC分类号： C08L61/16 ,  C08G2650/40 ,  C08L27/18 ,  C08L71/00 ,  C08L71/10

    摘要： Provided is a resin composition capable of giving a molded article that has a low coefficient of kinetic friction and a high limiting PV value. The resin composition comprises an aromatic polyether ketone resin (I), and a fluororesin (II), the fluororesin (II) being a copolymer of tetrafluoroethylene and a perfluoroethylenic unsaturated compound represented by the following formula (1): €ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒCF 2 =CF-R f 1 €ƒ€ƒ€ƒ€ƒ€ƒ(1) wherein R f 1 represents -CF 3 or -OR f 2 , and R f 2 represents a C1 to C5 perfluoroalkyl group; the composition comprising the aromatic polyether ketone resin (I) and the fluororesin (II) at a mass ratio (I):(II) of 95:5 to 50:50; the fluororesin (II) being dispersed as particles in the aromatic polyether ketone resin (I) and having an average dispersed particle size of 3.0 µm or smaller.

    RESIN COMPOSITION AND MOLDED ARTICLE
    9.
    发明公开
    RESIN COMPOSITION AND MOLDED ARTICLE 有权
    HARZZUSAMMENSETZUNG UND FORMARTIKEL

    公开(公告)号：EP2592116A1

    公开(公告)日：2013-05-15

    申请号：EP11803468.5

    申请日：2011-06-27

    申请人： Tsinghua University ,  Daikin Industries, Ltd.

    发明人： XIE Xuming ,  MASUDA Haruhisa

    IPC分类号： C08L71/10 ,  C08L27/18

    CPC分类号： C08L61/16 ,  C08G2650/40 ,  C08L27/18 ,  C08L71/00 ,  C08L71/10

    摘要： Provided is a resin composition capable of giving a molded article that has a low coefficient of kinetic friction and a high limiting PV value. The resin composition comprises an aromatic polyether ketone resin (I), and a fluororesin (II), the fluororesin (II) being a copolymer of tetrafluoroethylene and a perfluoroethylenic unsaturated compound represented by the following formula (1):

            CF 2 =CF-R f 1      (1)

    wherein R f 1 represents -CF 3 or -OR f 2 , and R f 2 represents a C1 to C5 perfluoroalkyl group; the composition comprising the aromatic polyether ketone resin (I) and the fluororesin (II) at a mass ratio (I):(II) of 95:5 to 50:50; the fluororesin (II) being dispersed as particles in the aromatic polyether ketone resin (I) and having an average dispersed particle size of 3.0 µm or smaller.

    摘要翻译： 本发明提供能够提供具有低动力摩擦系数和高限制PV值的成型体的树脂组合物。 树脂组合物包含芳族聚醚酮树脂（I）和氟树脂（II），氟树脂（II）是四氟乙烯和由下式（1）表示的全氟烯属不饱和化合物的共聚物：€ƒ€ƒ€ ƒ€ƒ€ƒ€ƒCF2 = CF-R f 1€ƒ€ƒ€ƒƒ（1）其中R f 1表示-CF 3或-OR f 2，R f 2表示 C1〜C5全氟烷基; 所述组合物的质量比（I）：（II）为95:5〜50:50的芳族聚醚酮树脂（I）和所述氟树脂（II） 氟树脂（II）作为颗粒分散在芳族聚醚酮树脂（I）中，平均分散粒径为3.0μm以下。