利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

8 条记录 (耗时 0.006 秒)

    CURABLE AND ELECTRICALLY DEBONDABLE ONE-COMPONENT (1K) STRUCTURAL ADHESIVE COMPOSITION
    2.
    发明公开
    CURABLE AND ELECTRICALLY DEBONDABLE ONE-COMPONENT (1K) STRUCTURAL ADHESIVE COMPOSITION 审中-公开

    公开(公告)号：EP4353760A1

    公开(公告)日：2024-04-17

    申请号：EP22201244.5

    申请日：2022-10-13

    申请人： Henkel AG & Co. KGaA

    发明人： Chou, Kang Wei ,  Engels, Thomas ,  Stapf, Stefanie ,  Kamm, Thomas

    IPC分类号： C08F285/00 ,  C08F287/00 ,  C08F290/04 ,  C09J4/06 ,  C09J5/00 ,  C09J9/02 ,  C09J151/04 ,  C09J151/06

    CPC分类号： C09J4/06 ,  C09J2301/50220200801 ,  C09J5/00 ,  C09J9/02 ,  C09J2203/32620130101 ,  C08F290/048 ,  C08F287/00 ,  C08F285/00 ,  C09J151/04 ,  C09J151/06

    摘要： The present invention relates to a curable and electrochemically debondable one-component (1K) structural adhesive composition comprising a) a (meth)acrylate monomer selected from the group consisting of hydroxypropyl acrylate, hydroxypropyl methacrylate, hydroxybutyl methacrylate, isobornyl acrylate, isobornyl methacrylate, methyl methacrylate and mixtures thereof; b) an electrolyte selected from the group consisting of 1-butyl-3-methylimidazolium bis(trifluoromethylsulfonyl) imide, 1-pentyl-3-methylimidazolium bis (trifluoromethylsulfonyl) imide, 1-hexyl-3-methylimidazolium bis (trifluoromethylsulfonyl) imide, 1-heptyl-3-methylimidazolium bis (trifluoromethylsulfonyl) imide, 1-octyl-3-methylimidazolium bis (trifluoromethylsulfonyl) imide, 1-nonyl-3-methylimidazolium bis (trifluoromethylsulfonyl) imide, 1-decyl-3-methylimidazolium bis (trifluoromethylsulfonyl) imide, 1-dodecyl-3-methylimidazolium bis (trifluoromethylsulfonyl) imide, 1-tetradecyl-3-methylimidazolium bis (trifluoromethylsulfonyl) imide, 1-hexadecyl-3-methylimidazolium bis (trifluoromethylsulfonyl) imide, 1-octadecyl-3-methylimidazolium bis (trifluoromethylsulfonyl) imide, trihexyltetradecylphosphonium bis (trifluoromethylsulfonyl) amide, and mixtures thereof; c) a co-polymerisable acid; d) an initiator; e) a core shell toughener; and f) a toughener. The composition according to the present invention can withstand harsh conditions (high temperature and high humidity) while maintaining adhesive and debonding properties.