Cooling system for a semiconductor element, semiconductor module including such a system and a thermally conductive member therefor
    4.
    发明公开
    Cooling system for a semiconductor element, semiconductor module including such a system and a thermally conductive member therefor 失效
    用于半导体元件的冷却系统,半导体模块,其包括这样的系统和用于热传导的散热片。

    公开(公告)号:EP0413565A1

    公开(公告)日:1991-02-20

    申请号:EP90308941.5

    申请日:1990-08-14

    申请人: HITACHI, LTD.

    摘要: A cooling system for a semiconductor element (2) comprises a heat flow path including a thermally conductive member (3) interposed between a surface of the element (2) and a surface (6a) of a cooling block (6) for conducting heat between them. The member (3) is slidable relative to at least one of the surfaces at a region of sliding contact. To reduce wear, without reducing thermal conductivity, at the region of sliding contact, at least one of the thermally conductive member (3) and the surface contacted thereby carries a fixed thin film (13) comprising fluorine-containing lubricant, of thickness preferably in the range 2 nm to 100 nm. The fluorine-containing lubricant is chemically bonded to the surface carrying it, or alternatively the thin film comprises the fluorine-­containing lubricant and a support layer therefor fixed to the surface carrying said thin film, molecules of said lubricant being anchored in the support layer.

    摘要翻译: 的半导体元件(2)的冷却系统包括一个热量流动路径包含一个热传导部件(3)的元件的表面之间夹(2)和冷却块的表面(6A)(6)之间进行热 它们。 所述构件(3)相对于所述表面中的至少一个可滑动的滑动接触的一个区域。 为了减少磨损,在不降低导热性,在滑动接触的区域中,所述导热构件(3),并因此接触的表面中的至少一个带有固定的薄膜(13)包含含有氟基润滑剂,厚度的优选 取值范围为2纳米至100纳米。含氟润滑剂化学键合到表面携带它,或者可替换地,所述薄膜包括含氟润滑剂和支撑层为此固定在表面承载所述薄膜,所述的分子 润滑剂被锚定在所述支撑层。