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    HEIGHT MEASURING METHOD FOR THREE DIMENSIONAL SHAPE MEASURING DEVICE
    2.
    发明公开
    HEIGHT MEASURING METHOD FOR THREE DIMENSIONAL SHAPE MEASURING DEVICE 有权
    三维形状测量装置的高度测量方法

    公开(公告)号：EP2853855A1

    公开(公告)日：2015-04-01

    申请号：EP13794392.4

    申请日：2013-05-22

    Applicant: Koh Young Technology Inc.

    Inventor： JEONG, Joong Ki ,  HONG, Deok-Hwa

    IPC: G01B11/25

    CPC classification number: G01B11/14 ,  G01B11/0608 ,  G01B11/2513 ,  G01B11/2531 ,  G01B2210/56

    Abstract: A method of measuring a height of 3-dimensional shape measurement apparatus includes irradiating a first grid pattern light from a plurality of first lighting devices and a second grid pattern light from a plurality of second lighting devices which are alternatively arranged to the first lighting devices toward a target object wherein the first grid pattern light has a first equivalent wavelength and the second grid pattern light has a second equivalent wavelength that is different from the first equivalent wavelength, and obtaining a first pattern image corresponding to the first grid pattern light and a second pattern image corresponding to the second grid pattern light, generating combined pattern images by combining the first and second pattern images obtained from the first and second lighting devices adjacent to each other among the plurality of first and second lighting devices, calculating heights of the target object according to a combined equivalent wavelength of the combined pattern images, and determining a representative height of the target object by using the calculated heights of the target object. And therefore, it is possible to measure a height of a target object which exceeds an available height of measurement by each of the first and second lighting devices, as well as, more accurate and reliable height may be obtained.

    Abstract translation: 测量三维形状测量设备的高度的方法包括：将来自多个第一照明设备的第一栅格图案光和来自交替布置到第一照明设备的多个第二照明设备的第二栅格图案光朝向 其中第一栅格图案光具有第一等效波长并且第二栅格图案光具有与第一等效波长不同的第二等效波长，并且获得与第一栅格图案光对应的第一图案图像和第二栅格图案光 通过组合从第一照明装置和第二照明装置中的彼此相邻的第一照明装置和第二照明装置获得的第一图案图像和第二图案图像，生成组合图案图像，计算目标物体的高度 根据联合收割机的组合等效波长 d图案图像，并且通过使用所计算的目标物体的高度来确定目标物体的代表性高度。 因此，可以测量超过第一和第二照明装置中的每一个的可用测量高度的目标物体的高度，并且可以获得更精确和可靠的高度。

    Apparatus and techniques for determining object depth in images
    3.
    发明公开
    Apparatus and techniques for determining object depth in images 审中-公开
    Bildern的Vorrichtung und Techniken zur Bestimmung einer Objekttiefe

    公开(公告)号：EP2779092A1

    公开(公告)日：2014-09-17

    申请号：EP14159087.7

    申请日：2014-03-12

    Applicant: Intel Corporation

    Inventor： Aviv, Ziv ,  Stanhill, David

    IPC: G06T7/00 ,  G01B11/25

    CPC classification number: G01C11/025 ,  G01B11/2513 ,  G01B11/2531 ,  G01B11/2536 ,  G06T7/521 ,  G06T2207/20016

    Abstract: An apparatus may include an emitter to project a low resolution optical pattern and a high resolution optical pattern having a finer resolution than the low resolution optical pattern and a sensor to detect a composite image, where the composite image comprises a low resolution optical reflection pattern comprising reflection of the projected low resolution optical pattern and a high resolution optical reflection pattern comprising a reflection of the projected high resolution optical pattern. The apparatus may also include logic to determine object depth in a first depth range and object depth in a second depth range based upon the detected composite image. Other embodiments are disclosed and claimed.

    Abstract translation: 装置可以包括发射器以投影低分辨率光学图案和具有比低分辨率光学图案更精细的分辨率的高分辨率光学图案和用于检测合成图像的传感器，其中合成图像包括低分辨率光学反射图案，其包括 投射的低分辨率光学图案的反射和包括投射的高分辨率光学图案的反射的高分辨率光学反射图案。 该装置还可以包括基于检测到的合成图像来确定第一深度范围中的物体深度和第二深度范围内的物体深度的逻辑。 公开并要求保护其他实施例。

    Messanordnung und Verfahren zum Vermessen einer dreidimensional ausgedehnten Struktur
    6.
    发明公开
    Messanordnung und Verfahren zum Vermessen einer dreidimensional ausgedehnten Struktur 有权
    测量装置和方法，用于测量三维扩展结构

    公开(公告)号：EP1901031A3

    公开(公告)日：2010-06-23

    申请号：EP07017870.2

    申请日：2007-09-12

    Applicant: Micro-Epsilon Optronic GmbH

    Inventor： Stautmeister, Torsten, Dipl.-Ing. ,  Schüller, Tobias, Dr.-Ing.

    IPC: G01B11/24 ,  G01B11/25

    CPC classification number: G01B11/2518 ,  G01B11/2531

    Abstract: Eine Messanordnung zum Vermessen einer dreidimensional ausgedehnten Struktur mittels eines optischen Sensors (2), wobei der Sensor (2) einen sich quer zur optischen Achse (4) erstreckenden Messbereich (5) ausweist, ist in Hinblick auf eine präzise und relativ schnelle Vermessung der dreidimensional ausgedehnten Struktur bei einfachem Aufbau der Messanordnung und geringen Kosten derart weitergebildet, dass die Messanordnung (1) eine Spiegelanordnung (3) mit mehreren Spiegeln (9, 12, 13) umfasst, die den Messbereich (5) des Sensors (2) zunächst über einen oder mehrere Spiegel (9) in mindestens zwei divergierende Bereiche (10, 11) aufteilt und die die divergierenden Bereiche (10, 11) über einen oder mehrere weitere Spiegel (12, 13) wieder derart zusammenführt, dass sich die Bereiche (14, 15) in einem Messfeld (16) schneiden, wobei in dem Messfeld (16) eine Vermessung der dreidimensional ausgedehnten Struktur erfolgt. Ein entsprechendes Verfahren ist angegeben.

    ARRANGEMENT AND METHOD FOR MEASURING SURFACE IRREGULARITIES AT AN OBJECT
    7.
    发明授权
    ARRANGEMENT AND METHOD FOR MEASURING SURFACE IRREGULARITIES AT AN OBJECT 有权
    测量表面的设备和方法不平整的物体

    公开(公告)号：EP1192415B1

    公开(公告)日：2008-12-10

    申请号：EP01904723.2

    申请日：2001-02-08

    Applicant: Volvo Personvagnar AB

    Inventor： MAX, Erland ,  LARSSON, Peter

    IPC: G01B11/30

    CPC classification number: G01B11/2504 ,  G01B11/2513 ,  G01B11/2531 ,  G01B11/30

    Abstract: Arrangement and method for measuring surface irregularities at an object, which arrangement comprises at least one source of light arranged to illuminate the object from at least two different positions at a small angle of incidence towards the object, a camera arranged to measure the shadow formation generated by said illumination of the surface microstructure, and an evaluting means for determining the surface microstructure from the generated shadow formation by means of signal processing of an input signal from said camera.

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