公开(公告)号：EP3490361B1

公开(公告)日：2024-10-09

申请号：EP16909500.7

申请日：2016-07-20

IPC: H05K13/04 ,  H05K13/08

CPC classification number: H05K13/04 ,  H05K13/0473 ,  H05K13/087 ,  H05K13/0815

公开(公告)号：EP3048439A1

公开(公告)日：2016-07-27

申请号：EP13893900.4

申请日：2013-09-17

Applicant: Fuji Machine Mfg. Co., Ltd.

Inventor： NAKAJIMA, Mikio ,  INAGAKI, Mitsutaka

IPC: G01N21/956 ,  G01B11/30 ,  H05K13/08

CPC classification number: H05K13/08 ,  G01N2021/95638 ,  H05K13/0815

Abstract: A mounting inspection device 40 performs foreign object inspection on a printed circuit board for a printed circuit board on which a missing component of components P which are mounted thereon is detected, based on results of missing component inspection. The mounting inspection device 40 does not perform the foreign object inspection on a printed circuit board on which a missing component is not detected by the missing component inspection. The mounting inspection device 40 acquires missing component position information which is information relating to a position in which a missing component is detected in the printed circuit board, and preferentially performs the foreign object inspection on a periphery of the missing component position which is specified by the missing component position information in the printed circuit board. The mounting inspection device 40 acquires missing component conveying information which is information relating to a conveyance path over the printed circuit board when mounting the component which is the detected missing component, and preferentially performs the foreign object inspection on the regions which are specified by the missing component conveying information in the printed circuit board.

Abstract translation: 基于缺少部件检查的结果，安装检查装置40对印刷电路板的印刷电路板进行异物检查，印刷电路板上安装有其上的部件P的缺失部件被检测到。 安装检查装置40不对通过缺失部件检查未检测到缺失部件的印刷电路板进行异物检查。 安装检查装置40获取作为在印刷电路板中检测到缺失成分的位置的信息的缺失部件位置信息，并且优先在由所述印刷电路板指定的缺失部件位置的周边进行异物检查 在印刷电路板中缺少组件位置信息。 当安装作为检测到的缺失部件的部件时，安装检查装置40获取与印刷电路板上的传送路径相关的信息的缺失部件传送信息，并且优先对由缺失部件指定的区域执行异物检查 在印刷电路板中传送信息的部件。

公开(公告)号：EP4428814A1

公开(公告)日：2024-09-11

申请号：EP24162347.9

申请日：2024-03-08

Applicant: Göpel electronic GmbH ,  Robert Bosch GmbH

Inventor： KOKOTT, Jens ,  HAUSWALD, Frank ,  MAGER, Christiane ,  RATCHEV, Roumen ,  MANIAR, Youssef ,  GLEICHAUF, Jonas

IPC: G06T7/00 ,  G01B11/06 ,  G01B11/14

CPC classification number: G06T7/00 ,  G01B11/0608 ,  G01B11/14 ,  H05K13/0815

Abstract: Die Erfindung betrifft eine Vorrichtung und ein Verfahren zur Messung eines Spaltes (13) an einer Seitenfläche (B) eines Bauteils (11) auf einer mittels automatischer optischer Inspektion zu prüfenden Leiterplatte (1) umfassend eine Kameraanordnung (2), die mindestens eine unter einem Neigungswinkel α zu der Leiterplatte (1) angeordnete geneigte Kamera (21) enthält, um eine Seitenfläche (B) eines Bauteils (11) zur Untersuchung eines Spalts (13) abzubilden, eine Beleuchtungseinrichtung (3) mit einer gerichteten Beleuchtung (31;32), die eine orthogonale Ausrichtung zur Leiterplatte (1) aufweist, eine Transporteinrichtung (5), die für eine relative Bewegung zwischen Leiterpatte (1), Kameraanordnung (2) und Beleuchtungseinrichtung (3) so ausgebildet ist, dass eine Neigungswinkelebene (22) der geneigten Kamera (21) einen rechten Winkel zu der Seitenfläche (B) des Bauteils (11) einstellbar ist, und eine Steuer- und Auswerteeinrichtung (4), durch die die Beleuchtungseinrichtung (3) mindestens in der Helligkeit steuerbar ist, und synchron dazu durch die mindestens eine geneigte Kamera (21) Bilder der Seitenfläche (B) des Bauteils (11) aufnehmbar sind, und eine Bildauswerteeinheit (42) zum Detektieren von im Bild der geneigten Kamera (21) vorhandenen Kantenverläufen, aus denen eine Spaltbreite b ermittelbar ist.

公开(公告)号：EP3410834A1

公开(公告)日：2018-12-05

申请号：EP16887959.1

申请日：2016-01-29

Applicant: Fuji Corporation

Inventor： SHIBATA, Mitsuhiko

IPC: H05K13/04 ,  H05K13/08

CPC classification number: H05K13/0812 ,  H05K13/0815 ,  H05K13/0882

Abstract: To provide an electronic component mounting machine (5) and a production line (1) having high accuracy of mounting electronic components (P1 to P6). The electronic component mounting machine (5) includes an image-capturing device (571) and a control device (50). The image-capturing device (571) captures the images of sub-fiducial marks (F1 to F3) and main fiducial marks (f1 to f4). When the control device (50) can read the main fiducial marks (f1 to f4) from the images captured by the image-capturing device (571), the control device (50) determines the mounting positions of the electronic components (P1 to P6) with respect to a substrate (8) with reference to the main fiducial marks (f1 to f4). On the other hand, when the main fiducial marks (f1 to f4) cannot be read from the images due to a print defect of the main fiducial marks (f1 to f4), the control device (50) determines the mounting positions of the electronic components (P1 to P6) with respect to the substrate (8) with reference to the sub-fiducial marks (F1 to F3) which are the reference sources of the image-capturing positions of the main fiducial marks (f1 to f4).

公开(公告)号：EP2477468B1

公开(公告)日：2018-03-07

申请号：EP11186471.6

申请日：2011-10-25

Applicant: Omron Corporation

Inventor： Matsushita, Akira ,  Mori, Hiroyuki ,  Kawata, Akihiro ,  Yoshida, Masaomi

IPC: H05K13/08 ,  G05B19/418

CPC classification number: G05B19/41875 ,  G05B2219/37439 ,  G05B2219/37448 ,  H05K13/0815 ,  H05K13/083 ,  Y02P90/04 ,  Y02P90/22 ,  Y02P90/265 ,  Y02P90/86

Abstract: An inspection means is selected for each component of a substrate to be inspected or each inspection item to be performed, and inspection information is readily generated by each inspection machine based on the selection result. A component specifying processing unit (21) specifies a position and a component type of each component from design information of a substrate to be processed. An inspection item recognition unit (22) references a component type table (202) and recognizes an inspection item necessary for the specified component, an inspection means selection unit references an inspection machine capability table (203) and selects an inspection means that performs inspection of each inspection item. By this processing, inspection menu information is generated, the inspection menu information associating, for each component, the component type and position information of the component with the inspection item performed on the component and information indicating the inspection means. Each inspection machine receives input of the inspection menu information and recognizes a component for which inspection by the inspection machine is defined, and generates inspection information by associating an inspection program with the position information of the component according to the component type of the component.

公开(公告)号：EP2654393A2

公开(公告)日：2013-10-23

申请号：EP13001915.1

申请日：2013-04-12

Applicant: Yamaha Hatsudoki Kabushiki Kaisha

Inventor： Ookawa, Naonobu

IPC: H05K13/08

CPC classification number: G01N23/04 ,  H05K13/08 ,  H05K13/0815

Abstract: Disclosed is an inspection machine provided with an imaging device that capture a close-up image of the imaging target portion of the printed circuit board (W) on which a plurality of electronic components (C) are mounted, by coming close to a printed circuit board (W). The inspection machine has a sensor unit (120) that detects the heights of the electronic components (C) on the printed circuit board (W) by irradiation light (Ll, L2) in a first direction that is along the surface of the printed circuit board (W). Control means (600) of the inspection machine sets a limit distance to a position above the highest electronic component (C) among heights detected from the electronic components. The control means (600) also restricts a facing distance by which the imaging device is accepted to approach the printed circuit board (W), to be the limit distance.

Abstract translation: 本发明提供了一种检测机器，其具有成像装置，其通过靠近印刷电路捕获其上安装有多个电子部件（C）的印刷电路板（W）的成像目标部分的特写图像 板（W）。 检查机具有传感器单元（120），其通过沿着印刷电路表面的第一方向上的照射光（L1，L2）来检测印刷电路板（W）上的电子部件（C）的高度 板（W）。 检查机的控制装置（600）在从电子部件检测到的高度之间设定到高于最高电子部件（C）的位置的极限距离。 控制装置（600）也限制成像装置被接受以接近印刷电路板（W）的面对距离，作为极限距离。

公开(公告)号：EP3735122B1

公开(公告)日：2024-07-17

申请号：EP18895879.7

申请日：2018-12-28

IPC: G01B11/06 ,  H05K13/08 ,  H01R43/20 ,  H01R12/58

CPC classification number: H01R12/58 ,  H01R43/205 ,  H05K13/083 ,  H05K13/0815 ,  G01B11/0608

公开(公告)号：EP3937598B1

公开(公告)日：2024-07-10

申请号：EP19918130.6

申请日：2019-03-05

IPC: H05K3/34 ,  G01N21/956 ,  H05K13/04 ,  H05K13/08

CPC classification number: H05K13/04 ,  G01N21/956 ,  H05K3/34 ,  H05K13/083 ,  H05K13/0815 ,  H05K13/0817

公开(公告)号：EP3413029A1

公开(公告)日：2018-12-12

申请号：EP17747815.3

申请日：2017-02-06

Applicant: Koh Young Technology Inc.

Inventor： KIM, Kwan Seong ,  KIM, Myung Ho ,  PARK, Nam Kyu ,  KIM, Joo Hyuk

IPC: G01M11/02 ,  G01M11/06 ,  G01N21/88 ,  G01N21/13 ,  H05K13/08

CPC classification number: G01M11/02 ,  G01M11/06 ,  G01N21/13 ,  G01N21/88 ,  H05K13/0815 ,  H05K13/089

Abstract: A method of verifying a fault of an inspection unit, an inspection apparatus, and an inspection system are disclosed. The method according to the present disclosure includes: providing a verification reference body which is formed on a frame attached to an inspection system; placing the inspection unit on the verification reference body; obtaining image data of the verification reference body through the inspection unit; verifying a fault of the inspection unit by extracting a movement error and height error of the inspection unit from the image data; and generating a verification result indicating the fault of the inspection unit.

公开(公告)号：EP3330663A1

公开(公告)日：2018-06-06

申请号：EP16830821.1

申请日：2016-07-26

Applicant: Koh Young Technology Inc.

Inventor： SEO, Seung Ae ,  LEE, Yeon Hee ,  AHN, Won Mi ,  LEE, Hye In ,  LEE, Jong Hui

IPC: G01B11/24 ,  G01B11/25 ,  G01B11/26 ,  G01N21/88 ,  G06T7/00 ,  G06T7/60 ,  H01L21/66 ,  G01B11/27 ,  G01R31/28 ,  G01N21/956 ,  H05K3/30 ,  H05K13/08

CPC classification number: G06T7/001 ,  G01B11/24 ,  G01B11/25 ,  G01B11/2513 ,  G01B11/2527 ,  G01B11/2531 ,  G01B11/26 ,  G01B11/272 ,  G01B2210/56 ,  G01N21/956 ,  G01N2021/95638 ,  G01R31/2813 ,  G06T7/00 ,  G06T7/60 ,  G06T15/20 ,  G06T2207/10028 ,  G06T2207/20092 ,  G06T2207/30141 ,  H05K3/303 ,  H05K13/0815

Abstract: Disclosed are a substrate inspection apparatus and a method for displaying a component in a three-dimensional inspection of a substrate. The substrate inspection apparatus measures a substrate or an inspection target region of interest of the substrate and displays an image of components positioned within the measured region on a display unit. The image of the components displayed on the display unit may be displayed in a predetermined reference direction. The difference between the reference direction and a direction in which the actual component is disposed on the substrate is displayed in the form of a numerical value or a figure. Alternatively, the image of the component in the reference direction and the image of the actually disposed component are simultaneously displayed on a screen, and a user may convert a display method of the image by using a toggle button.