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    HIGH-SPEED, 3-D METHOD AND SYSTEM FOR OPTICALLY INSPECTING PARTS
    1.
    发明公开
    HIGH-SPEED, 3-D METHOD AND SYSTEM FOR OPTICALLY INSPECTING PARTS 审中-公开
    零件光学检测3D HIGH SPEED的方法和系统

    公开(公告)号：EP2823289A1

    公开(公告)日：2015-01-14

    申请号：EP13757558.5

    申请日：2013-03-01

    申请人： GII Acquisition, LLC DBA General Inspection, LLC

    发明人： NYGAARD, Michael, G. ,  NYGAARD, Gregory, M.

    IPC分类号： G01N21/952

    CPC分类号： G01N21/8851 ,  G01N21/9515 ,  G01N21/952 ,  G01N2201/0415 ,  G01N2201/102

    摘要： A high-speed, 3-D method and system for optically inspecting parts are provided. The system includes a part transfer subsystem including a transfer mechanism adapted to support a part at a loading station and transfer the supported part from the loading station to an inspection station at which the part has a predetermined position and orientation for inspection. The system also includes an illumination assembly to simultaneously illuminate an end surface of the part and a peripheral surface of the part. The system further includes a lens and detector assembly to form an optical image of the illuminated end surface and an optical image of the illuminated peripheral surface of the part and to detect the optical images. The system still further includes a processor to process the detected optical images to obtain an end view of the part and a 3-D panoramic view of the peripheral surface of the part.

    Apparatus for measuring bend amount of IC leads
    7.
    发明公开
    Apparatus for measuring bend amount of IC leads 失效
    测量IC引线弯曲量的设备

    公开(公告)号：EP0560096A2

    公开(公告)日：1993-09-15

    申请号：EP93102569.6

    申请日：1993-02-18

    申请人： NEC CORPORATION

    发明人： Kida, Tomoyuki, c/o NEC Corporation

    IPC分类号： H01L21/66

    CPC分类号： H01L21/67288 ,  G01N21/95684 ,  G01N2021/8887 ,  G01N2021/95661 ,  G01N2201/102 ,  G01R31/311 ,  H01L21/67271 ,  H01L22/00 ,  H05K13/08

    摘要： A lead-bend measuring apparatus comprising: an illuminating device (4a-4e) for projecting light onto leads projecting from a package of an integrated circuit device; an imaging device (1,10,11) for imaging light reflected from and transmitted through the leads; a cutout device (16,19b) for fetching an image of the imaged light and dividing the image into a plurality of sections; a binarization processing device (17,20b) for processing gradations of the image with different binarization levels for each of the divided sections; a profile counter device (21) for preparing profiles of various portions of the leads corresponding to the respective sections from binarized data subjected to processing by the binarization processing device; a calculating device (22,25) for calculating a deviation of each of the prepared profiles from a reference profile and determining an amount of bend of each of the leads; and a device (24) for determining a non-defective or defective state by making a comparison between the amount of bent calculated and allowable values. The respective sections are processed by corresponding binarization levels to measure the bend of leads, so that clear binarized images are obtained even if the illuminance of the various portions of the leads is not uniform.

    摘要翻译： 一种引线弯曲测量装置，包括：照明装置（4a-4e），用于将光投射到从集成电路装置的封装突出的引线上; 成像装置（1,10,11），用于对从所述引线反射并透过所述引线的光进行成像; （16,19b），用于提取成像光的图像并将图像分成多个部分; 二值化处理装置（17,20b），用于针对每个分割部分处理具有不同二值化级别的图像的灰度; 一个配置文件计数器装置（21），用于根据由二进制化处理装置进行处理的二进制数据，准备对应于各个部分的引线各部分的轮廓; 计算装置（22,25），用于计算每个准备好的分布与参考分布的偏差并确定每个引线的弯曲量; 以及用于通过比较弯曲的计算量和允许值来确定无缺陷或缺陷状态的设备（24）。 通过相应的二值化等级处理各个部分以测量引线的弯曲，使得即使引线的各个部分的照度不均匀，也可以获得清晰的二值化图像。

    INSPECTING GARMENTS
    9.
    发明公开
    INSPECTING GARMENTS 失效
    控制服装。

    公开(公告)号：EP0526489A1

    公开(公告)日：1993-02-10

    申请号：EP91907741.0

    申请日：1991-04-05

    申请人： DE MONTFORT UNIVERSITY

    发明人： NORTON-WAYNE, Leonard Leicester Polytechnic ,  ABBASSZADEH, Siavash Leicester Polytechnic

    IPC分类号： A41H43 ,  D06H3 ,  G01N21

    CPC分类号： D06H3/08 ,  G01N21/8983 ,  G01N2021/8887 ,  G01N2201/102

    摘要： On décrit un procédé de contrôle d'articles d'habillement afin de déceler des trous. Dans ledit procédé, l'article est éclairé par l'avant sur un fond contrasté et on en forme une image à pixels. On isole les pixels de l'article des pixels du fond en choisissant automatiquement un seuil de gris optimal de binarisation; on binarise l'image à ce niveau, détermine les limites de l'article, contrôle l'uniformité du niveau de gris à l'intérieur des limites de l'article sur l'image binarisée le long de rangées et de colonnes de pixels dans les limites de l'article, et on relève les pixels non concordants. Les trous sont identifiés seulement sur la base des pixels qui se sont révélés non concordants dans le test horizontal et le test vertical.