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15 条记录 (耗时 0.008 秒)

    Polishing apparatus having interlock function
    1.
    发明公开
    Polishing apparatus having interlock function 失效
    Poliervorrichtung mit Verriegelungsfunktion

    公开(公告)号：EP1704962A2

    公开(公告)日：2006-09-27

    申请号：EP06013931.8

    申请日：1997-05-28

    申请人： EBARA CORPORATION

    发明人： Watanabe, Katsuhide

    IPC分类号： B24B1/00 ,  B24B37/04

    CPC分类号： B24B37/005 ,  B24B49/16 ,  G05B19/4063 ,  G05B19/416 ,  G05B2219/37434 ,  G05B2219/45199 ,  G05B2219/50113 ,  G05B2219/50205 ,  G05B2219/50276

    摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus having interlock function comprises a turntable having a polishing surface thereon, a top ring for holding a workpiece to be polished and pressing the workpiece against the polishing surface on the turntable, a first motor for rotating the turntable, and a second motor for rotating the top ring. The polishing apparatus further comprises a first actuator for lifting and lowering the top ring, a second actuator for moving the top ring in a horizontal direction, and a control unit for controlling the motors and the actuators . The control unit controls the motors and the actuators in such a manner that when an abnormality is detected in at least one of the motors and the actuators, at least one of the motors and the actuators other than that of abnormality performs a predetermined operation.

    摘要翻译： 一种用于抛光工件表面的抛光装置，包括：在其上具有抛光表面的转台（1）; 用于保持要抛光的工件并将工件压靠在所述转台上的所述抛光表面上的顶环（2） 用于修整所述转盘的所述抛光表面的修整工具（21）; 用于旋转所述修整工具的马达（22）; 用于提升和降低所述修整工具的致动器（23） 控制单元（10），用于控制所述电动机和所述致动器; 其中所述控制单元以这样的方式控制所述马达（22）和所述致动器（23），使得当在所述抛光装置中检测到异常时，所述修整工具被提起并且所述修整工具的旋转停止。

    Polishing apparatus having interlock function
    3.
    发明公开
    Polishing apparatus having interlock function 失效
    抛光设备具有互锁功能

    公开(公告)号：EP0810064A2

    公开(公告)日：1997-12-03

    申请号：EP97108597.2

    申请日：1997-05-28

    申请人： EBARA CORPORATION

    发明人： Watanabe, Katsuhide

    IPC分类号： B24B1/00

    CPC分类号： B24B37/005 ,  B24B49/16 ,  G05B19/4063 ,  G05B19/416 ,  G05B2219/37434 ,  G05B2219/45199 ,  G05B2219/50113 ,  G05B2219/50205 ,  G05B2219/50276

    摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus having interlock function comprises a turntable having a polishing surface thereon, a top ring for holding a workpiece to be polished and pressing the workpiece against the polishing surface on the turntable, a first motor for rotating the turntable, and a second motor for rotating the top ring. The polishing apparatus further comprises a first actuator for lifting and lowering the top ring, a second actuator for moving the top ring in a horizontal direction, and a control unit for controlling the motors and the actuators. The control unit controls the motors and the actuators in such a manner that when an abnormality is detected in at least one of the motors and the actuators, at least one of the motors and the actuators other than that of abnormality performs a predetermined operation.

    Polishing apparatus having interlock function
    4.
    发明公开
    Polishing apparatus having interlock function 失效
    抛光设备具有互锁功能

    公开(公告)号：EP1704962A3

    公开(公告)日：2007-08-01

    申请号：EP06013931.8

    申请日：1997-05-28

    申请人： EBARA CORPORATION

    发明人： Watanabe, Katsuhide

    IPC分类号： B24B1/00 ,  B24B37/04

    CPC分类号： B24B37/005 ,  B24B49/16 ,  G05B19/4063 ,  G05B19/416 ,  G05B2219/37434 ,  G05B2219/45199 ,  G05B2219/50113 ,  G05B2219/50205 ,  G05B2219/50276

    摘要： A polishing apparatus for polishing a surface of a workpiece, comprising:
    a turntable (1) having a polishing surface thereon;
    a top ring (2) for holding a workpiece to be polished and pressing the workpiece against said polishing surface on said turntable;
    a dressing tool (21) for dressing said polishing surface of said turntable;
    a motor (22) for rotating said dressing tool;
    an actuator (23) for lifting and lowering said dressing tool;
    a control unit (10) for controlling said motors and said actuator;
    wherein said control unit controls said motor (22) and said actuator (23) in such a manner that when an abnormality is detected in said polishing apparatus, said dressing tool is lifted and rotation of said dressing tool is stopped.

    Polishing apparatus having interlock function
    6.
    发明公开
    Polishing apparatus having interlock function 失效
    具有联锁功能的抛光装置

    公开(公告)号：EP1213094A2

    公开(公告)日：2002-06-12

    申请号：EP02004882.3

    申请日：1997-05-28

    申请人： EBARA CORPORATION

    发明人： Watanabe, Katsuhide

    IPC分类号： B24B37/04

    CPC分类号： B24B37/005 ,  B24B49/16 ,  G05B19/4063 ,  G05B19/416 ,  G05B2219/37434 ,  G05B2219/45199 ,  G05B2219/50113 ,  G05B2219/50205 ,  G05B2219/50276

    摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus having interlock function comprises a turntable having a polishing surface thereon, a top ring for holding a workpiece to be polished and pressing the workpiece against the polishing surface on the turntable, a first motor for rotating the turntable, and a second motor for rotating the top ring. The polishing apparatus further comprises a first actuator for lifting and lowering the top ring, a second actuator for moving the top ring in a horizontal direction, and a control unit for controlling the motors and the actuators. The control unit controls the motors and the actuators in such a manner that when an abnormality is detected in at least one of the motors and the actuators, at least one of the motors and the actuators other than that of abnormality performs a predetermined operation.

    摘要翻译： 抛光装置用于将诸如半导体晶片的工件抛光成平坦的镜面抛光。 具有互锁功能的研磨装置包括：具有研磨表面的转台，用于保持待研磨工件并将工件压靠在转台上的研磨表面上的顶环，用于旋转该转台的第一电机，以及用于第二电机的第二电机 旋转顶圈。 抛光装置还包括用于提升和降低顶环的第一致动器，用于沿水平方向移动顶环的第二致动器以及用于控制电动机和致动器的控制单元。 控制单元以这样的方式控制电动机和致动器，即，当在电动机和致动器中的至少一个中检测到异常时，除了异常状态以外的电动机和致动器中的至少一个执行预定操作。

    WERKZEUG MIT PRÄVENTIVER BRUCH-, AUSBRUCH-, RISS- UND VERSCHLEISSERKENNUNG
    8.
    发明公开
    WERKZEUG MIT PRÄVENTIVER BRUCH-, AUSBRUCH-, RISS- UND VERSCHLEISSERKENNUNG 审中-公开
    WERKZEUG MITPRÄVENTIVERBRUCH-，AUSBRUCH-，RISS- UND VERSCHLEISSERKENNUNG

    公开(公告)号：EP3077154A1

    公开(公告)日：2016-10-12

    申请号：EP14812161.9

    申请日：2014-12-03

    申请人： CeramTec GmbH

    发明人： AGUSTIN-PAYA, Jose ,  SCHREINER, Hans-Jürgen ,  BINDIG, Reiner

    IPC分类号： B23Q17/09 ,  G05B19/4065

    CPC分类号： G05B19/4065 ,  B23Q17/0957 ,  B23Q17/0966 ,  G05B2219/37344 ,  G05B2219/37412 ,  G05B2219/50203 ,  G05B2219/50205

    摘要： The invention relates to a method for monitoring a machining tool which is used for machining primarily metal materials, having a cutting tool, wherein the cutting force, the feed force and the passive force during machining are set, and having sensors for measuring forces. In order that machining can be stopped 2 to 60 seconds, preferably 2 to 10 seconds, prior to failure of the cutting body, the invention proposes that the sensors continuously sense at least one of said forces during machining and machining is stopped if a sudden reduction in the sensed force occurs.

    摘要翻译： 本发明涉及一种用于主要用于加工金属材料的加工刀具的方法，该加工刀具具有切削刀具，其中加工期间的切削力，进给力和被动力被设定，并且具有用于测量力的传感器。 为了在切削体失效之前停止加工2至60秒，优选2至10秒，本发明提出，如果突然减少，则在加工期间传感器连续感测所述力中的至少一个并且加工停止 在感应力发生。

    Polishing apparatus having interlock function
    9.
    发明公开
    Polishing apparatus having interlock function 失效
    抛光设备具有互锁功能

    公开(公告)号：EP1213094A9

    公开(公告)日：2002-08-07

    申请号：EP02004882.3

    申请日：1997-05-28

    申请人： EBARA CORPORATION

    发明人： Watanabe, Katsuhide

    IPC分类号： B24B37/04

    CPC分类号： B24B37/005 ,  B24B49/16 ,  G05B19/4063 ,  G05B19/416 ,  G05B2219/37434 ,  G05B2219/45199 ,  G05B2219/50113 ,  G05B2219/50205 ,  G05B2219/50276

    摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus having interlock function comprises a turntable having a polishing surface thereon, a top ring for holding a workpiece to be polished and pressing the workpiece against the polishing surface on the turntable, a first motor for rotating the turntable, and a second motor for rotating the top ring. The polishing apparatus further comprises a first actuator for lifting and lowering the top ring, a second actuator for moving the top ring in a horizontal direction, and a control unit for controlling the motors and the actuators. The control unit controls the motors and the actuators in such a manner that when an abnormality is detected in at least one of the motors and the actuators, at least one of the motors and the actuators other than that of abnormality performs a predetermined operation.

    TOOL BREAKAGE DETECTING SYSTEM
    10.
    发明公开
    TOOL BREAKAGE DETECTING SYSTEM 失效
    刀具断裂监控系统

    公开(公告)号：EP0749804A4

    公开(公告)日：1998-03-04

    申请号：EP95934851

    申请日：1995-10-19

    申请人： FANUC LTD

    发明人： NAGATOMI TAKASHI ,  SAKAGUCHI MIWAKO

    IPC分类号： B23B47/24 ,  B23Q17/09 ,  G05B9/02 ,  G05B19/18 ,  G05B19/4065

    CPC分类号： G05B19/4065 ,  B23Q17/0961 ,  G05B2219/37246 ,  G05B2219/37344 ,  G05B2219/50205

    摘要： A tool breakage detecting system adapted to detect the breakage of a tool with a high accuracy which occurs in some cases even when a load is not substantially imparted to a rotary shaft and a tool feed shaft. The disturbance load torque of a main shaft and a shaft for relatively moving a work and a tool is monitored by a rotary shaft disturbance load torque estimating means (1) and a moving shaft disturbance load torque estimating means (2), and also the disturbance load torque of a shaft which does not relatively move a work and a tool by stationary shaft disturbance load torque estimating means (3, 4). The breakage of the tool is judged by a comparison means (5) on the basis of the estimated disturbance load torque from these estimating means, and, when the breakage of the tool is detected, the machine is stopped by a machine stoppage command means (6).