公开(公告)号：EP1864307A1

公开(公告)日：2007-12-12

申请号：EP06739741.4

申请日：2006-03-24

申请人： Intel Corporation

发明人： CHOU, Tsung-Kuan

IPC分类号： H01G5/16 ,  H01H59/00

CPC分类号： H01H59/0009 ,  H01G5/16 ,  H01G5/18 ,  H01H2059/0063

摘要： A microelectromechanical (MEMS) switch is disclosed. The MEMS switch includes a substrate (205), a plurality of actuation electrodes (230) mounted on the substrate, a plurality of bottom electrodes (210) mounted on the substrate, a capacitor (cl, c2, c3) having subcomponents e.g. dielectric layers (330), mounted on the two or more bottom electrodes (210) and a top bendable electrode (215) mounted on the substrate. The top electrode (215) collapses a first magnitude towards the actuation electrodes (230) whenever a first voltage is applied to one or more of the actuation electrodes (230) and collapses a second magnitude towards the actuation electrodes (230) whenever a second voltage is applied to the actuation electrodes (230).

公开(公告)号：EP0698279A1

公开(公告)日：1996-02-28

申请号：EP94914474.0

申请日：1994-05-06

申请人： CAVENDISH KINETICS LIMITED

发明人： Smith,Charles Gordon

IPC分类号： G11C11 ,  G11C23 ,  H01H1 ,  H01H59 ,  H01L27 ,  H01L49

CPC分类号： H01H1/0036 ,  G11C11/50 ,  G11C23/00 ,  H01H1/20 ,  H01H1/66 ,  H01H59/0009 ,  H01H2001/0042 ,  H01H2059/0036 ,  H01H2059/0063

摘要： A bi-stable memory element (1) comprises a base contact (3), and a bridging contact (8), both made from an electrically conductive material. The bridging contact (8) is dimensioned so as to have two stable positions, in one of which the bridging contact (8) is in contact with the base contact (3), and in the other of which the bridging contact (8) is spaced apart from the base contact (3). Deflection means (4, 5) deflects the bridging contact (8) from one stable position to the other.

公开(公告)号：EP1146532B1

公开(公告)日：2009-10-14

申请号：EP01660059.5

申请日：2001-04-02

申请人： Nokia Corporation

发明人： Ryhänen, Tapani ,  Ermolov, Vladimir

IPC分类号： H01H59/00 ,  H01H47/32

CPC分类号： H01H47/325 ,  H01H59/0009 ,  H01H2059/0036 ,  H01H2059/0063

公开(公告)号：EP1619710A2

公开(公告)日：2006-01-25

申请号：EP05014807.1

申请日：2005-07-07

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Lee, Moon-chul ,  Park, Tae-sik ,  Jeong, Hee-moon

IPC分类号： H01H59/00

CPC分类号： H01H59/0009 ,  H01H2059/0036 ,  H01H2059/0063

摘要： A vibration type MEMS switch and a method of fabricating the vibration type MEMS switch. The vibration type MEMS switch includes a vibrating body supplied with an alternating current voltage of a predetermined frequency to vibrate in a predetermined direction; and a stationary contact point spaced apart from the vibrating body along a vibration direction of the vibrating body. When a direct current voltage with a predetermined magnitude is applied to the stationary contact point, a vibration margin of the vibrating body is increased, the vibrating body contacts the stationary contact point and the vibration type MEMS switch is turned on. A first substrate is bonded to a second substrate to isolate the vibrating body in a sealed vacuum space. The vibration type MEMS switch is turned on and/off by a resonance.

摘要翻译： 一种振动型MEMS开关和一种制造该振动型MEMS开关的方法。 振动型MEMS开关包括被供给预定频率的交流电压以在预定方向上振动的振动体; 以及沿着振动体的振动方向与振动体间隔开的固定接触点。 当具有预定大小的直流电压施加到固定接触点时，振动体的振动裕度增加，振动体接触固定接触点并且振动型MEMS开关导通。 将第一衬底粘合到第二衬底以将振动体隔离在密封的真空空间中。 振动型MEMS开关通过谐振而导通/截止。

公开(公告)号：EP1537590A2

公开(公告)日：2005-06-08

申请号：EP03791790.3

申请日：2003-08-26

申请人： Teravicta Technologies, Inc.

发明人： IVANCIW, Dan, A. ,  HILBERT, Claude

IPC分类号： H01H59/00 ,  H01H1/60 ,  H01H47/04 ,  H01H1/00

CPC分类号： H01H1/605 ,  H01H1/0015 ,  H01H1/60 ,  H01H11/0062 ,  H01H47/04 ,  H01H59/0009 ,  H01H2059/0063 ,  Y10T307/911 ,  Y10T307/924

摘要： In methods and circuits for using associated circuitry to enhance performance of a micro-electromechanical switch, one of the method embodiments is a contact conditioning process including applying a time-varying voltage to the control element of a closed switch. In another embodiment, a voltage profile applied to the control element of the switch can be tailored to improve the actuation speed or reliability of the switch. In another method embodiment, the performance of a switch may be evaluated by measuring a performance parameter, and corrective action initiated if the switch performance is determined to need improvement. An embodiment of a circuit for maintaining performance of a micro-electromechanical switch includes first and second signal line nodes, sensing circuitry coupled to the signal line nodes and adapted to sense a performance parameter value of the switch, and control circuitry operably coupled to at least one terminal of the switch.

公开(公告)号：EP1156504A3

公开(公告)日：2003-12-10

申请号：EP00121231.5

申请日：2000-09-29

申请人： Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.

发明人： Faul, Robert ,  Drost, Andreas ,  Pradel, Helmut

IPC分类号： H01H59/00

CPC分类号： H01H59/0009 ,  H01G5/18 ,  H01H1/2025 ,  H01H2059/0063 ,  H01H2059/0081

摘要： Die vorliegende Erfindung betrifft ein mikromechanisches Relais mit verbesserten Schalteigenschaften, bei dem der Kontaktbügel zur Überbrückung eines Schaltkontaktes beabstandet vom freien Ende eines einseitig eingespannten, mikromechanischen, beweglichen Biegebalkenelementes an diesem angeordnet ist. Beidseitig des Kontaktbügels sind am beweglichen Element Steuerelektroden vorgesehen, die in Zusammenwirkung mit gegenüberliegenden Steuerelektroden am Substrat sowie entsprechenden Steuersignalen das Öffnen und Schließen des Kontaktes bewirken. Sowohl durch die beidseitige Anordnung der Steuerelektrodengebiete als auch die erweiterten und beispielsweise getrennten Ansteuerungsmöglichkeiten der Steuerelektroden beidseitig des Kontaktbügels bzw. der entsprechenden Steuerelektroden am Substrat lässt sich ein verbessertes Schaltverhalten erzielen.

公开(公告)号：EP1565922A1

公开(公告)日：2005-08-24

申请号：EP03786074.9

申请日：2003-11-27

申请人： COMMISSARIAT A L'ENERGIE ATOMIQUE

发明人： ROBERT, Philippe

IPC分类号： H01H59/00

CPC分类号： H01H59/0009 ,  H01H2059/0063

摘要： The invention relates to an electrostatic microswitch which is intended to connect two strip conductors (4, 5) which are disposed on a support. According to the invention, the two strip conductors are connected by means of a contact pad (6) which is provided on deformable means (3) which are made from an insulating material and which can be deformed in relation to the support under the effect of an electrostatic force generated by control electrodes. The aforementioned contact pad connects the ends (14, 15) of the two strip conductors (4, 5) when the deformable means are sufficiently deformed. Moreover, the control electrodes are distributed over the deformable means and the support in two electrode assemblies, namely: (i) a first assembly of electrodes (101, 102, 33, 53) which is intended to generate a first electrostatic force in order to initiate the deformation of the deformable means, and (ii) a second assembly of electrodes (101, 102, 7, 8) which is intended to generate a second electrostatic force in order to continue the deformation of the deformable means (3), such that the contact pad (6) connects the ends (14, 15) of the two strip conductors.

摘要翻译： 本发明涉及一种静电微动开关，其用于连接设置在支撑件上的两个带状导体（4,5）。 根据本发明，两个带状导体通过设置在可变形装置（3）上的接触垫（6）连接，所述接触垫由绝缘材料制成并且可以在所述支撑件的作用下相对于所述支撑件变形 由控制电极产生的静电力。 当可变形装置充分变形时，前述接触垫连接两个带状导体（4,5）的端部（14,15）。 此外，控制电极分布在两个电极组件中的可变形装置和支撑件上，即：（i）第一组电极（101,102,33,53），其旨在产生第一静电力以便 启动可变形装置的变形，以及（ii）第二组电极（101,102,7,8），用于产生第二静电力以继续可变形装置（3）的变形，例如 接触垫（6）连接两个带状导体的端部（14,15）。

公开(公告)号：EP1146532A3

公开(公告)日：2004-09-01

申请号：EP01660059.5

申请日：2001-04-02

申请人： Nokia Corporation

发明人： Ryhänen, Tapani ,  Ermolov, Vladimir

IPC分类号： H01H59/00 ,  H01H47/32

CPC分类号： H01H47/325 ,  H01H59/0009 ,  H01H2059/0036 ,  H01H2059/0063

摘要： The invention relates to a controlling of micromechanical elements. Especially the invention relates to the controlling of the micromechanical switches. According to a method for controlling at least one micromechanical element a first control signal and a second control signal are fed to the micromechanical element. The second control signal is arranged to set the micromechanical element to an active state and the first control signal is arranged to hold the micromechanical element in the active state. An arrangement for controlling at least one micromechanical element (402) contains at least means for generating at least a first control signal and a second control signal, means for raising a voltage level of at least the second control signal and means for feeding the first control signal and the second control signal with raised voltage level to the micromechanical element. By means of the invention lower voltage levels can be used in micromechanical applications.

公开(公告)号：EP1156504A2

公开(公告)日：2001-11-21

申请号：EP00121231.5

申请日：2000-09-29

申请人： Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.

发明人： Faul, Robert ,  Drost, Andreas ,  Pradel, Helmut

IPC分类号： H01H59/00

CPC分类号： H01H59/0009 ,  H01G5/18 ,  H01H1/2025 ,  H01H2059/0063 ,  H01H2059/0081

摘要： Die vorliegende Erfindung betrifft ein mikromechanisches Relais mit verbesserten Schalteigenschaften, bei dem der Kontaktbügel zur Überbrückung eines Schaltkontaktes beabstandet vom freien Ende eines einseitig eingespannten, mikromechanischen, beweglichen Biegebalkenelementes an diesem angeordnet ist. Beidseitig des Kontaktbügels sind am beweglichen Element Steuerelektroden vorgesehen, die in Zusammenwirkung mit gegenüberliegenden Steuerelektroden am Substrat sowie entsprechenden Steuersignalen das Öffnen und Schließen des Kontaktes bewirken.
Sowohl durch die beidseitige Anordnung der Steuerelektrodengebiete als auch die erweiterten und beispielsweise getrennten Ansteuerungsmöglichkeiten der Steuerelektroden beidseitig des Kontaktbügels bzw. der entsprechenden Steuerelektroden am Substrat lässt sich ein verbessertes Schaltverhalten erzielen.

摘要翻译： 电极区域（1a），移动元件（10a）和接触片（5）被布置成使得基极和对置电极区域彼此相对。 接触片（5）布置在与自由端间隔开的移动元件（10a）上。 在接触片和移动元件的自由端之间的区域（3）中，形成至少一个第二对电极区域（3a）和相对的第二基极区域（14）。

公开(公告)号：EP1146532A2

公开(公告)日：2001-10-17

申请号：EP01660059.5

申请日：2001-04-02

申请人： NOKIA MOBILE PHONES LTD.

发明人： Ryhänen, Tapani ,  Ermolov, Vladimir

IPC分类号： H01H59/00 ,  H01H47/32

CPC分类号： H01H47/325 ,  H01H59/0009 ,  H01H2059/0036 ,  H01H2059/0063

摘要： The invention relates to a controlling of micromechanical elements. Especially the invention relates to the controlling of the micromechanical switches. According to a method for controlling at least one micromechanical element a first control signal and a second control signal are fed to the micromechanical element. The second control signal is arranged to set the micromechanical element to an active state and the first control signal is arranged to hold the micromechanical element in the active state. An arrangement for controlling at least one micromechanical element (402) contains at least means for generating at least a first control signal and a second control signal, means for raising a voltage level of at least the second control signal and means for feeding the first control signal and the second control signal with raised voltage level to the micromechanical element. By means of the invention lower voltage levels can be used in micromechanical applications.

摘要翻译： 本发明涉及微机械元件的控制。 特别地，本发明涉及微机械开关的控制。 根据用于控制至少一个微机械元件的方法，第一控制信号和第二控制信号被馈送到微机械元件。 第二控制信号被布置成将微机械元件设置为有效状态，并且第一控制信号被布置成将微机械元件保持在活动状态。 用于控制至少一个微机械元件（402）的装置至少包含用于产生至少第一控制信号和第二控制信号的装置，用于提高至少第二控制信号的电压电平的装置和用于馈送第一控制信号的装置 信号和具有升高的电压水平的微机电元件的第二控制信号。 通过本发明，可以在微机械应用中使用较低的电压电平。