摘要:
Some techniques disclosed herein facilitate cleaning residue from a molecular beam component. For example, in an exemplary method, a molecular beam is provided along a beam path, causing residue build up on the molecular beam component. To reduce the residue, the molecular beam component is exposed to a hydro-fluorocarbon plasma. Exposure to the hydro-fluorocarbon plasma is ended based on whether a first predetermined condition is met, the first predetermined condition indicative of an extent of removal of the residue. Other methods and systems are also disclosed.
摘要:
The present invention is directed to in-situ detection of particles and other such features in an ion implantation system (300) during implantation operations to avoid such additional monitoring tool steps otherwise expended before and/or after implantation, for example. One or more such systems are revealed for detecting scattered light from particles on one or more semiconductor wafers illuminated by a light source (e.g., laser beam). The system comprises an ion implanter (302) having a laser (322) for illumination of a spot on the wafer (308) and a pair of detectors (360) (e.g., PMT or photodiode) rotationally opposite from the ion implantation operations. A wafer transport holds a wafer or wafers for translational scanning under the fixed laser spot. A computer analyzes the intensity of the scattered light (326) detected from the illuminated wafer (workpiece) (308), and may also map the light detected to a unique the present invention is directed to in-situ detection of particles and other such features in an ion implantation system during implantation operations to avoid such additional monitoring tool steps otherwise expended before and/or after implantation, for example. One or more such sysetms are revealed for detecting scattered light from particles on one or more semiconductor wafers illuminated by a light source (e, g., laser beam).The system comprises an ion implanter having a laser for illumination of a spot on the wafer and a pair of detectors (e, g., PMT or photodiode ) rotationally opposite from the ion implantation operations. A wafer transport holds a wafer or wafers for tanslational scanning under fixed laser spot. A computer analyzes the intensity of the scattered light detected from the illuminated wafer (workpiece), and may also map the light detected to a unique position. For example, particles or other such contaminates may be identified on wafers during the implantation process before additional time and resources are consumed, and aid in determining the sources of such contaminates. Further, threshold analysis of the quantity or size of such particles, for example, may provide a system interlock for shutdown or feedback control.
摘要:
A method and apparatus for actively monitoring conditions of a plasma source for adjustment and control of the source and to detect the presence of unwanted contaminant species in a plasma reaction chamber (220). Preferred embodiments include a spectrometer (252) used to quantify components of the plasma. A system controller is provided that uses feedback loops based on spectral analysis of the plasma to regulate the ion composition of the plasma source. The system also provides end pointing means based on spectral analysis to determine when cleaning of the plasma source is completed.
摘要:
A method and apparatus for etching photomasks is provided herein. In one embodiment, a method of etching a photomask includes providing a process chamber (102) having a substrate support pedestal (124) adapted to receive a photomask substrate thereon. An ion-radical shield (170) is disposed above the pedestal (124). A substrate (122) is placed upon the pedestal beneath the ion-radical shield (170). A process gas is introduced into the process chamber and a plasma is formed from the process gas. The substrate is etched predominantly with radicals that pass through the shield.
摘要:
A method and apparatus for actively monitoring conditions of a plasma source for adjustment and control of the source and to detect the presence of unwanted contaminant species in a plasma reaction chamber (220). Preferred embodiments include a spectrometer (252) used to quantify components of the plasma. A system controller is provided that uses feedback loops based on spectral analysis of the plasma to regulate the ion composition of the plasma source. The system also provides end pointing means based on spectral analysis to determine when cleaning of the plasma source is completed.
摘要:
A method and apparatus for etching photomasks is provided herein. In one embodiment, a method of etching a photomask includes providing a process chamber (102) having a substrate support pedestal (124) adapted to receive a photomask substrate thereon. An ion-radical shield (170) is disposed above the pedestal (124). A substrate (122) is placed upon the pedestal beneath the ion-radical shield (170). A process gas is introduced into the process chamber and a plasma is formed from the process gas. The substrate is etched predominantly with radicals that pass through the shield.
摘要:
A degree of contamination can be measured in a charged particle beam system by means of a contamination monitor which is provided with a carrier (3) having an aperture for transmitting a charged particle beam (7) and a membrane (5) which is connected to the carrier and which covers the aperture. The thickness of a contamination layer deposited on the membrane can be determined by measurement of a decrease of the transmission of the membrane as the contamination increases. The accuracy of measurement is enhanced by selecting a central portion of the particle beam transmitted by the membrane.