Abstract:
Formulations of solutions and processes are described to form a substrate including a dopant. In particular implementations, the dopant may include arsenic (As). In an embodiment, a dopant solution is provided that includes a solvent and a dopant. In a particular embodiment, the dopant solution may have a flashpoint that is at least approximately equal to a minimum temperature capable of causing atoms at a surface of the substrate to attach to an arsenic-containing compound of the dopant solution. In one embodiment, a number of silicon atoms at a surface of the substrate are covalently bonded to the arsenic-containing compound.
Abstract:
A high-k gate dielectric interface with a group III-V semiconductor surface of a non-planar transistor channel region is non-directionally doped with nitrogen. In nanowire embodiments, a non-directional nitrogen doping of a high-k gate dielectric interface is performed before or concurrently with a conformal gate electrode deposition through exposure of the gate dielectric to liquid, vapor, gaseous, plasma, or solid state sources of nitrogen. In embodiments, a gate electrode metal is conformally deposited over the gate dielectric and an anneal is performed to uniformly accumulate nitrogen within the gate dielectric along the non-planar III-V semiconductor interface.
Abstract:
A method for treating at least one first layer of material comprising siloxane bonds, at least one surface of which is intended to be secured to a surface of a second layer of material by means of direct bonding, comprising at least one step of forced diffusion, at a temperature at least equal to approximately 30°C and at least in the first layer of material, of chemical species including at least one free electron pair and at least one labile proton, transforming at least one part of the siloxane bonds into silanol bonds in at least one part of the first layer of material extending from said surface to a depth greater than or equal to approximately 10 nm.
Abstract:
The occurrence of internal stress is reduced during the solar cell production process, thereby reducing crystal defects and recombination loss. Provided is a method for producing a solar cell having a p-n junction, which involves a step for forming a p-type layer on a semiconductor substrate by applying a coating liquid for diffusion containing impurity which serves as an acceptor, and by diffusing the impurity by means of thermal diffusion and/or a step for forming an n-type layer on a semiconductor substrate by applying a coating liquid for diffusion containing impurity which serves as a donor, and by diffusing the impurity through a thermal diffusion treatment.
Abstract:
The invention relates to a method for producing at least one functional layer on at least one region of a surface of a semiconductor component by applying a liquid to at least the one region, wherein the functional layer has a layer thickness d 1 and the liquid required for forming the functional layer having the thickness di has a layer thickness d 2 . In order that functional layers having a desired thin and uniform thickness are produced in a reproducible manner, it is proposed that the liquid is applied to the at least one region of the surface in excess with a layer thickness d 3 where d 3 > d 2 and that subsequently, either with the semiconductor component moved in translational fashion or with the semiconductor component arranged in stationary fashion, excess liquid is removed from the surface in a contactless manner to an extent such that the liquid layer has the thickness d 2 or approximately the thickness d2.
Abstract:
Disclosed are a solar cell manufactured using a composite thin film comprising amorphous silicon and nanocrystalline silicon, a method of manufacturing the solar cell, and a composition for the composite thin film used in manufacturing the solar cell. The solar cell of the present invention is manufactured by dispersing the crystalline silicon nanoparticles in the liquid silicon precursor, coating the dispersion on a substrate or printing the substrate with the dispersion, and heating the coated or printed substrate to modify the liquid silicon precursor into the amorphous silicon. According to the present invention, expensive equipments are not needed to form a composite thin film comprising both of amorphous silicon and crystalline silicon. In addition, it is possible to form a composite thin film comprising plural materials with different band gap energy which can remarkably improve conversion efficiency of a solar cell by using a liquid precursor and nanocrystalline particles in a solution process with low production cost.
Abstract:
A method for producing an inverted photosensitive device, comprising: providing a metal reflective electrode; performing at least an ultra-violet ozone (UV-O 3 ) or plasma surface treatment on the metal reflective electrode; forming an organic donor-acceptor heterojunction over the metal reflective electrode; and forming a transparent electrode over the organic donor-acceptor heterojunction.